KR970072223A - A semiconductor manufacturing apparatus. - Google Patents

A semiconductor manufacturing apparatus. Download PDF

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Publication number
KR970072223A
KR970072223A KR1019960010509A KR19960010509A KR970072223A KR 970072223 A KR970072223 A KR 970072223A KR 1019960010509 A KR1019960010509 A KR 1019960010509A KR 19960010509 A KR19960010509 A KR 19960010509A KR 970072223 A KR970072223 A KR 970072223A
Authority
KR
South Korea
Prior art keywords
cooling
lead frame
semiconductor manufacturing
manufacturing apparatus
heater
Prior art date
Application number
KR1019960010509A
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Korean (ko)
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KR100196389B1 (en
Inventor
하정기
Original Assignee
최춘길
태석기계 주식회사
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Publication date
Application filed by 최춘길, 태석기계 주식회사 filed Critical 최춘길
Priority to KR1019960010500A priority Critical patent/KR100196389B1/en
Publication of KR970072223A publication Critical patent/KR970072223A/en
Application granted granted Critical
Publication of KR100196389B1 publication Critical patent/KR100196389B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 반도체 제조장치에 관한 것으로서, 특히 다수의 칩을 접착제로 접착시킨 리드 프레임을 이송시키면서 히터에서 발생되는 열을 비접촉식으로 간접 가열하여 상기 접착제를 경화시키는 가열경화수단과, 상기 가열경화수단에서 가열된 리드 프레임 및 칩에 냉각 가스를 토출하여 강제적으로 냉각시키는 냉각수단을 구비하는 것을 특징으로 한다.The present invention relates to a semiconductor manufacturing apparatus and, more particularly, to a semiconductor manufacturing apparatus which includes a heating curing unit for indirectly heating a heat generated in a heater while transferring a lead frame to which a plurality of chips are bonded with an adhesive to cure the adhesive, And cooling means for forcibly cooling the heated lead frame and the chip by discharging the cooling gas.

따라서, 본 발명에서는 에폭시 등의 접착제에 의해 접착된 리드 프레임 및 칩이 히터에서 발생된 열을 비접촉식으로 전달 받아서 가열경화된 후 질소 가스 등의 냉각 가스에 의해 강제적으로 냉각됨으로써 직접 가열에 의한 리드 프레임 및 칩의 열화나 특성 변화 등의 발생을 방지함과 동시에 변형 등에 의한 불량율의 발생을 최소화할 수 있으며, 특히 대기 시간을 단축시켜 생산성을 향상시킬 수 있는 등의 여러 가지 효과가 있다.Therefore, in the present invention, the lead frame and the chip bonded by an adhesive such as epoxy are received in a non-contact manner and heat-cured, and then forcedly cooled by a cooling gas such as nitrogen gas, And deterioration of the chip and change in characteristics, and at the same time, it is possible to minimize the occurrence of defective rate due to deformation and the like, and in particular, productivity can be improved by shortening the standby time.

Description

반도체 제조장치.A semiconductor manufacturing apparatus.

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 본 발명에 따른 반도체 제조장치를 도시한 개략적인 평면도이다.FIG. 1 is a schematic plan view showing a semiconductor manufacturing apparatus according to the present invention.

Claims (7)

다수의 칩을 접착제로 접착시킨 리드 프레임을 이송시키면서 히터에서 발생되는 열을 비접촉식으로 간접 가열하여 상기 접착제를 경화시키는 가열경화수단; 상기 가열경화수단에서 가열된 리드 프레임 및 칩에 냉각가스를 토출하여 강제적으로 냉각시키는 냉각수단을 구비하는 것을 특징으로 하는 반도체 제조장치.A heating curing means for curing the adhesive by indirectly heating the heat generated in the heater while indirectly heating the heat generated by the heater while transferring the lead frame having a plurality of chips bonded with an adhesive; And cooling means for forcibly cooling the lead frame and the chip heated by the heating and curing means by discharging the cooling gas to the lead frame and the chip. 제1항에 있어서, 상기 가열경화수단은 케이스 내에 배열되어 히터에서 발생된 열을 전달하는 다수의 히터 블럭 및 히터 블럭판과, 상기 히터 블럭 및 히터 블럭판의 사이에서 슬라이드 가능케 고정 설치된 슬라이드 블럭과, 상기 슬라이드 블럭의 상측에 삽입 고정된 다수의고정 와이어와, 상기 리드 프레임을 이송시키는 이송와이어를 구비하는 것을 특징으로 하는 반도체 제조장치.[2] The apparatus of claim 1, wherein the heating and curing means comprises a plurality of heater blocks and heater block plates arranged in the case to transmit heat generated from the heaters, a slide block slidably installed between the heater blocks and the heater block plate, , A plurality of fixed wires inserted and fixed on the upper side of the slide block, and a feed wire for feeding the lead frame. 제2항에 있어서, 상기 슬라이드 블럭은 고정 와이어가 삽입 고정되는 통공을 갖는 돌출부가 구비된 것을 특징으로 하는 반도체 제조장치.The semiconductor manufacturing apparatus according to claim 2, wherein the slide block is provided with a projection having a through hole through which the fixing wire is inserted and fixed. 제1항에 있어서, 상기 냉각수단은 리드 프레임을 이송시키는 이송 벨트와, 상기 이송벨트 상에서 이송되는 리드 프레임 및 칩을 향하여 냉각 가스를 토출시키는 다수의 노즐을 갖는 하부 냉각판 및 상부 냉각판과, 상기 하부 및 상부 냉각판의 내측으로 냉각 가스를 공급하는 가스관을 구비하는 것을 특징으로 하는 반도체 제조장치.2. The apparatus of claim 1, wherein the cooling means comprises: a transfer belt for transferring a lead frame; a lower cooling plate and an upper cooling plate having a plurality of nozzles for discharging a cooling gas toward a lead frame and a chip transferred on the transfer belt; And a gas pipe for supplying a cooling gas to the inside of the lower and upper cooling plates. 제4항에 있어서, 상기 냉각 가스는 질소 가스인 것을 특징으로 하는 반도체 제조장치.The semiconductor manufacturing apparatus according to claim 4, wherein the cooling gas is a nitrogen gas. 제4항에 있어서, 상기 가스관은 냉각 가스의 토출량을 조절하는 조정밸브가 구비된 것을 특징으로 하는 반도체 제조장치.5. The semiconductor manufacturing apparatus according to claim 4, wherein the gas pipe is provided with a regulating valve for regulating a discharge amount of the cooling gas. 제4항에 있어서, 상기 하부 및 상부 냉각판은 투명재 수지인 것을 특징으로 하는 반도체 제조장치.The semiconductor manufacturing apparatus according to claim 4, wherein the lower and upper cooling plates are transparent resin. ※ 참고사항 : 최초출원 내용에 의하여 공개되는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960010500A 1996-04-08 1996-04-08 Apparatus for manufacturing semiconductor device KR100196389B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960010500A KR100196389B1 (en) 1996-04-08 1996-04-08 Apparatus for manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960010500A KR100196389B1 (en) 1996-04-08 1996-04-08 Apparatus for manufacturing semiconductor device

Publications (2)

Publication Number Publication Date
KR970072223A true KR970072223A (en) 1997-11-07
KR100196389B1 KR100196389B1 (en) 1999-06-15

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Application Number Title Priority Date Filing Date
KR1019960010500A KR100196389B1 (en) 1996-04-08 1996-04-08 Apparatus for manufacturing semiconductor device

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302198B1 (en) * 1998-03-17 2001-11-30 서경석 Semiconductor fabrication equipment

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100302198B1 (en) * 1998-03-17 2001-11-30 서경석 Semiconductor fabrication equipment

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Publication number Publication date
KR100196389B1 (en) 1999-06-15

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