MA40175A - Dispositif de soudure avec distribution de gaz - Google Patents
Dispositif de soudure avec distribution de gazInfo
- Publication number
- MA40175A MA40175A MA040175A MA40175A MA40175A MA 40175 A MA40175 A MA 40175A MA 040175 A MA040175 A MA 040175A MA 40175 A MA40175 A MA 40175A MA 40175 A MA40175 A MA 40175A
- Authority
- MA
- Morocco
- Prior art keywords
- gas distribution
- welding device
- welding
- distribution
- gas
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/08—Soldering by means of dipping in molten solder
- B23K1/085—Wave soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102014018165.0A DE102014018165B3 (de) | 2014-12-09 | 2014-12-09 | Lötvorrichtung mit Gasverteilung |
Publications (1)
Publication Number | Publication Date |
---|---|
MA40175A true MA40175A (fr) | 2017-10-31 |
Family
ID=54834756
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
MA040175A MA40175A (fr) | 2014-12-09 | 2015-12-07 | Dispositif de soudure avec distribution de gaz |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP3040149B1 (fr) |
DE (1) | DE102014018165B3 (fr) |
HU (1) | HUE038067T2 (fr) |
LT (1) | LT3040149T (fr) |
MA (1) | MA40175A (fr) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107214391A (zh) * | 2017-07-13 | 2017-09-29 | 宋国明 | 多喷锡嘴式选择性波峰焊锡机 |
CN109051793A (zh) * | 2018-07-31 | 2018-12-21 | 中山易必固新材料科技有限公司 | 一种下沉式二氧化碳气体保护输送管 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2670986B1 (fr) * | 1990-12-20 | 1996-08-02 | Air Liquide | Dispositif d'inertage de bain de soudure d'une machine de soudage a la vague. |
US5176307A (en) * | 1991-02-22 | 1993-01-05 | Praxair Technology, Inc. | Wave soldering in a protective atmosphere enclosure over a solder pot |
DE19749185A1 (de) * | 1997-11-07 | 1999-05-12 | Messer Griesheim Gmbh | Mit einer Gasversorgung verbindbare Gasverteilung |
DE19749184B4 (de) * | 1997-11-07 | 2007-03-01 | Air Liquide Deutschland Gmbh | Lötvorrichtung |
DE19912718C1 (de) * | 1999-03-20 | 2000-02-03 | Messer Griesheim Gmbh | Lötvorrichtung |
DE102005052076B4 (de) * | 2005-10-28 | 2007-09-20 | Messer Group Gmbh | Lötvorrichtung mit Gasverteilung |
US8104662B2 (en) * | 2009-07-24 | 2012-01-31 | Flextronics Ap Llc | Inert environment enclosure |
-
2014
- 2014-12-09 DE DE102014018165.0A patent/DE102014018165B3/de active Active
-
2015
- 2015-12-07 MA MA040175A patent/MA40175A/fr unknown
- 2015-12-08 LT LTEP15198479.6T patent/LT3040149T/lt unknown
- 2015-12-08 HU HUE15198479A patent/HUE038067T2/hu unknown
- 2015-12-08 EP EP15198479.6A patent/EP3040149B1/fr active Active
Also Published As
Publication number | Publication date |
---|---|
EP3040149A1 (fr) | 2016-07-06 |
LT3040149T (lt) | 2018-02-26 |
EP3040149B1 (fr) | 2017-11-01 |
DE102014018165B3 (de) | 2016-01-07 |
HUE038067T2 (hu) | 2018-09-28 |
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