JP4957290B2 - End face processing equipment - Google Patents
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Description
本発明は、レジスト塗布基板等の周辺端部の感光層を除去する端面処理装置に関し、特に、ブラック、レッド、グリーン、ブルー等の着色顔料レジストを塗布したレジスト塗布基板の端面のレジスト層を所定幅除去することができる端面処理装置に関する。 The present invention relates to an end face processing apparatus for removing a photosensitive layer at a peripheral edge of a resist-coated substrate, and more particularly to a predetermined resist layer on the end surface of a resist-coated substrate coated with a color pigment resist such as black, red, green, and blue. The present invention relates to an end face processing apparatus capable of removing the width.
近年、大型カラーテレビ、ノートパソコン、携帯用電子機器の増加に伴い、液晶ディスプレイ、特にカラー液晶ディスプレイパネルの需要の増加はめざましいものがある。
カラー液晶ディスプレイパネルは、カラーフィルタ基板と、液晶と、駆動素子と、光学フィルムとから構成されている。
In recent years, with the increase in large color televisions, notebook computers and portable electronic devices, there has been a remarkable increase in demand for liquid crystal displays, particularly color liquid crystal display panels.
The color liquid crystal display panel includes a color filter substrate, a liquid crystal, a driving element, and an optical film.
カラー液晶ディスプレイパネルに用いられるカラーフィルタ基板は、ガラス基板上に、ブラックマトリックス、赤色フィルタ、緑色フィルタ、青色フィルタ等からなる着色フィルタ、柱状スペーサー等がフォトマスクを用いたパターン露光、現像等のパターニング処理を行うフォトリソグラフィープロセスを経て形成される。 The color filter substrate used in the color liquid crystal display panel is a patterning such as pattern exposure and development using a photomask on a glass substrate, a colored filter composed of a black matrix, a red filter, a green filter, a blue filter, and a columnar spacer. It is formed through a photolithography process that performs processing.
以下、フォトリソグラフィープロセスを用いたカラーフィルタ基板の製造方法について説明する。
図１０（ａ）〜（ｈ）は、カラーフィルタ基板の製造方法の一例を示す部分模式構成断面図である。
まず、ガラス基板１１１上にアクリル系樹脂にカーボンブラックを分散した黒色の感光性樹脂をスピンナー等にて塗布し、黒色感光性樹脂層２１１を形成し（図１０（ａ）参照）、パターン露光、現像等のパターニング処理を行って、ブラックマトリクス２１１ａを形成する（図１０（ｂ）参照）。
Hereinafter, a method for manufacturing a color filter substrate using a photolithography process will be described.
10A to 10H are partial schematic cross-sectional views illustrating an example of a method for manufacturing a color filter substrate.
First, a black photosensitive resin in which carbon black is dispersed in an acrylic resin is applied on a glass substrate 111 with a spinner or the like to form a black photosensitive resin layer 211 (see FIG. 10A), pattern exposure, A black matrix 211a is formed by performing a patterning process such as development (see FIG. 10B).
次に、アクリル系の感光性樹脂に赤色顔料を分散した赤色感光性樹脂溶液をブラックマトリクス２１１ａが形成されたガラス基板１１１上にスピンナー等を用いて塗布し、赤色感光性樹脂層２３１を形成し（図１０（ｃ）参照）、所定のフォトマスクを使ってパターン露光、現像等の一連のパターニング処理を行って、赤色フィルタ２３１Ｒを形成する（図１０（ｄ）参照）。 Next, a red photosensitive resin solution in which a red pigment is dispersed in an acrylic photosensitive resin is applied to the glass substrate 111 on which the black matrix 211a is formed using a spinner or the like to form a red photosensitive resin layer 231. (See FIG. 10C.) A series of patterning processes such as pattern exposure and development are performed using a predetermined photomask to form a red filter 231R (see FIG. 10D).
次に、アクリル系の感光性樹脂に緑色顔料を分散した緑色感光性樹脂溶液をブラックマトリクス２１１ａ及び赤色フィルタ２３１Ｒが形成されたガラス基板１１１上にスピンナー等を用いて塗布し、緑色感光性樹脂層２３２を形成し（図１０（ｅ）参照）、所定のフォトマスクを使ってパターン露光、現像等の一連のパターニング処理を行って、緑色フィルタ２３２Ｇを形成する（図１０（ｆ）参照）。 Next, a green photosensitive resin solution in which a green pigment is dispersed in an acrylic photosensitive resin is applied onto the glass substrate 111 on which the black matrix 211a and the red filter 231R are formed using a spinner or the like, and the green photosensitive resin layer is applied. 232 is formed (see FIG. 10E), and a series of patterning processes such as pattern exposure and development are performed using a predetermined photomask to form a green filter 232G (see FIG. 10F).
次に、アクリル系の感光性樹脂に青色顔料を分散した青色感光性樹脂溶液をブラックマトリクス２１１ａ、赤色フィルタ２３１Ｒ及び緑色フィルタ２３２Ｇが形成されたガラス基板１１１上にスピンナー等を用いて塗布し、青色感光性樹脂層２３３を形成し（図１０（ｇ）参照）、所定のフォトマスクを使ってパターン露光、現像等の一連のパターニング処理を行って、青色フィルタ２３３Ｂを形成し、ブラックマトリクス２１１ａが形成されたガラス基板１１１上に赤色フィルタ２３１Ｒ、緑色フィルタ２３２Ｇ及び緑色フィルタ２３３Ｂからなる着色フィルタ２３０を形成する（図１０（ｈ）参照）。
さらに、必要に応じて、透明電極、柱状スペーサを形成する。
Next, a blue photosensitive resin solution in which a blue pigment is dispersed in an acrylic photosensitive resin is applied onto the glass substrate 111 on which the black matrix 211a, the red filter 231R, and the green filter 232G are formed using a spinner or the like. A photosensitive resin layer 233 is formed (see FIG. 10G), a series of patterning processes such as pattern exposure and development are performed using a predetermined photomask to form a blue filter 233B, and a black matrix 211a is formed. A colored filter 230 including a red filter 231R, a green filter 232G, and a green filter 233B is formed on the glass substrate 111 (see FIG. 10H).
