LT2003036A - A method for manufacturing of microelectromechanical switch - Google Patents

A method for manufacturing of microelectromechanical switch

Info

Publication number
LT2003036A
LT2003036A LT2003036A LT2003036A LT2003036A LT 2003036 A LT2003036 A LT 2003036A LT 2003036 A LT2003036 A LT 2003036A LT 2003036 A LT2003036 A LT 2003036A LT 2003036 A LT2003036 A LT 2003036A
Authority
LT
Lithuania
Prior art keywords
layer
microelectromechanical
electron
electrodes
substrate
Prior art date
Application number
LT2003036A
Other languages
Lithuanian (lt)
Other versions
LT5208B (en
Inventor
Vytautas OSTAŠEVIČIUS
Viktoras GRIGALIŪNAS
Sigitas TAMULEVIČIUS
Rolanas DAUKŠEVIČIUS
Original Assignee
Kauno technologijos universitetas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kauno technologijos universitetas filed Critical Kauno technologijos universitetas
Priority to LT2003036A priority Critical patent/LT5208B/en
Publication of LT2003036A publication Critical patent/LT2003036A/en
Publication of LT5208B publication Critical patent/LT5208B/en

Links

Landscapes

  • Manufacture Of Switches (AREA)
  • Micromachines (AREA)

Abstract

Invention relates to a class of microelectromechanical systems (MEMS), to be more precise to the manufacturing technology of microelectromechanical switches. Seeking to increase reliability and durability of microelectromechanical switches, fabrication method of microelectromechanical switch starts from formation of microstructures in the support area (7) of microcantilever structure (5) by patterning and etching, using a combination of wet and reactive ion etching processes, a layer of deposited aluminium. Further, source (2), gate (3) and drain (4) electrodes are formed on the substrate (1) by deposition of chrome under layer by electron - beam evaporation and subsequent resistive evaporation of gold layer a top of the chrome layer, following pattering of the electrodes using lift - off lithography. Next, electron - beam evaporation is used to deposit a sacrificial copper layer over the whole area of the substrate (1). Then pattering of the copper is partially etched to define thecontact tips (6)
LT2003036A 2003-05-12 2003-05-12 A method for manufacturing of microelectromechanical switch LT5208B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
LT2003036A LT5208B (en) 2003-05-12 2003-05-12 A method for manufacturing of microelectromechanical switch

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
LT2003036A LT5208B (en) 2003-05-12 2003-05-12 A method for manufacturing of microelectromechanical switch

Publications (2)

Publication Number Publication Date
LT2003036A true LT2003036A (en) 2004-11-25
LT5208B LT5208B (en) 2005-04-25

Family

ID=33432472

Family Applications (1)

Application Number Title Priority Date Filing Date
LT2003036A LT5208B (en) 2003-05-12 2003-05-12 A method for manufacturing of microelectromechanical switch

Country Status (1)

Country Link
LT (1) LT5208B (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5578976A (en) 1995-06-22 1996-11-26 Rockwell International Corporation Micro electromechanical RF switch
CA2211830C (en) 1997-08-22 2002-08-13 Cindy Xing Qiu Miniature electromagnetic microwave switches and switch arrays

Also Published As

Publication number Publication date
LT5208B (en) 2005-04-25

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Effective date: 20090512