KR980005902A - Wafer cleaning method - Google Patents
Wafer cleaning method Download PDFInfo
- Publication number
- KR980005902A KR980005902A KR1019960025395A KR19960025395A KR980005902A KR 980005902 A KR980005902 A KR 980005902A KR 1019960025395 A KR1019960025395 A KR 1019960025395A KR 19960025395 A KR19960025395 A KR 19960025395A KR 980005902 A KR980005902 A KR 980005902A
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- KR
- South Korea
- Prior art keywords
- wafer
- cleaning method
- solution
- wafer cleaning
- ozone
- Prior art date
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Abstract
본 발명은 반도체 제조중 웨이퍼 표면세정방법에 있어서, 오존과 순수(D.I)가 혼합된 용액에서 웨이퍼상의 유기물을 제거하는 것을 특징으로 하는 효과적인 웨이퍼 세정방법에 관한 것으로 종래의 세정용액으로 독성있는 산성용액을 사용하지 않아 웨이퍼 표면의 손상이 전혀 없으며 상기 용액의 폐액처분에서 자연보호의 효과가 있고, 세정공정의 비용을 절감할 수가 있다.The present invention relates to an effective wafer cleaning method for removing organic matters on a wafer in a solution in which ozone and pure water (DI) are mixed, in a wafer surface cleaning method during semiconductor manufacturing. The present invention relates to an effective wafer cleaning method, There is no damage to the surface of the wafer at all, and there is an effect of protecting the solution from waste solution disposal of the solution, and the cost of the cleaning process can be reduced.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
제1도는 본 발명의 일실시예에 따른 웨이퍼를 세정하기 위한 장치의 개략적인 구성도이다.FIG. 1 is a schematic block diagram of an apparatus for cleaning a wafer according to an embodiment of the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960025395A KR980005902A (en) | 1996-06-28 | 1996-06-28 | Wafer cleaning method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960025395A KR980005902A (en) | 1996-06-28 | 1996-06-28 | Wafer cleaning method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR980005902A true KR980005902A (en) | 1998-03-30 |
Family
ID=66241342
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960025395A KR980005902A (en) | 1996-06-28 | 1996-06-28 | Wafer cleaning method |
Country Status (1)
Country | Link |
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KR (1) | KR980005902A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100483037B1 (en) * | 1997-12-27 | 2005-07-29 | 주식회사 하이닉스반도체 | Semiconductor Wafer Cleaning Method |
-
1996
- 1996-06-28 KR KR1019960025395A patent/KR980005902A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100483037B1 (en) * | 1997-12-27 | 2005-07-29 | 주식회사 하이닉스반도체 | Semiconductor Wafer Cleaning Method |
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