Furthermore, a transparent electrode and a columnar spacer are formed as necessary.
上記カラーフィルタ基板の製造工程で、黒色感光性樹脂層２１１、赤色感光性樹脂層２
３１、緑色感光性樹脂層２３２及び青色感光性樹脂層２３３等の感光層が形成された塗布基板では、塗布基板の周縁部（１〜５ｍｍ）が盛り上がり、パターン露光工程の以降の工程で、塗布基板とフォトマスクとのギャップ設定がうまくいかなかったり、盛り上がりレジストが欠けて異物等の欠陥として塗布基板上に付着する等の不具合が発生する。
In the manufacturing process of the color filter substrate, the black photosensitive resin layer 211, the red photosensitive resin layer 2
31, in the coated substrate on which the photosensitive layers such as the green photosensitive resin layer 232 and the blue photosensitive resin layer 233 are formed, the peripheral portion (1 to 5 mm) of the coated substrate is raised, and the coating is performed in the steps after the pattern exposure step. Problems such as poor gap setting between the substrate and the photomask, or rising resist lacking and adhering to the coated substrate as a defect such as a foreign substance, occur.
上記不具合を防止するために、塗布基板端面の感光層を除去することが行われており、ガラス基板にレジストを塗布して感光層を形成した塗布基板の周縁部の感光層を除去する基板処理方法が提案されている（例えば、特許文献１参照）。 In order to prevent the above problems, the photosensitive layer on the end face of the coated substrate is removed, and the substrate processing for removing the photosensitive layer on the peripheral portion of the coated substrate in which a photosensitive layer is formed by coating a resist on a glass substrate. A method has been proposed (see, for example, Patent Document 1).
これは、ガラス基板に着色レジストを塗布した塗布基板の周縁部の感光層を４個のリムーバーヘッドにて、除去液（シンナー）等を吐出しながら塗布基板の各辺に沿って移動し、塗布基板の周縁部に付着した余分の感光層を除去しようというものである。 This is because the photosensitive layer on the periphery of the coated substrate, which is coated with a colored resist on a glass substrate, is moved along each side of the coated substrate while discharging removal liquid (thinner) etc. with four remover heads. The purpose is to remove the excess photosensitive layer adhering to the peripheral edge of the substrate.
ここで、処理ヘッドを用いた塗布基板の周縁部の感光層を除去する除去方法に付いて説明する。
図９（ａ）〜（ｄ）は、塗布基板の周縁部の感光層を処理ヘッドを用いて除去している状態を示す説明図である。
ガラス基板１１１に感光層２１１が形成された塗布基板２０１の両端を２個の処理ヘッド３００にてくわえ込み（図９（ａ）参照）、塗布基板２０１の両端の端面を処理液に浸して、塗布基板２０１の揺動動作を行うことで、塗布基板２０１の端面の感光層除去し、対向する端面の感光層が除去された塗布基板２０２を作製する（図９（ｂ）参照）。
Here, a removal method for removing the photosensitive layer at the peripheral edge of the coated substrate using the processing head will be described.
FIGS. 9A to 9D are explanatory views showing a state in which the photosensitive layer at the peripheral edge of the coated substrate is removed using the processing head.
Both ends of the coated substrate 201 on which the photosensitive layer 211 is formed on the glass substrate 111 are held by two processing heads 300 (see FIG. 9A), and the end surfaces of both ends of the coated substrate 201 are immersed in a processing solution. By swinging the coated substrate 201, the photosensitive layer on the end surface of the coated substrate 201 is removed, and the coated substrate 202 from which the photosensitive layer on the opposite end surface is removed is manufactured (see FIG. 9B).
さらに、対向する端面の感光層が除去された塗布基板２０２を９０度回転して、塗布基板２０２を処理ヘッド３００にてくわえ込み（図９（ｃ）参照）、塗布基板２０２の両端の端面を処理液に浸して、塗布基板２０２の揺動動作を行うことで、処理ヘッド３００にてくわえ込んだ塗布基板２０２の端面の感光層除去し、塗布基板２０１の４端面の感光層が除去された塗布基板２０３を作製する（図９（ｄ）参照）。
このように、処理ヘッド３００を用いて塗布基板の端面を処理することにより、塗布基板周縁部の感光層を容易に除去することができる
次に、端面処理部１０が内蔵された端面処理装置２００について説明する
図６は、端面処理装置２００の内部構造を模式的に示す模式構成断面図である。
端面処理装置２００は、処理液を貯留しておく処理液貯留部１１と処理液を処理液貯留部に供給する処理液供給部１２と端面処理した処理液を廃棄する処理液廃液部１３とからなる端面処理部１０と、端面処理された基板上端面部の洗浄を行う純水供給部２１、純水吐出ノズル２１ａと、純水洗浄した基板上端面部を乾燥させるエアー供給部２１、エアー吐出ノズル２１ａとを備えた上部処理ヘッド２０と、純水洗浄した基板下端面部を乾燥させる純水供給部３１、純水吐出ノズル３１ａと、純水洗浄した基板下端面部を乾燥させるエアー供給部３２、エアー吐出ノズル３２ａとを備えた下部処理ヘッド３０と、処理液及び純水を廃棄する排気装置４０とで構成されている。
Further, the coated substrate 202 from which the photosensitive layer on the opposite end surface is removed is rotated by 90 degrees, and the coated substrate 202 is held by the processing head 300 (see FIG. 9C), and the end surfaces at both ends of the coated substrate 202 are moved. By immersing the coating substrate 202 in the processing solution, the photosensitive layer on the end surface of the coating substrate 202 held by the processing head 300 is removed, and the photosensitive layer on the four end surfaces of the coating substrate 201 is removed. A coated substrate 203 is manufactured (see FIG. 9D).
