KR970077119A - How to remove the film on the edge of the substrate - Google Patents

How to remove the film on the edge of the substrate Download PDF

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Publication number
KR970077119A
KR970077119A KR1019970019785A KR19970019785A KR970077119A KR 970077119 A KR970077119 A KR 970077119A KR 1019970019785 A KR1019970019785 A KR 1019970019785A KR 19970019785 A KR19970019785 A KR 19970019785A KR 970077119 A KR970077119 A KR 970077119A
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substrate
solvent
edge
storage portion
resist cleaning
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KR1019970019785A
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KR100254292B1 (en
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고이치 나가사와
나오미 가와구치
후토시 시마이
미츠루 사토
고지 하라다
쥰 고시야마
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나카네 히사시
도쿄 오카 코교 가부시키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • G03F7/322—Aqueous alkaline compositions

Abstract

디프로필렌 글리콜 모노알킬 에테르 단독, 이것과 비점이 75∼130℃, 20℃에서의 증기압이 5∼75㎜Hg인 고휘발성 유기용제의 혼합물, 또는 알칼리성 수용액등의 현상액으로 된 레지스트 세정제거용 용제를 미리 채운 용제저장부(14a)에 기판(W)의 단연부를 수평방향으로부터 삽입한 후, 용제저장부(14a)내의 상기 레지스트 세정제거용 용제중에 기판(W)의 단연부를 소정시간 침지시켜 기판 단연부의 여분의 부착물을 용해 제거하도록 하였다.Dipropylene glycol monoalkyl ether alone, a mixture of a high-volatile organic solvent having a boiling point of 75 to 130 ° C. and a vapor pressure of 5 to 75 mmHg at 20 ° C., or a solvent for removing the resist cleaning and removing with a developer such as an alkaline aqueous solution After inserting the edge of the substrate W into the pre-filled solvent storage portion 14a from the horizontal direction, the edge of the substrate W is immersed for a predetermined time in the resist cleaning removal solvent in the solvent storage portion 14a. The excess excess deposits were allowed to dissolve off.

Description

기판 단연부(端緣部)의 피막 제거방법How to remove the film on the edge of the substrate

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제 1도는 본 발명에 따른 기판 단연부의 피막 제거방법을 실행하는 제거장치의 전체 사시도.1 is an overall perspective view of a removal apparatus for performing the film removal method of the substrate edge portion according to the present invention.

Claims (11)

