KR950030250A - Tape Removal Method in Semiconductor Back Grinding Process - Google Patents

Tape Removal Method in Semiconductor Back Grinding Process Download PDF

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Publication number
KR950030250A
KR950030250A KR1019940006947A KR19940006947A KR950030250A KR 950030250 A KR950030250 A KR 950030250A KR 1019940006947 A KR1019940006947 A KR 1019940006947A KR 19940006947 A KR19940006947 A KR 19940006947A KR 950030250 A KR950030250 A KR 950030250A
Authority
KR
South Korea
Prior art keywords
tape
back grinding
grinding process
semiconductor back
removal method
Prior art date
Application number
KR1019940006947A
Other languages
Korean (ko)
Inventor
황준
박상훈
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019940006947A priority Critical patent/KR950030250A/en
Publication of KR950030250A publication Critical patent/KR950030250A/en

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Abstract

본 발명은 테이프 제거시 잔류물이 남지 않도록 UV(ultra-violet) 조사기를 사용 테이프를 경화시키는 것을 내용으로 하는 반도체 백 그라인딩 공정시의 테이프 제거 방법에 관한 것으로, 감광막 코팅 및 제거 단계를 생략함으로써 소자의 공정시간 단축 및 수율을 향상시키는 효과가 있다.The present invention relates to a method for removing a tape during a semiconductor back grinding process, wherein the tape is cured using an ultraviolet (ultra-violet) irradiator so that no residue is left upon removing the tape. It is effective in shortening the process time and improving the yield.

Description

반도체 백 그라인딩 공정시의 테이프 제거방법Tape Removal Method in Semiconductor Back Grinding Process

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (1)

웨이퍼 후면의 공정 잔유물을 제거하기 위한 백 그라인딩(back grinding) 공정시의 테이프(tape)제거 방법에 있어서; 웨이퍼 전면을 보호하기 위하여 테이프를 전면에 코팅하는 단계; 백 그라인딩을 실시하는 단계; 상기 테이프를 노광(exposure)하여 경화시키는 단계; 상기 테이프를 제거하는 단계를 포함하여 이루어지는 것을 특징으로 하는 반도체 백 그라인딩 공정시의 테이프 제거방법.A tape removal method in a back grinding process for removing process residues on a wafer back surface; Coating the tape on the front surface to protect the front side of the wafer; Performing back grinding; Exposing and curing the tape; Removing the tape, wherein the tape is removed during the semiconductor back grinding process. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임※ Note: The disclosure is based on the initial application.
KR1019940006947A 1994-04-01 1994-04-01 Tape Removal Method in Semiconductor Back Grinding Process KR950030250A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019940006947A KR950030250A (en) 1994-04-01 1994-04-01 Tape Removal Method in Semiconductor Back Grinding Process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019940006947A KR950030250A (en) 1994-04-01 1994-04-01 Tape Removal Method in Semiconductor Back Grinding Process

Publications (1)

Publication Number Publication Date
KR950030250A true KR950030250A (en) 1995-11-24

Family

ID=66677396

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940006947A KR950030250A (en) 1994-04-01 1994-04-01 Tape Removal Method in Semiconductor Back Grinding Process

Country Status (1)

Country Link
KR (1) KR950030250A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100502406B1 (en) * 1998-05-11 2005-09-26 삼성전자주식회사 UV tape removal device and method for semiconductor device manufacturing

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100502406B1 (en) * 1998-05-11 2005-09-26 삼성전자주식회사 UV tape removal device and method for semiconductor device manufacturing

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