Thus, by processing the end surface of the coated substrate using the processing head 300, the photosensitive layer at the peripheral edge of the coated substrate can be easily removed. Next, the end surface processing apparatus 200 in which the end surface processing unit 10 is incorporated. 6 is a schematic cross-sectional view schematically showing the internal structure of the end surface processing apparatus 200. FIG.
The end surface processing apparatus 200 includes a processing liquid storage unit 11 that stores the processing liquid, a processing liquid supply unit 12 that supplies the processing liquid to the processing liquid storage unit, and a processing liquid waste liquid unit 13 that discards the processing liquid subjected to the end surface processing. The end surface processing unit 10, the pure water supply unit 21 that cleans the upper end surface portion of the substrate subjected to the end surface processing, the pure water discharge nozzle 21 a, and the air supply unit 21 and air discharge nozzle 21 a that dry the upper end surface portion of the substrate cleaned with pure water. An upper processing head 20, a pure water supply unit 31 for drying the lower end surface portion of the substrate cleaned with pure water, a pure water discharge nozzle 31 a, an air supply unit 32 for drying the lower end surface portion of the substrate cleaned with pure water, and an air discharge The lower processing head 30 provided with the nozzle 32a, and the exhaust apparatus 40 which discards a process liquid and a pure water are comprised.
ガラス基板１１１に感光層２１１が形成された塗布基板２０１は、上部処理ヘッド２０と下部処理ヘッド３０との間から端面処理部１０の処理液貯留部１１に挿入され、塗布基板２０１を処理液に浸すことで端面の感光層を溶解させ、塗布基板２０１を端面処理部１０から離しながら、純水供給部２２、３２の純水吐出ノズル２２ａ、３２ａでの純水洗浄、エアー供給部２１、３１のエアー吐出ノズル２１ａ、３１ａでのエアーパージにて表面乾燥を行って、塗布基板２０１の対向する２端面の感光層が除去された塗布基板２０２を得る。
さらに、端面の感光層が除去された塗布基板２０２を９０度回転して、上記端面処理装置２００にて塗布基板２０２の端面の感光層を除去することにより、塗布基板２０１の４端面の感光層が除去された塗布基板２０３を得ることができる。
The coated substrate 201 having the photosensitive layer 211 formed on the glass substrate 111 is inserted into the processing liquid storage unit 11 of the end surface processing unit 10 from between the upper processing head 20 and the lower processing head 30, and the coated substrate 201 is used as the processing liquid. By soaking, the photosensitive layer on the end surface is dissolved, and the coated substrate 201 is separated from the end surface processing unit 10 while washing with pure water at the pure water discharge nozzles 22a and 32a of the pure water supply units 22 and 32 and the air supply units 21 and 31. Surface drying is performed by air purging with the air discharge nozzles 21a and 31a to obtain a coated substrate 202 from which the photosensitive layers on the two opposite end surfaces of the coated substrate 201 are removed.
Further, the coated substrate 202 from which the photosensitive layer on the end surface is removed is rotated by 90 degrees, and the photosensitive layer on the end surface of the coated substrate 202 is removed by the end surface processing apparatus 200, whereby the photosensitive layer on the four end surfaces of the coated substrate 201 is obtained. It is possible to obtain the coated substrate 203 from which is removed.
上記塗布基板２０１の端面の感光層を除去する工程の中で、塗布基板２０１の端面の感光層を処理液に浸した後、純水洗浄、エアーパージ（表面乾燥）動作を順に行っているが、処理中に溶解したレジストが純水吐出ノズルやエアー吐出ノズルに付着して吐出ノズルのノズル詰まりが発生する場合がある。 In the step of removing the photosensitive layer on the end surface of the coated substrate 201, the photosensitive layer on the end surface of the coated substrate 201 is immersed in a processing solution, and then a pure water cleaning operation and an air purge (surface drying) operation are sequentially performed. In some cases, the resist dissolved during the treatment adheres to the pure water discharge nozzle or the air discharge nozzle and the nozzle of the discharge nozzle becomes clogged.
図７（ａ）は、純水吐出ノズル２２ａにノズル詰まりが無く、塗布基板２０１の端面の感光層を処理液に浸した後、感光層が溶解した端面に純水吐出ノズル２２ａから純水が均一に吐出された状態を示す。
図７（ｂ）は、純水吐出ノズル２２ａにノズル詰まりが発生し、塗布基板２０１の端面の感光層を処理液に浸した後、感光層が溶解した端面に純水吐出ノズル２２ａから純水が不均一に吐出された状態を示す。
FIG. 7A shows that the pure water discharge nozzle 22a is not clogged, and after the photosensitive layer on the end face of the coated substrate 201 is immersed in the processing solution, pure water is supplied from the pure water discharge nozzle 22a to the end face where the photosensitive layer is dissolved. The state where it was discharged uniformly is shown.
