KR970072138A - Wafer cleaning apparatus and cleaning method - Google Patents

Wafer cleaning apparatus and cleaning method Download PDF

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Publication number
KR970072138A
KR970072138A KR1019960012523A KR19960012523A KR970072138A KR 970072138 A KR970072138 A KR 970072138A KR 1019960012523 A KR1019960012523 A KR 1019960012523A KR 19960012523 A KR19960012523 A KR 19960012523A KR 970072138 A KR970072138 A KR 970072138A
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KR
South Korea
Prior art keywords
cleaning
wafer
cleaning liquid
liquid supply
sonic
Prior art date
Application number
KR1019960012523A
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Korean (ko)
Inventor
이현재
고용선
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960012523A priority Critical patent/KR970072138A/en
Publication of KR970072138A publication Critical patent/KR970072138A/en

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Abstract

본 발명은 웨이퍼 세정장치 및 세정방법에 관해 개시한다. 본 발명에 의한 세정장치는 세정액 공급부와 상기 세정액 공급부로부터 세정액을 공급받는 초음파는 방출하는 DI 소닉(sonic)과 웨이퍼 세정용 브러쉬와 DI 노즐(nozzle)을 포함하는 메가소닉 세정공정이 진행되는 스핀 스크래블러를 구비한다.The present invention discloses a wafer cleaning apparatus and a cleaning method. The cleaning apparatus according to the present invention is characterized in that the ultrasonic wave supplied from the cleaning liquid supply unit and the cleaning liquid supply unit is supplied to the cleaning apparatus through the spin sonic cleaning process including the DI sonic discharging ultrasonic wave, the wafer cleaning brush and the DI nozzle, Respectively.

따라서 본 발명에 의한 세정장치를 이용한 세정방법은 메가소닉장치와 DI소닉을 이용한 매엽식 세정장치를 결합한 세정장치를 이용함으로써, 물리 화학적인 방법으로 웨이퍼를 세정할 수 있다. 즉, 초음파 세정과 세정액을 이용한 세정을 결합하여 세정을 실시하므로 세정효과를 높일 수 있을 뿐만 아니라 세정시간을 짧게할 수 있으므로 대구경 웨이퍼의 세정에도 긴 시간을 요하지 않는다. 결과적으로 반도체장치의 생산성을 높일 수 있다.Therefore, the cleaning method using the cleaning device according to the present invention can clean the wafer by a physicochemical method by using a cleaning device that combines a megasonic device and a single wafer cleaning device using a DI Sonic. In other words, since cleaning is performed by combining ultrasonic cleaning with cleaning using a cleaning liquid, the cleaning effect can be enhanced and the cleaning time can be shortened, so that a long time is not required for washing the large diameter wafer. As a result, the productivity of the semiconductor device can be increased.

Description

웨이퍼 세정장치 및 세정방법Wafer cleaning apparatus and cleaning method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 본 발명에 의한 웨이퍼 세정장치의 계통도이다.FIG. 1 is a system diagram of a wafer cleaning apparatus according to the present invention.

Claims (4)

세정액 공급부와 상기 세정액 공급부로부터 세정액을 공급받는 초음파는 방출하는 DI소닉(sonic)과 웨이퍼 세정용 브러쉬와 DI 노즐(nozzle)을 포함하는 메가소닉 세정공정이 진행되는 스핀 스크래블러를 구비하는 것을 특징으로 하는 웨이퍼 세정장치.The ultrasonic wave supplied from the cleaning liquid supply unit and the cleaning liquid supply unit includes a spin scrubber that performs a megasonic cleaning process including DI Sonic, a wafer cleaning brush, and a DI nozzle, . 제1항에 있어서, 상기 세정액 공급부는 세정액 공급원과 상기 세정액 공급원으로부터 세정액을 받아서 혼합하는 믹싱 탱크와 상기 믹싱탱크로부터 혼합 세정액을 받아서 가압하는 가압탱크 및 상기 가압탱크로부터 상기 DI 소닉 사이에 설치된 유량 측정기를 구비하는 것을 특징으로 하는 웨이퍼 세정장치.The apparatus according to claim 1, wherein the cleaning liquid supply unit comprises: a mixing tank for mixing the cleaning liquid from the cleaning liquid supply source and the cleaning liquid supply source; a pressurizing tank for receiving and pressurizing the mixed cleaning liquid from the mixing tank; And a wafer cleaning device for cleaning the wafer. 제2항에 있어서, 상기 세정액 공급원과 탱크, 탱크와 탱크사이에는 세정액의 흐름을 제어할 수있는 다수의 밸브가 구비되어 있는 것을 특징으로 하는 웨이퍼 세정장치.3. The wafer cleaning apparatus according to claim 2, wherein a plurality of valves capable of controlling the flow of the cleaning liquid are provided between the cleaning liquid supply source and the tank, and between the tank and the tank. 스핀 스크래블러내의 웨이퍼 척 상에 웨이퍼를 로딩하는 단계; 상기 웨이퍼 전면으로부터 일정거리 이격되어 있는 DI 소닉에 세정액을 공급하는 세정액 공급부로부터 세정액을 공급하는 단계; 상기 스핀 스크레블러내에서 메가 소닉에 의한 세정공정을 실시하는 단계; 상기 DI 소닉으로 공급된 세정액과 상기 DI 소닉으로부터 방출되는 초음파, 상기 스핀 스크래블러내의 브러쉬 및 DI를 이용하여 매엽식 세정을 실시하는 단계를 포함하는 것을 특징으로 하는 웨이퍼 세정장치.Loading a wafer onto a wafer chuck in a spin scrubber; Supplying a cleaning liquid from a cleaning liquid supply unit that supplies cleaning liquid to the DI Sonic which is spaced a predetermined distance from the front surface of the wafer; Performing a cleaning process by megasonic in the spin scaler; And performing a single-wafer cleaning using ultrasonic waves emitted from the DI sonic and DI Sonic, a brush in the spin-scrubber, and DI. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960012523A 1996-04-24 1996-04-24 Wafer cleaning apparatus and cleaning method KR970072138A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960012523A KR970072138A (en) 1996-04-24 1996-04-24 Wafer cleaning apparatus and cleaning method

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Application Number Priority Date Filing Date Title
KR1019960012523A KR970072138A (en) 1996-04-24 1996-04-24 Wafer cleaning apparatus and cleaning method

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KR970072138A true KR970072138A (en) 1997-11-07

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KR1019960012523A KR970072138A (en) 1996-04-24 1996-04-24 Wafer cleaning apparatus and cleaning method

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6743723B2 (en) 1995-09-14 2004-06-01 Canon Kabushiki Kaisha Method for fabricating semiconductor device
KR100426184B1 (en) * 1996-11-29 2004-06-24 캐논 가부시끼가이샤 Method for manufacturing semiconductor device
KR100537022B1 (en) * 1998-05-19 2006-03-17 삼성전자주식회사 Cleaning equipment and cleaning solution supply method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6743723B2 (en) 1995-09-14 2004-06-01 Canon Kabushiki Kaisha Method for fabricating semiconductor device
KR100426184B1 (en) * 1996-11-29 2004-06-24 캐논 가부시끼가이샤 Method for manufacturing semiconductor device
KR100537022B1 (en) * 1998-05-19 2006-03-17 삼성전자주식회사 Cleaning equipment and cleaning solution supply method

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