디프로필렌 글리콜 모노알킬 에테르 단독, 이것과 비점이 75∼130℃, 20℃에서의 증기압이 5∼75㎜Hg인 고휘발성 유기용제의 혼합물, 또는 알칼리성 수용액으로 된 레지스트 세정제거용 용제를 미리 채운 용제저장부에, 기판의 단연부를 수평 방향으로부터 삽입한 후, 상기 용제저장부내의 상기 레지스트 세정제거용 용제중에 상기 기판의 단연부를 소정시간 침지시켜 상기 기판 단연부의 여분의 부착물을 용해 제거하도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.Dipropylene glycol monoalkyl ether alone, a mixture of a high volatile organic solvent having a boiling point of 75 to 130 ° C and a vapor pressure of 5 to 75 mmHg at 20 ° C, or a solvent pre-filled with a resist cleaning and removing solvent which is an alkaline aqueous solution After inserting the edge of the substrate from the horizontal direction into the storage portion, the edge of the substrate is immersed for a predetermined time in the resist cleaning removal solvent in the solvent storage portion to dissolve and remove the extra adherend of the substrate edge. The film removal method of the board | substrate edge part made into. 디프로필렌 글리콜 모노알킬 에테르 65∼95중량%와 초산 부틸 5∼35중량%의 혼합물로 된 레지스트 세정제거용 용제를 미리 채운 용제저장부에, 기판의 단연부를 수평방향으로부터 삽입한 후, 상기 용제저장부내의 상기 레지스트 세정제거용 용제중에 상기 기판의 단연부를 소정시간 침지시켜 상기 기판 단연부의 여분의 부착물을 용해제거하도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.After inserting the edge of the substrate from the horizontal direction into a solvent storage portion pre-filled with a resist cleaning and removing solvent comprising a mixture of 65 to 95 wt% dipropylene glycol monoalkyl ether and 5 to 35 wt% butyl acetate, the solvent storage A method for removing a film on a substrate edge, wherein the edge of the substrate is immersed in the resist cleaning removal solvent in a portion for a predetermined time to dissolve and remove excess adherents of the substrate edge. 알코올류, 글리콜 에테르류 및 비(非)프로톤성 극성용매중에서 선택된 적어도 1종의 수용성 용기용제와, 알카놀 아민류, 환상질소화합물 및 제4급 암모늄염중에서 선택된 적어도 1종의 알칼리를 물에 용해한 알칼리 수용액으로 된 레지스트 세정제거용 용제를 미리 채운 용제저장부에, 기판의 단연부를 수평방향으로부터 삽입한 후, 상기 용제저장부내의 상기 레지스트 세정제거용 용제중에 상기 기판의 단연부를 소정시간 침지시켜 상기 기판 단연부의 여분의 부착물을 용해 제거하도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.Alkali in which at least one water-soluble container solvent selected from alcohols, glycol ethers and non-protic polar solvents is dissolved in water and at least one alkali selected from alkanol amines, cyclic nitrogen compounds and quaternary ammonium salts After inserting the edge of the substrate from the horizontal direction into the solvent storage portion prefilled with the resist cleaning removal solvent made of an aqueous solution, the substrate is immersed for a predetermined time in the resist cleaning removal solvent in the solvent storage portion. The film removal method of the board | substrate edge part made to melt | dissolve and remove the extra deposit of the edge part. 제3항에 있어서, 알칼리 수용액에 있어서의 상기 수용성 유기용제가 메틸알코올, 이소프로필 알코올, 에틸렌 글리콜 모노메틸 에테르, 프로필렌 글리콜 모노메틸 에테르, 디프로필렌 글리콜 모노메틸 에테르 및 1,3-디메틸-2-이미다졸리디논 중에서 선택된 적어도 1종이고, 상기 알칼리가 모노에탄올아민, 디에탄올아민, 2-(2-아미노에톡시)에탄올, 2-히드록시에틸피리딘, N-메틸-2-피롤리돈 및 테트라 메틸암모툼 히드록시드 중에서 선택된 적어도 1종인 것을 특징으로 하는 기판 단연부의 피막 제거방법.The water-soluble organic solvent in the aqueous alkali solution is methyl alcohol, isopropyl alcohol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether and 1,3-dimethyl-2-. At least one selected from imidazolidinone, the alkali being monoethanolamine, diethanolamine, 2- (2-aminoethoxy) ethanol, 2-hydroxyethylpyridine, N-methyl-2-pyrrolidone and The film removal method of the edge of a board | substrate characterized in that it is at least 1 sort (s) chosen from tetramethylammonium hydroxide. 디프로필렌 글리콜 모노알킬 에테르 단독, 이것과 비점이 75∼130℃, 20℃에서의 증기압이 5∼75㎜Hg인 고휘발성 유기용제의 혼합물, 또는 알칼리성 수용액으로 된 레지스트 세정제거용 용제를 채우기 전의 용제저장부에, 기판의 단연부를 수평방향으로부터 삽입한 후, 상기 용제저장부내 상기 레지스트 세정제거용 용제를 채우고, 이어서 상기 용제저장부내의 상기 레지스트 세정제거용 용제중에 상기 기판의 단연부를 소정시간 침지시켜 상기 기판 단연부의 여분의 부착물을 용해제거하도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.Solvent before filling with dipropylene glycol monoalkyl ether alone, a mixture of this and a highly volatile organic solvent having a boiling point of 75 to 130 ° C. and a vapor pressure of 5 to 75 mmHg at 20 ° C., or an alkaline aqueous solution. After inserting the periphery of the substrate from the horizontal direction, the storage section is filled with the resist cleaning removal solvent in the solvent storage section, and then the edge of the substrate is immersed for a predetermined time in the resist cleaning removal solvent in the solvent storage section. The film removal method of the board | substrate edge part made to melt | dissolve and remove the excess adhering part of the said board | substrate edge part. 