In FIG. 7B, after the nozzle clogging occurs in the pure water discharge nozzle 22a and the photosensitive layer on the end face of the coated substrate 201 is immersed in the processing solution, the pure water is supplied from the pure water discharge nozzle 22a to the end face where the photosensitive layer is dissolved. Shows a state where the ink is discharged non-uniformly.
図８（ａ）は、エアー吐出ノズル２２ａにノズル詰まりが無く、塗布基板２０１の端面の感光層を処理液に浸した後、感光層が溶解した端面に純水吐出ノズル２２ａから純水が均一に吐出された状態を示す。
図８（ｂ）は、エアー吐出ノズル２２ａにノズル詰まりが発生し、塗布基板２０１の端面の感光層を処理液に浸した後、感光層が溶解した端面に純水吐出ノズル２２ａから純水が不均一に吐出された状態を示す。
In FIG. 8A, the air discharge nozzle 22a is not clogged, and after the photosensitive layer on the end surface of the coated substrate 201 is immersed in the processing solution, the pure water is uniformly supplied from the pure water discharge nozzle 22a to the end surface where the photosensitive layer is dissolved. The discharged state is shown.
In FIG. 8B, nozzle clogging occurs in the air discharge nozzle 22a. After the photosensitive layer on the end face of the coated substrate 201 is immersed in the processing solution, pure water is supplied from the pure water discharge nozzle 22a to the end face where the photosensitive layer is dissolved. The state of non-uniform ejection is shown.
このように、純水吐出ノズル及びエアー吐出ノズルにノズル詰まりが発生すると、塗布基板２０１の端面の感光層が正常に除去されずに、ガラス基板１１１端面にレジスト残りが発生したり、処理液や純水が塗布基板の有効面まで弾けて飛散する液はねに繋がる。 As described above, when nozzle clogging occurs in the pure water discharge nozzle and the air discharge nozzle, the photosensitive layer on the end surface of the coated substrate 201 is not normally removed, and a resist residue is generated on the end surface of the glass substrate 111. The pure water is splashed to the effective surface of the coated substrate and splashes to the liquid splash.
塗布基板端面のレジスト残りが発生した場合、パターン露光工程で塗布基板端面のレジスト残りがアライメントマークと近接していた場合アライメント作業が正常に行われず、位置合わせズレが発生することになり問題である。 If the resist residue on the coated substrate end face occurs, if the resist residue on the coated substrate end face is close to the alignment mark in the pattern exposure process, the alignment operation will not be performed normally, causing misalignment. .
また、塗布基板有効面に処理液や純水が弾けると、塗布基板有効面にピンホール、もしくは異物となり、製品不良となり問題である。
本発明は、上記問題点に鑑み考案されたものであり、純水吐出ノズルとエアー吐出ノズルと処理液貯留部とを備えた端面処理部にて塗布基板の端面の感光層を除去する端面処理装置において、純水吐出ノズル及びエアー吐出ノズルのノズル詰まりが発生しないで、塗布基板の端面除去処理を均一に行うことができる端面処理装置を提供することを目的とする。 The present invention has been devised in view of the above-described problems, and is an end face process for removing a photosensitive layer on an end face of a coated substrate in an end face processing section provided with a pure water discharge nozzle, an air discharge nozzle, and a processing liquid storage section. An object of the present invention is to provide an end face processing apparatus capable of uniformly performing an end face removing process of a coated substrate without causing clogging of pure water discharge nozzles and air discharge nozzles.
本発明に於いて上記課題を達成するために、まず、請求項１においては、少なくとも処理液を一時的に保留しておくための処理液貯留部（１１）と処理液を処理液貯留部に供給するための処理液供給部（１２）と処理液を排出するための処理液排出部（１３）とから
なる端面被膜処理部（１０）と、上部処理ヘッド（２０）と下部処理ヘッド（３０）とからなる処理ヘッド（９０）と、前記処理ヘッド（９０）内の処理液及び純水を外部にエアー排出するための排出装置（４０）とで構成されている端面処理装置であって、
前記端面処理装置の処理ヘッド（９０）が少なくとも２個以上に分割され、
前記上部処理ヘッド（２０）は、純水を純水吐出ノズルに供給するための純水供給部（２１）と、塗布基板の端部に純水を吐出するための純水吐出ノズル（２１ａ）と、エアーをエアー吐出ノズルに供給するためのエアー供給部（２２）と、塗布基板の端部をエアー乾燥するためのエアー吐出ノズル（２２ａ）と、純水供給部に純水を供給するための純水配管（２１ｂ）とエアー供給部にエアーを供給するためのエアー配管（２２ｂ）とで構成され、
前記下部処理ヘッド（３０）は、純水を純水吐出ノズルに供給するための純水供給部（３１）と塗布基板の端部に純水を吐出するための純水吐出ノズル（３１ａ）とエアーをエアー吐出ノズルに供給するためのエアー供給部（３２）と塗布基板の端部をエアー乾燥するためのエアー吐出ノズル（３２ａ）と純水供給部に純水を供給するための純水配管（３１ｂ）とエアー供給部にエアーを供給するためのエアー配管（３２ｂ）とで構成され、
前記分割された処理ヘッド（９０）毎に前記純水配管（２１ｂ）及び純水配管（３１ｂ）に純水圧と流量を検知するための水圧センサー（５１）を、前記エアー配管（２２ｂ）及びエアー配管（３２ｂ）にエアー圧と流量を検知するためのエアー圧センサー（５２）をそれぞれ設けたことを特徴とする端面処理装置としたものである。
In order to achieve the above object in the present invention, first, in claim 1, at least a processing liquid storage part (11) for temporarily storing a processing liquid and a processing liquid in the processing liquid storage part. An end face film processing unit (10) including a processing liquid supply unit (12) for supplying and a processing liquid discharge unit (13) for discharging the processing liquid, an upper processing head (20), and a lower processing head (30). And a discharge device (40) for discharging the processing liquid and pure water in the processing head (90) to the outside,
The processing head (90) of the end surface processing apparatus is divided into at least two or more ,
The upper processing head (20) includes a pure water supply unit (21) for supplying pure water to the pure water discharge nozzle, and a pure water discharge nozzle (21a) for discharging pure water to the end of the coating substrate. An air supply unit (22) for supplying air to the air discharge nozzle, an air discharge nozzle (22a) for air-drying the end of the coated substrate, and a pure water supply unit for supplying pure water to the pure water supply unit. The pure water pipe (21b) and the air pipe (22b) for supplying air to the air supply unit,
The lower processing head (30) includes a pure water supply part (31) for supplying pure water to the pure water discharge nozzle, and a pure water discharge nozzle (31a) for discharging pure water to the end of the coating substrate. An air supply unit (32) for supplying air to the air discharge nozzle, an air discharge nozzle (32a) for air drying the end of the coating substrate, and a pure water pipe for supplying pure water to the pure water supply unit (31b) and an air pipe (32b) for supplying air to the air supply unit,
A water pressure sensor (51) for detecting a pure water pressure and a flow rate in the pure water pipe (21b) and the pure water pipe (31b) for each of the divided processing heads (90), the air pipe (22b) and the air The end face processing apparatus is characterized in that an air pressure sensor (52) for detecting the air pressure and the flow rate is provided in the pipe (32b) .
