KR980005398U - Wire clamp unit with leaf spring - Google Patents

Wire clamp unit with leaf spring

Info

Publication number
KR980005398U
KR980005398U KR2019960018551U KR19960018551U KR980005398U KR 980005398 U KR980005398 U KR 980005398U KR 2019960018551 U KR2019960018551 U KR 2019960018551U KR 19960018551 U KR19960018551 U KR 19960018551U KR 980005398 U KR980005398 U KR 980005398U
Authority
KR
South Korea
Prior art keywords
leaf spring
wire clamp
clamp unit
unit
wire
Prior art date
Application number
KR2019960018551U
Other languages
Korean (ko)
Other versions
KR200160148Y1 (en
Inventor
이태희
Original Assignee
현대전자산업주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 현대전자산업주식회사 filed Critical 현대전자산업주식회사
Priority to KR2019960018551U priority Critical patent/KR200160148Y1/en
Publication of KR980005398U publication Critical patent/KR980005398U/en
Application granted granted Critical
Publication of KR200160148Y1 publication Critical patent/KR200160148Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
KR2019960018551U 1996-06-28 1996-06-28 Wire clamp unit using plate spring KR200160148Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019960018551U KR200160148Y1 (en) 1996-06-28 1996-06-28 Wire clamp unit using plate spring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019960018551U KR200160148Y1 (en) 1996-06-28 1996-06-28 Wire clamp unit using plate spring

Publications (2)

Publication Number Publication Date
KR980005398U true KR980005398U (en) 1998-03-30
KR200160148Y1 KR200160148Y1 (en) 1999-11-01

Family

ID=19460105

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019960018551U KR200160148Y1 (en) 1996-06-28 1996-06-28 Wire clamp unit using plate spring

Country Status (1)

Country Link
KR (1) KR200160148Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100388958B1 (en) * 2000-12-15 2003-06-25 삼성테크윈 주식회사 Pivot of wire clamp

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101902517B1 (en) * 2018-03-09 2018-09-28 대광기업 주식회사 Grommet support and grommet support applied grommet wire rope sling

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100388958B1 (en) * 2000-12-15 2003-06-25 삼성테크윈 주식회사 Pivot of wire clamp

Also Published As

Publication number Publication date
KR200160148Y1 (en) 1999-11-01

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Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20090727

Year of fee payment: 11

LAPS Lapse due to unpaid annual fee