디프로필렌 글리콜 모노알킬 에테르 65∼95중량%와 초산 부틸 5∼35중량%의 혼합물로 된 레지스트 세정제거용 용제를 채우기 전의 용제저장부에, 기판의 단연부를 수평방향으로부터 삽입한 후, 상기 용제저장부내에 상기 레지스트 세정제거용 용제를 채우고, 이어서 상기 용제저장부내의 상기 레지스트 세정제거용 용제중에 상기 기판의 단연부를 소정시간 침지시켜 상기 기판 단연부의 여분의 부착물을 용해제거하도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.After inserting the edge of the substrate from the horizontal direction into the solvent storage portion before filling the resist cleaning and removing solvent comprising a mixture of 65 to 95 wt% dipropylene glycol monoalkyl ether and 5 to 35 wt% butyl acetate, the solvent storage A substrate is filled with the resist cleaning removal solvent in a portion, and then the edge of the substrate is immersed in the resist cleaning removal solvent in the solvent storage for a predetermined time to dissolve and remove the extra adherend of the substrate edge. How to remove the film from the edge. 알코올류, 글리콜 에테르류 및 비프로톤성 극성용매 중에서 선택된 적어도 1종의 수용성 유기용제와, 알카놀아민류, 환상질소화합물 및 제4급 암모늄염 중에서 선택된 적어도 1종의 알칼리를 물에 용해한 알칼리 수용액으로 된 레지스트 세정제거용 용제를 채우기 전의 용제저장부에, 기판의 단연부를 수평방향으로부터 삽입한 후, 상기 용제저장부내의 상기 레지스트 세정제거용 용제를 채우고, 이어서 상기 용제저장부내의 상기 레지스트 세정제거용제중에 상기 기판의 단연부를 소정시간 침지시켜 상기 기판 단연부의 여분의 부착물을 용해제거하도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.At least one water-soluble organic solvent selected from alcohols, glycol ethers, and aprotic polar solvents, and an aqueous alkali solution in which at least one alkali selected from alkanolamines, cyclic nitrogen compounds, and quaternary ammonium salts is dissolved in water. After inserting the periphery of the substrate from the horizontal direction into the solvent storage portion before filling the resist cleaning removal solvent, the solvent cleaning removal solvent in the solvent storage portion is filled, and then in the resist cleaning removal solvent in the solvent storage portion. The film removal method of the board | substrate edge part by immersing the edge of the said board | substrate for a predetermined time so that the extra deposit of the said board | substrate edge part may be removed. 제7항에 있어서, 알칼리 수용액에 있어서의 상기 수용성 유기용제가 메틸알코올, 이소프로필 알코올, 에틸렌 글리콜 모노메틸 에테르, 프로필렌 글리콜 모노메틸 에테르, 디프로필렌 글리콜 모노메틸 에테르 및 1,3-디메틸-2-아미다졸리디논 중에서 선택된 적어도 1종이고, 상기 알칼리가 모노에탄올아민, 디에탄올아민, 2-(2-아미노에톡시)에탄올, 2-히드록시에틸피리딘, N-메틸-2-피롤리돈 및 테트라 메틸암모늄 히드록시드 중에서 선택된 적어도 1종인것을 특징으로 하는 기판 단연부의 피막 제거방법.8. The water-soluble organic solvent in the aqueous alkali solution is methyl alcohol, isopropyl alcohol, ethylene glycol monomethyl ether, propylene glycol monomethyl ether, dipropylene glycol monomethyl ether and 1,3-dimethyl-2-. At least one selected from amidazolidinone, the alkali being monoethanolamine, diethanolamine, 2- (2-aminoethoxy) ethanol, 2-hydroxyethylpyridine, N-methyl-2-pyrrolidone and The film removing method of the edge of a board | substrate characterized in that it is at least 1 sort (s) chosen from tetramethylammonium hydroxide. 제1항 내지 제8항 중 어느 한 항에 있어서, 피막의 제거중에서 상기 레지스트 세정제거용 용제, 상기 용제저장부 또는 상기 기판을 진동시키는 것을 특징으로 하는 기판 단연부의 피막 제거방법.The film removing method of any one of claims 1 to 8, wherein the solvent for removing the resist cleaning, the solvent storage portion, or the substrate is vibrated during the removal of the film. 제1항 내지 제9항 중 어느 한 항에 있어서, 상기 기판은 직사각형을 이루고, 이 직사각형 기판의 1변 또는 대향하는 2변의 단연부를 상기 용제저장부에 수평방향으로부터 삽입하여 상기 단연부의 여분의 부착물을 제거하도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.The substrate according to any one of claims 1 to 9, wherein the substrate has a rectangular shape, and one edge or two opposite edges of the rectangular substrate are inserted into the solvent storage portion from the horizontal direction to provide extra attachment to the edge portion. The film removal method of the edge of the substrate, characterized in that to remove the. 제1항 내지 제9항 중 어느 한 항에 있어서, 상기 기판은 원판의 외주의 일부에 직선상의 절결부를 갖는 형상을 이루고, 이 기판의 외측 단연부의 피막을 제거함에 있어서, 상기 기판의 그 자리에서 회전되고, 상기 용제저장부는 직선상의 절결부를 포함하는 상기 기판의 외측 단연부를 따라 상기 기판에 대하여 수평방향으로 전후 이동되도록 한 것을 특징으로 하는 기판 단연부의 피막 제거방법.10. The substrate according to any one of claims 1 to 9, wherein the substrate has a shape having a straight cutout on a part of the outer circumference of the original plate, and in removing the coating of the outer edge of the substrate, the position of the substrate And the solvent storage unit is moved back and forth in the horizontal direction with respect to the substrate along the outer edge of the substrate including a straight cutout. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019970019785A 1996-05-21 1997-05-21 Method of removing coating from edge of substrate KR100254292B1 (en)

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Application Number Priority Date Filing Date Title
JP12597096A JP4127866B2 (en) 1996-05-21 1996-05-21 Method for removing substrate edge coating
JP96-125,970 1996-05-21
JP8-125,970 1996-05-21

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KR100254292B1 KR100254292B1 (en) 2000-06-01

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