本発明の端面処理装置は、処理ヘッドが分割されており、個々の処理ヘッド毎に純水及びエアーの圧力を管理しているので、純水吐出ノズル及びエアー吐出ノズルのノズル詰まりを防止することができ、ノズル詰まりによる処理液、純水の飛散を未然に防止でき、塗布基板の端面除去処理を安定して、均一に行うことができる。 In the end face processing apparatus of the present invention, the processing head is divided and the pressure of pure water and air is managed for each processing head, so that the nozzle clogging of the pure water discharge nozzle and the air discharge nozzle is prevented. It is possible to prevent the treatment liquid and pure water from scattering due to nozzle clogging, and to stably and uniformly perform the end face removal processing of the coated substrate.
以下本発明の実施の形態につき説明する。
図１は、本発明の端面処理装置の一実施例を示す模式図である。
図２は、端面処理装置の処理ヘッドをＡ−Ａ’で切断した処理ヘッドの模式構成断面図である。
本発明の端面処理装置１００は、処理液を一時的に保留しておくための処理液貯留部１１と処理液を処理液貯留部に供給するための処理液供給部１２と処理液を排出するための処理液排出部１３とからなる端面被膜処理部１０と、上部処理ヘッド２０と、下部処理ヘッド３０とからなる処理ヘッド９０と、前記処理ヘッド９０内の処理液及び純水を外部にエアー排出するための排出装置４０とで構成されており、処理ヘッド９０をそれぞれ分割処理ヘッド９０ａ、分割処理ヘッド９０ｂ、分割処理ヘッド９０ｃ、分割処理ヘッド９０ｄとに４分割した事例である。
ここでは、処理ヘッド９０を４分割した事例について説明したが、処理ヘッド９０の分割数は２分割以上であれば、何分割でも良く、適宜設定できるものである。
Hereinafter, embodiments of the present invention will be described.
FIG. 1 is a schematic view showing an embodiment of an end face processing apparatus of the present invention.
FIG. 2 is a schematic cross-sectional view of the processing head obtained by cutting the processing head of the end surface processing apparatus along AA ′.
The end surface processing apparatus 100 of the present invention discharges the processing liquid storage unit 11 for temporarily holding the processing liquid, the processing liquid supply unit 12 for supplying the processing liquid to the processing liquid storage unit, and the processing liquid. The processing film discharge unit 13 for the end surface coating processing unit 10, the upper processing head 20, the processing head 90 including the lower processing head 30, and the processing liquid and pure water in the processing head 90 are aired to the outside. This is an example in which the processing head 90 is divided into four divided into a divided processing head 90a, a divided processing head 90b, a divided processing head 90c, and a divided processing head 90d.
Here, an example in which the processing head 90 is divided into four has been described. However, the number of divisions of the processing head 90 may be any number as long as it is two or more, and can be set as appropriate.
上部処理ヘッド２０と下部処理ヘッド３０とはそれぞれのヘッド後部でネジ止め等で固定されて一体構造の処理ヘッド９０を構成している。 The upper processing head 20 and the lower processing head 30 are fixed by screwing or the like at the rear of each head to constitute an integrated processing head 90.
上部処理ヘッド２０は、純水を純水吐出ノズルに供給するための純水供給部２１と、塗布基板の端部に純水を吐出するための純水吐出ノズル２１ａと、エアーをエアー吐出ノズル２２ａに供給するためのエアー供給部２２と、塗布基板の端部をエアー乾燥するためのエアー吐出ノズル２２ａと、純水供給部に純水を供給するための純水配管２１ｂとエアー供給部にエアーを供給するためのエアー配管２２ｂとで構成されており、純水配管２１ｂ
及びエアー配管２２ｂの途中に純水圧、エアー圧を感知するための水圧センサー５１、エアー圧センサー５２を設けて、純水吐出ノズル２１ａから吐出される純水吐出圧及び流量を、またエアー吐出ノズル２２ａから吐出されるエアー吐出圧及び流量をそれぞれ制御している。
The upper processing head 20 includes a pure water supply unit 21 for supplying pure water to the pure water discharge nozzle, a pure water discharge nozzle 21a for discharging pure water to the end of the coating substrate, and an air discharge nozzle. An air supply unit 22 for supplying to 22a, an air discharge nozzle 22a for air-drying the end of the coating substrate, a pure water pipe 21b for supplying pure water to the pure water supply unit, and an air supply unit It is composed of an air pipe 22b for supplying air, and a pure water pipe 21b.
