LU77436A1 - - Google Patents
Info
- Publication number
- LU77436A1 LU77436A1 LU77436A LU77436A LU77436A1 LU 77436 A1 LU77436 A1 LU 77436A1 LU 77436 A LU77436 A LU 77436A LU 77436 A LU77436 A LU 77436A LU 77436 A1 LU77436 A1 LU 77436A1
- Authority
- LU
- Luxembourg
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
- H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
- H05K3/384—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0723—Electroplating, e.g. finish plating
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electroplating Methods And Accessories (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6238476A JPS52145769A (en) | 1976-05-31 | 1976-05-31 | Method of surface treating printed circuit copper foil |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| LU77436A1 true LU77436A1 (https=) | 1977-09-09 |
Family
ID=13198566
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| LU77436A LU77436A1 (https=) | 1976-05-31 | 1977-05-27 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPS52145769A (https=) |
| DE (1) | DE2724074C2 (https=) |
| GB (1) | GB1558919A (https=) |
| LU (1) | LU77436A1 (https=) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56155592A (en) * | 1980-04-03 | 1981-12-01 | Furukawa Circuit Foil | Copper foil for printed circuit and method of manufacturing same |
| JPS6249735U (https=) * | 1985-09-14 | 1987-03-27 | ||
| TW317575B (https=) * | 1994-01-21 | 1997-10-11 | Olin Corp | |
| JP4626390B2 (ja) | 2005-05-16 | 2011-02-09 | 日立電線株式会社 | 環境保護を配慮したプリント配線板用銅箔 |
| JP4492434B2 (ja) | 2005-05-16 | 2010-06-30 | 日立電線株式会社 | プリント配線板用銅箔とその製造方法およびその製造に用いる３価クロム化成処理液 |
| JP4904933B2 (ja) | 2005-09-27 | 2012-03-28 | 日立電線株式会社 | ニッケルめっき液とその製造方法、ニッケルめっき方法およびプリント配線板用銅箔 |
| JP5512273B2 (ja) | 2007-09-28 | 2014-06-04 | Ｊｘ日鉱日石金属株式会社 | 印刷回路用銅箔及び銅張積層板 |
| MY150825A (en) | 2008-11-25 | 2014-02-28 | Jx Nippon Mining & Metals Corp | Copper foil for printed circuit |
| MY172093A (en) | 2009-12-24 | 2019-11-13 | Jx Nippon Mining & Metals Corp | Surface-treated copper foil |
| WO2011138876A1 (ja) | 2010-05-07 | 2011-11-10 | Jx日鉱日石金属株式会社 | 印刷回路用銅箔 |
| WO2012132577A1 (ja) | 2011-03-30 | 2012-10-04 | Jx日鉱日石金属株式会社 | 印刷回路用銅箔 |
| JP5654416B2 (ja) | 2011-06-07 | 2015-01-14 | Jx日鉱日石金属株式会社 | 液晶ポリマー銅張積層板及び当該積層板に用いる銅箔 |
| US9115441B2 (en) | 2011-10-18 | 2015-08-25 | Nan Ya Plastics Corporation | Process to manufacture surface fine grain copper foil with high peeling strength and environmental protection for printed circuit boards |
| EP2590487B1 (en) | 2011-11-03 | 2014-05-14 | Nan-Ya Plastics Corporation | Process to manufacture fine grain surface copper foil with high peeling strength and environmental protection for printed circuit boards |
| KR102030911B1 (ko) | 2012-09-28 | 2019-10-10 | 제이엑스금속주식회사 | 캐리어 부착 동박 및 캐리어 부착 동박을 사용한 구리 피복 적층판 |
| JP6422658B2 (ja) * | 2014-02-27 | 2018-11-14 | 新光電気工業株式会社 | 電気めっき浴及び電気めっき方法 |
| WO2018193935A1 (ja) * | 2017-04-17 | 2018-10-25 | 住友金属鉱山株式会社 | 導電性基板、導電性基板の製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3220897A (en) * | 1961-02-13 | 1965-11-30 | Esther S Conley | Conducting element and method |
| US3585010A (en) * | 1968-10-03 | 1971-06-15 | Clevite Corp | Printed circuit board and method of making same |
-
1976
- 1976-05-31 JP JP6238476A patent/JPS52145769A/ja active Granted
-
1977
- 1977-05-27 DE DE19772724074 patent/DE2724074C2/de not_active Expired
- 1977-05-27 LU LU77436A patent/LU77436A1/xx unknown
- 1977-05-31 GB GB2292677A patent/GB1558919A/en not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| DE2724074C2 (de) | 1982-05-13 |
| JPS569028B2 (https=) | 1981-02-26 |
| DE2724074A1 (de) | 1977-12-15 |
| JPS52145769A (en) | 1977-12-05 |
| GB1558919A (en) | 1980-01-09 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| DT | Application date | ||
| TA | Annual fee |