KR980005921A - Adhesive resin formation method of semiconductor chip for LOC package - Google Patents

Adhesive resin formation method of semiconductor chip for LOC package Download PDF

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Publication number
KR980005921A
KR980005921A KR1019960020178A KR19960020178A KR980005921A KR 980005921 A KR980005921 A KR 980005921A KR 1019960020178 A KR1019960020178 A KR 1019960020178A KR 19960020178 A KR19960020178 A KR 19960020178A KR 980005921 A KR980005921 A KR 980005921A
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KR
South Korea
Prior art keywords
adhesive resin
semiconductor chip
pattern
forming
opening
Prior art date
Application number
KR1019960020178A
Other languages
Korean (ko)
Inventor
김형호
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960020178A priority Critical patent/KR980005921A/en
Publication of KR980005921A publication Critical patent/KR980005921A/en

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Abstract

본 발명에 의한 LOC 패키지용 반도체 칩의 접착 수지 형성 방법은 칩의 본딩 패드를 노출시키는 폴리이미드 필름의 패턴이 기판의 전면에 형성되고, 반도체 칩과 리드 프레임의 내부 리드가 접착하게 될 폴리이미드 필름의 패턴위에 개구부가 형성되도록 감광막의 패턴을 형성하고, 상기 감광막의 개구부에 접착용 수지가 두껍게 형성되고 상기 감광막의 패턴위에 얇게 형성되도록 코팅한 후 상기 감광막을 리프트 오프시켜 상기 개구부에만 접착용 수지가 남게 함으로써 접착용 수지를 직접 식각하지 않고도 간단하게 접착용 수지를 기판위에 형성할 수 있다.In the method of forming an adhesive resin of a semiconductor chip for a LOC package according to the present invention, a pattern of a polyimide film exposing a bonding pad of a chip is formed on a front surface of a substrate, and a polyimide film to which an internal lead of a semiconductor chip and a lead frame are to be bonded. The pattern of the photoresist film is formed so that an opening is formed on the pattern of the photoresist, the adhesive resin is thickly formed in the opening of the photoresist film, and the coating is formed to be thinly formed on the pattern of the photoresist film. By making it remain, the adhesive resin can be easily formed on the substrate without directly etching the adhesive resin.

Description

LOC패키지용 반도체 접착 수지 형성 방법How to Form Semiconductor Adhesive Resin for LOC Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 2 도 (a) 내지 (d)는 본 발명에 의한 LOC패키지용 반도체 칩의 접착수지 형성 방법을 나타낸 단면 공정도.2 (a) to (d) are cross-sectional process diagrams showing a method of forming an adhesive resin for a semiconductor chip for a LOC package according to the present invention.

Claims (3)

LOC 패키지용 반도체 칩의 접착 수지 형성 방법에 있어서, 상기 반도체 칩의 본딩 패드를 노출시키는 개구부를 갖는 폴리이미드 필름의 패턴을 기판위에 형성하는 단계와, 상기 반도체 칩과 리드 프레임의 내부 리드를 접착하기 위한 영역에 개구부를 형성하기 위해 상기 폴리이미드 필름의 패턴위에 소정의 감광막의 패턴을 형성하는 단계와, 상기 개구부에 접착용 수지를 선택적으로 형성하는 단계를 포함하는 LOC 패키지용 반도체 칩의 접착 수지 형성 방법.A method of forming an adhesive resin for a semiconductor chip for a LOC package, the method comprising: forming a pattern of a polyimide film having an opening exposing a bonding pad of the semiconductor chip on a substrate, and adhering the semiconductor chip to an internal lead of the lead frame. Forming a pattern of a predetermined photoresist film on the pattern of the polyimide film to form an opening in the region for, and forming an adhesive resin of the semiconductor chip for LOC package comprising the step of selectively forming an adhesive resin in the opening Way. 제 1 항에 있어서, 상기 접착용 수지를 선택적으로 형성하는 단게는 상기 감광막의 개부부와 패턴위에 상기 접착용 수지를 코팅하는 단계와, 리프트 오프법을 이용하여 상기 감광막의 패턴위의 상기 접착용 수지만을 제거하는 단계를 포함하는 것을 특징으로 하는 LOC 패키지용 반도체 칩의 접착 수지 형성 방법.The method of claim 1, wherein the step of selectively forming the adhesive resin comprises coating the adhesive resin on the opening and the pattern of the photosensitive film, and using the lift-off method for the adhesive on the pattern of the photosensitive film. A method of forming an adhesive resin for a semiconductor chip for a LOC package comprising the step of removing only the resin. 제 2 항에 있어서, 상기 접착용 수지가 상기 감광막의 개구부에 두껍게 형성되는 반면에 상기 감광막의 패턴위에 얇게 형성되는 것을 특징으로 하는 LOC 패키지용 반도체 칩의 접착 수지 형성 방법.3. The method of claim 2, wherein the adhesive resin is thickly formed in the opening of the photoresist film, while being formed thinly on the pattern of the photoresist film. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019960020178A 1996-06-07 1996-06-07 Adhesive resin formation method of semiconductor chip for LOC package KR980005921A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960020178A KR980005921A (en) 1996-06-07 1996-06-07 Adhesive resin formation method of semiconductor chip for LOC package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960020178A KR980005921A (en) 1996-06-07 1996-06-07 Adhesive resin formation method of semiconductor chip for LOC package

Publications (1)

Publication Number Publication Date
KR980005921A true KR980005921A (en) 1998-03-30

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ID=66284752

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960020178A KR980005921A (en) 1996-06-07 1996-06-07 Adhesive resin formation method of semiconductor chip for LOC package

Country Status (1)

Country Link
KR (1) KR980005921A (en)

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