And a water pressure sensor 51 and an air pressure sensor 52 for detecting pure water pressure and air pressure in the middle of the air pipe 22b, so that the pure water discharge pressure and flow rate discharged from the pure water discharge nozzle 21a can be changed. The air discharge pressure and flow rate discharged from 22a are respectively controlled.
下部処理ヘッド３０は、純水を純水吐出ノズルに供給するための純水供給部３１と、塗布基板の端部に純水を吐出するための純水吐出ノズル３１ａと、エアーをエアー吐出ノズル３２ａに供給するためのエアー供給部３２と、塗布基板の端部をエアー乾燥するためのエアー吐出ノズル３２ａと、純水供給部に純水を供給するための純水配管３１ｂとエアー供給部にエアーを供給するためのエアー配管３２ｂとで構成されており、純水配管３１ｂ及びエアー配管３２ｂの途中に純水圧及び流量を、エアー圧及び流量を感知するための水圧センサー５１、エアー圧センサー５２を設けて、純水吐出ノズル２１ａから吐出される純水吐出圧及び流量を、またエアー吐出ノズル２２ａから吐出されるエアー吐出圧及び流量をそれぞれ制御している。 The lower processing head 30 includes a pure water supply unit 31 for supplying pure water to the pure water discharge nozzle, a pure water discharge nozzle 31a for discharging pure water to the end of the coating substrate, and an air discharge nozzle. An air supply unit 32 for supplying to 32a, an air discharge nozzle 32a for air-drying the end of the coated substrate, a pure water pipe 31b for supplying pure water to the pure water supply unit, and an air supply unit It comprises an air pipe 32b for supplying air, a pure water pressure and a flow rate in the middle of the pure water pipe 31b and the air pipe 32b, a water pressure sensor 51 for sensing the air pressure and flow rate, and an air pressure sensor 52. Are provided to control the pure water discharge pressure and flow rate discharged from the pure water discharge nozzle 21a and the air discharge pressure and flow rate discharged from the air discharge nozzle 22a, respectively.
このことから、吐出ノズルにノズル詰まりが発生すると流量が極端に少なくなり、それを水圧センサー５１、エアー圧センサー５２が検知するので、リアルタイムで吐出ノズルのノズル詰まりを監視することができる。 From this, when nozzle clogging occurs in the discharge nozzle, the flow rate becomes extremely small, and the water pressure sensor 51 and the air pressure sensor 52 detect this, so that the nozzle clogging of the discharge nozzle can be monitored in real time.
一例として、６２０×７５０ｍｍの塗布基板を処理する本発明の端面処理装置１００の構成例について説明する。
処理ヘッド９０の幅を８００ｍｍとし、４分割して、それぞれ上、下の２００ｍｍ幅の分割処理ヘッド９０ａ、分割処理ヘッド９０ｂ、分割処理ヘッド９０ｃ、分割処理ヘッド９０ｄに、純水配管、水圧センサー５１、純水供給部、純水吐出ノズル、エアー配管、エアー圧センサー５２、エアー供給部、エアー吐出ノズルを形成し、ヘッド後部をネジ止めして、処理ヘッドが４分割された処理ヘッド９０を作製する。
水圧センサー５１の一例として、０〜１ｋＰａの測定範囲を有する正圧タイプの水圧センサーを、エアー圧センサー５２の一例として、０〜１ＭＰａの測定範囲を有する正圧タイプのエアー圧センサーを挙げることができる。
純水吐出ノズル及びエアー吐出ノズルのピッチの一例として１０ｍｍを挙げることができる。
As an example, a configuration example of the end surface processing apparatus 100 of the present invention that processes a 620 × 750 mm coated substrate will be described.
The width of the processing head 90 is 800 mm, and is divided into four parts. Each of the upper and lower divided processing heads 90a, 90b, 90b, 90c, and 90d is divided into pure water piping and a water pressure sensor 51. A pure water supply part, a pure water discharge nozzle, an air pipe, an air pressure sensor 52, an air supply part and an air discharge nozzle are formed, and the head rear part is screwed to produce a processing head 90 in which the processing head is divided into four parts. To do.
An example of the water pressure sensor 51 is a positive pressure type water pressure sensor having a measurement range of 0 to 1 kPa, and an example of the air pressure sensor 52 is a positive pressure type air pressure sensor having a measurement range of 0 to 1 MPa. it can.
An example of the pitch of the pure water discharge nozzle and the air discharge nozzle is 10 mm.
以下本発明の端面処理装置１００を用いてガラス基板１１１上にレジスト等の感光層２１１がガラス基板１１１の片面に形成された塗布基板２０１の端面処理について説明する。
図３、図４、図５は、端面処理装置１００の分割処理ヘッド９０ｄでの塗布基板２０１の端面処理を行っている状態を示す説明図である。
分割処理ヘッド９０ａ、９０ｂ及び９０ｃについては、分割処理ヘッド９０ｄと同じ処理が行われるので、ここでは、分割処理ヘッド９０ｄでの説明にとどめる。
Hereinafter, the end surface processing of the coated substrate 201 in which a photosensitive layer 211 such as a resist is formed on one side of the glass substrate 111 on the glass substrate 111 using the end surface processing apparatus 100 of the present invention will be described.
