KR980005766A - Wafer cleaning method - Google Patents
Wafer cleaning method Download PDFInfo
- Publication number
- KR980005766A KR980005766A KR1019960026350A KR19960026350A KR980005766A KR 980005766 A KR980005766 A KR 980005766A KR 1019960026350 A KR1019960026350 A KR 1019960026350A KR 19960026350 A KR19960026350 A KR 19960026350A KR 980005766 A KR980005766 A KR 980005766A
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- spraying
- onto
- water vapor
- water
- Prior art date
Links
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명은 웨이퍼의 세정방법을 개시한다. 개시된 본 발명의 웨이퍼의 세정방법은 챔버내에 웨이퍼를 장잠입시킨 후에 웨이퍼를 수직으로 세워 저속으로 회전시키는 단계; 저속으로 회전되는 웨이퍼의 표면에 순수한 물을 분사하는 단계; 순수한 물이 분사된 웨이퍼의 표면에 수증기를 분사하는 단계; 웨이퍼의 표면에 수증기를 분사하면서, 오존 가스를 수증기와 혼합하여 분사하는 단계; 오존 가스와 수증기를 분사하는 것을 끝낸후에 웨이퍼의 표면에 순수한 물을 분사하는 단계; 및 웨이퍼를 고속으로 회전시키고, 고속 회전하는 웨이퍼의 표면에 N2가스를 분사하는 단계를 포함하는 것을 특징으로 한다.The present invention discloses a cleaning method of a wafer. The cleaning method of a wafer of the present invention includes: a step of vertically standing the wafer at a low speed after a wafer is loaded in a chamber; Spraying pure water onto the surface of the wafer rotated at a low speed; Spraying water vapor onto the surface of the wafer onto which pure water is sprayed; Spraying ozone gas with water vapor while spraying water vapor onto the surface of the wafer; Spraying pure water onto the surface of the wafer after finishing spraying ozone gas and water vapor; And a step of spinning the wafer at a high speed and injecting N 2 gas onto the surface of the wafer rotating at a high speed.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.
도면은 본 발명에 따른 웨이퍼의 세정방법의 동작을 설명하기 위한 세정장치를 개략적으로 나타낸 도면.The drawings schematically show a cleaning apparatus for explaining the operation of a cleaning method of a wafer according to the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960026350A KR980005766A (en) | 1996-06-29 | 1996-06-29 | Wafer cleaning method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019960026350A KR980005766A (en) | 1996-06-29 | 1996-06-29 | Wafer cleaning method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR980005766A true KR980005766A (en) | 1998-03-30 |
Family
ID=66241520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960026350A KR980005766A (en) | 1996-06-29 | 1996-06-29 | Wafer cleaning method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR980005766A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100467016B1 (en) * | 2002-05-30 | 2005-01-24 | 삼성전자주식회사 | Method of cleaning semiconductor substrate |
-
1996
- 1996-06-29 KR KR1019960026350A patent/KR980005766A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100467016B1 (en) * | 2002-05-30 | 2005-01-24 | 삼성전자주식회사 | Method of cleaning semiconductor substrate |
US7318870B2 (en) | 2002-05-30 | 2008-01-15 | Samsung Electronics Co., Ltd. | Method of cleaning semiconductor substrate |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |