KR980005921A - Adhesive resin formation method of semiconductor chip for LOC package - Google Patents
Adhesive resin formation method of semiconductor chip for LOC package Download PDFInfo
- Publication number
- KR980005921A KR980005921A KR1019960020178A KR19960020178A KR980005921A KR 980005921 A KR980005921 A KR 980005921A KR 1019960020178 A KR1019960020178 A KR 1019960020178A KR 19960020178 A KR19960020178 A KR 19960020178A KR 980005921 A KR980005921 A KR 980005921A
- Authority
- KR
- South Korea
- Prior art keywords
- adhesive resin
- semiconductor chip
- pattern
- forming
- opening
- Prior art date
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- Die Bonding (AREA)
Abstract
본 발명에 의한 LOC 패키지용 반도체 칩의 접착 수지 형성 방법은 칩의 본딩 패드를 노출시키는 폴리이미드 필름의 패턴이 기판의 전면에 형성되고, 반도체 칩과 리드 프레임의 내부 리드가 접착하게 될 폴리이미드 필름의 패턴위에 개구부가 형성되도록 감광막의 패턴을 형성하고, 상기 감광막의 개구부에 접착용 수지가 두껍게 형성되고 상기 감광막의 패턴위에 얇게 형성되도록 코팅한 후 상기 감광막을 리프트 오프시켜 상기 개구부에만 접착용 수지가 남게 함으로써 접착용 수지를 직접 식각하지 않고도 간단하게 접착용 수지를 기판위에 형성할 수 있다.In the method of forming an adhesive resin of a semiconductor chip for a LOC package according to the present invention, a pattern of a polyimide film exposing a bonding pad of a chip is formed on a front surface of a substrate, and a polyimide film to which an internal lead of a semiconductor chip and a lead frame are to be bonded. The pattern of the photoresist film is formed so that an opening is formed on the pattern of the photoresist, the adhesive resin is thickly formed in the opening of the photoresist film, and the coating is formed to be thinly formed on the pattern of the photoresist film. By making it remain, the adhesive resin can be easily formed on the substrate without directly etching the adhesive resin.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 2 도 (a) 내지 (d)는 본 발명에 의한 LOC패키지용 반도체 칩의 접착수지 형성 방법을 나타낸 단면 공정도.2 (a) to (d) are cross-sectional process diagrams showing a method of forming an adhesive resin for a semiconductor chip for a LOC package according to the present invention.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960020178A KR980005921A (en) | 1996-06-07 | 1996-06-07 | Adhesive resin formation method of semiconductor chip for LOC package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960020178A KR980005921A (en) | 1996-06-07 | 1996-06-07 | Adhesive resin formation method of semiconductor chip for LOC package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR980005921A true KR980005921A (en) | 1998-03-30 |
Family
ID=66284752
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960020178A KR980005921A (en) | 1996-06-07 | 1996-06-07 | Adhesive resin formation method of semiconductor chip for LOC package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR980005921A (en) |
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1996
- 1996-06-07 KR KR1019960020178A patent/KR980005921A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
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WITN | Withdrawal due to no request for examination |