3, 4, and 5 are explanatory diagrams illustrating a state where the end surface processing of the coated substrate 201 is performed by the division processing head 90 d of the end surface processing apparatus 100.
Since the division processing heads 90a, 90b, and 90c perform the same process as the division processing head 90d, only the division processing head 90d will be described here.
まず、処理液貯留部１１に処理液供給部１２より処理液を満たした状態で、塗布基板２０１を上部処理ヘッド２０と下部処理ヘッド３０との間から挿入し、塗布基板２０１の処理したい端面部の位置まで処理液供給部１２内の処理液に浸す（図３参照）。 First, the coating substrate 201 is inserted between the upper processing head 20 and the lower processing head 30 in a state in which the processing liquid storage unit 11 is filled with the processing liquid from the processing liquid supply unit 12, and the end surface portion of the coating substrate 201 to be processed is processed. Is immersed in the processing liquid in the processing liquid supply unit 12 (see FIG. 3).
次に、塗布基板２０１の端面部が処理液供給部１２の処理液に一定時間浸漬されると、被膜の膨潤、溶解が始まるので、処理液排出部１３より処理液を処理液貯留部１１より排出して、塗布基板２０１の端面部を純水ノズル２１ａの位置までずらして、純水ノズル２１ａにて純水をスプレーして、純水にて被膜が溶解した処理液を除去し、塗布基板２０１の端面部には純水の液溜まりを生成する（図４参照）。
ここで、純水ノズル２１ａの純水スプレー圧及び流量は、水圧センサー５１にて制御され
、ノズル詰まり等が発生して、流量が落ちると水圧センサー５１にて感知し、警報等を発し、リアルタイムに処置できるようになっている。
Next, when the end surface of the coated substrate 201 is immersed in the processing liquid of the processing liquid supply unit 12 for a certain period of time, the coating begins to swell and dissolve, so that the processing liquid is discharged from the processing liquid discharge unit 13 from the processing liquid storage unit 11. After discharging, the end face of the coating substrate 201 is shifted to the position of the pure water nozzle 21a, and pure water is sprayed with the pure water nozzle 21a to remove the treatment liquid in which the film is dissolved with pure water, and the coating substrate. A pool of pure water is generated on the end surface portion 201 (see FIG. 4).
Here, the pure water spray pressure and flow rate of the pure water nozzle 21a are controlled by the water pressure sensor 51, and when the nozzle flow is reduced due to nozzle clogging or the like, the water pressure sensor 51 senses and issues an alarm. Can be treated.
次に、端面部に純水の液溜まりができた塗布基板２０１を純水ノズル２１ａの位置までずらして、エアー吐出ノズル２２ａにてエアーを吐出し、純水の液溜まりを吹き飛ばして、塗布基板２０１の端面部の清浄と乾燥を行う（図５参照）。
エアー吐出ノズル２２ａにて純水の液溜まりを吹き飛ばす際、余分の水滴等が塗布基板２０１の有効領域に再付着しないように、排出装置４０にて排気される。
以上の工程で、塗布基板２０１の対向する端面の端面処理ができたので、さらに塗布基板２０１を９０度回転して同様の端面処理を行うことにより、塗布基板２０１の四端面の端面処理を行うことができる。
Next, the coating substrate 201 in which the pure water pool is formed at the end face is shifted to the position of the pure water nozzle 21a, the air is ejected by the air ejection nozzle 22a, and the pure water pool is blown off, thereby coating the coating substrate. The end surface portion 201 is cleaned and dried (see FIG. 5).
When the pure water pool is blown off by the air discharge nozzle 22 a, the water is exhausted by the discharge device 40 so that excess water droplets and the like do not reattach to the effective area of the coating substrate 201.
With the above steps, the end surface processing of the opposite end surfaces of the coated substrate 201 has been completed, and the end surface processing of the four end surfaces of the coated substrate 201 is performed by further rotating the coated substrate 201 by 90 degrees and performing the same end surface processing. be able to.
ここでは、ガラス基板１１１の片面に感光層２１が形成された塗布基板２０１の端面処理ついて説明したが、本発明の端面処理装置は両面塗布基板対応になっているので、両面に感光層が形成された塗布基板の端面処理ができるのは言うまでもない。 Here, the end surface processing of the coated substrate 201 in which the photosensitive layer 21 is formed on one side of the glass substrate 111 has been described. However, since the end surface processing apparatus of the present invention is compatible with a double-sided coated substrate, a photosensitive layer is formed on both sides. Needless to say, the end surface of the coated substrate can be processed.
１０……端面処理部
１１……処理液貯留部
１２……処理液供給部
１３……処理液排出部
２０……上部処理ヘッド
３０……下処理ヘッド
２１、３１……純水供給部
２１ａ、３１ａ……純水吐出ノズル
２１ｂ、３１ｂ……純水配管
２２、３２……エアー供給部
２２ａ、３２ａ……エアー吐出ノズル
２２ｂ、３２ｂ……エアー配管
４０……排気装置
９０……処理ヘッド
９０ａ、９０ｂ、９０ｃ、９０ｄ……分割処理ヘッド
１００、２００……端面処理装置
１１１……ガラス基板
２０１……塗布基板
２０２……対向する２端面の感光層が除去された塗布基板
２０３……４端面の感光層が除去された塗布基板
２１１……感光層
２１１ａ……ブラックマトリクス
２３０……着色フィルタ
２３１……赤色感光性樹脂層
２３１Ｒ……赤色フィルタ
２３２……緑色感光性樹脂層
２３２Ｇ……緑色フィルタ
２３３……青色感光性樹脂層
２３３Ｂ……青色フィルタ
３００……処理ヘッド
DESCRIPTION OF SYMBOLS 10 ... End surface process part 11 ... Process liquid storage part 12 ... Process liquid supply part 13 ... Process liquid discharge part 20 ... Upper process head 30 ... Lower process head 21, 31 ... Pure water supply part 21a, 31a... Pure water discharge nozzles 21b and 31b... Pure water pipes 22 and 32... Air supply units 22a and 32a... Air discharge nozzles 22b and 32b. 90b, 90c, 90d ... division processing heads 100, 200 ... end face processing device 111 ... glass substrate 201 ... coated substrate 202 ... coated substrate 203 from which the two opposite facing photosensitive layers have been removed. Coating substrate 211 from which the photosensitive layer has been removed .... Photosensitive layer 211a .... Black matrix 230 .... Colored filter 231 .... Red photosensitive resin layer 231R ... Red filter 232 ... Green Photosensitive resin layer 232G ...... green filter 233 ...... blue-sensitive resin layer 233B ...... blue filter 300 ...... treatment head
Claims (1)
前記端面処理装置の処理ヘッド（９０）が少なくとも２個以上に分割され、
前記上部処理ヘッド（２０）は、純水を純水吐出ノズルに供給するための純水供給部（２１）と、塗布基板の端部に純水を吐出するための純水吐出ノズル（２１ａ）と、エアーをエアー吐出ノズルに供給するためのエアー供給部（２２）と、塗布基板の端部をエアー乾燥するためのエアー吐出ノズル（２２ａ）と、純水供給部に純水を供給するための純水配管（２１ｂ）とエアー供給部にエアーを供給するためのエアー配管（２２ｂ）とで構成され、
前記下部処理ヘッド（３０）は、純水を純水吐出ノズルに供給するための純水供給部（３１）と塗布基板の端部に純水を吐出するための純水吐出ノズル（３１ａ）とエアーをエアー吐出ノズルに供給するためのエアー供給部（３２）と塗布基板の端部をエアー乾燥するためのエアー吐出ノズル（３２ａ）と純水供給部に純水を供給するための純水配管（３１ｂ）とエアー供給部にエアーを供給するためのエアー配管（３２ｂ）とで構成され、
前記分割された処理ヘッド（９０）毎に前記純水配管（２１ｂ）及び純水配管（３１ｂ）に純水圧と流量を検知するための水圧センサー（５１）を、前記エアー配管（２２ｂ）及びエアー配管（３２ｂ）にエアー圧と流量を検知するためのエアー圧センサー（５２）をそれぞれ設けたことを特徴とする端面処理装置。 At least the processing liquid storage unit (11) for temporarily holding the processing liquid, the processing liquid supply unit (12) for supplying the processing liquid to the processing liquid storage unit, and the processing liquid for discharging the processing liquid An end face film processing unit (10) including a discharge unit (13), a processing head (90) including an upper processing head (20) and a lower processing head (30), and a processing liquid in the processing head (90) And an end surface treatment device composed of a discharge device (40) for discharging pure water to the outside,
The processing head (90) of the end surface processing apparatus is divided into at least two or more ,
The upper processing head (20) includes a pure water supply unit (21) for supplying pure water to the pure water discharge nozzle, and a pure water discharge nozzle (21a) for discharging pure water to the end of the coating substrate. An air supply unit (22) for supplying air to the air discharge nozzle, an air discharge nozzle (22a) for air-drying the end of the coated substrate, and a pure water supply unit for supplying pure water to the pure water supply unit. The pure water pipe (21b) and the air pipe (22b) for supplying air to the air supply unit,
The lower processing head (30) includes a pure water supply part (31) for supplying pure water to the pure water discharge nozzle, and a pure water discharge nozzle (31a) for discharging pure water to the end of the coating substrate. An air supply unit (32) for supplying air to the air discharge nozzle, an air discharge nozzle (32a) for air drying the end of the coating substrate, and a pure water pipe for supplying pure water to the pure water supply unit (31b) and an air pipe (32b) for supplying air to the air supply unit,
A water pressure sensor (51) for detecting a pure water pressure and a flow rate in the pure water pipe (21b) and the pure water pipe (31b) for each of the divided processing heads (90), the air pipe (22b) and the air An end face processing apparatus, wherein an air pressure sensor (52) for detecting an air pressure and a flow rate is provided in each pipe (32b) .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007048981A JP4957290B2 (en) | 2007-02-28 | 2007-02-28 | End face processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007048981A JP4957290B2 (en) | 2007-02-28 | 2007-02-28 | End face processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008211143A JP2008211143A (en) | 2008-09-11 |
| JP4957290B2 true JP4957290B2 (en) | 2012-06-20 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2007048981A Expired - Fee Related JP4957290B2 (en) | 2007-02-28 | 2007-02-28 | End face processing equipment |
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| JP (1) | JP4957290B2 (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3602225B2 (en) * | 1995-10-31 | 2004-12-15 | 大日本スクリーン製造株式会社 | Substrate processing equipment |
| JP3437693B2 (en) * | 1995-12-06 | 2003-08-18 | 大日本スクリーン製造株式会社 | Substrate edge cleaning device |
| JP4127866B2 (en) * | 1996-05-21 | 2008-07-30 | 東京応化工業株式会社 | Method for removing substrate edge coating |
| JP2002110501A (en) * | 2000-09-26 | 2002-04-12 | Toppan Printing Co Ltd | Method and device for removing resist bead |
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