KR970070250A - Lead frame strike plating device - Google Patents

Lead frame strike plating device Download PDF

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Publication number
KR970070250A
KR970070250A KR1019960009867A KR19960009867A KR970070250A KR 970070250 A KR970070250 A KR 970070250A KR 1019960009867 A KR1019960009867 A KR 1019960009867A KR 19960009867 A KR19960009867 A KR 19960009867A KR 970070250 A KR970070250 A KR 970070250A
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KR
South Korea
Prior art keywords
plating
lead frame
anode
vessel
roller
Prior art date
Application number
KR1019960009867A
Other languages
Korean (ko)
Other versions
KR100203328B1 (en
Inventor
이상균
Original Assignee
이대원
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 이대원, 삼성항공산업 주식회사 filed Critical 이대원
Priority to KR1019960009867A priority Critical patent/KR100203328B1/en
Publication of KR970070250A publication Critical patent/KR970070250A/en
Application granted granted Critical
Publication of KR100203328B1 publication Critical patent/KR100203328B1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H01L23/49582—Metallic layers on lead frames

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

리드프레임(lead frame) 전체를 일정한 두께로 도금하는 스트라이크(strike)도금장치에 관한 내용이 개시되어 있다. 이 스트라이크 도금장치는 도금액이 담긴 도금용기와, 도금용기 내부에 소정 간격 분리되어 상하로 설치된 양극과, 양극 사이로 리드프레임을 이송시키기 위한 로울러수단을 구비하는 리드프레임 스트라이크 도금장치에 있어서, 도금용기의 상부 일측 및 그 반대편에 설치된 제1로울러 및 제2로울러와, 양극의 좌측 및 우측에 설치된 제3로울러 및 제4로울러를 구비하였다. 이와 같이 구비된 본 발명에 따른 리드프레임 스트라이크 도금장치는 리드프레임과 양극 사이에 인가되는 전류밀도의 증가구간 및 감소구간이 감소되었으며, 리드프레임의 표면이 손상되지 않았다.Discloses a strike plating apparatus for plating an entire lead frame to a constant thickness. This strike plating apparatus comprises a plating vessel containing a plating solution, an anode disposed at a predetermined interval in the plating vessel and vertically disposed therein, and a roller means for transferring the lead frame between the anode and the cathode, First and second rollers provided on the upper side and the opposite side thereof, and third and fourth rollers provided on the left and right sides of the anode. In the lead frame strike plating apparatus according to the present invention thus provided, the increase and decrease intervals of the current density applied between the lead frame and the anode are reduced, and the surface of the lead frame is not damaged.

Description

리드프레임 스트라이크 도금장치Lead frame strike plating device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제3도는 본 발명에 따른 리드프레임 스트라이크 도금장치의 주요부를 도시한 단면도이다.FIG. 3 is a cross-sectional view showing a main part of a lead frame strike plating apparatus according to the present invention.

Claims (3)

음극에 연결된 리드프레임을 도금하기 위한 도금액이 담긴 도금용기와, 상기 도금용기 내부에 소정 간격 분리되어 상하로 설치된 상부양극 및 하부양극과, 상기 리드프레임 내부에 설치되어 상기 상부양극과 상기 하부양극 사이로 상기 리드프레임을 이송시키기 위한 로울러수단과, 상기 도금용기의 내부에 있는 도금액을 외부에 마련된 다른 도금액과 순환시키는 순환수단을 구비하는 리드프레임 스트라이크도금장치에 있어서, 상기 도금용기의 상부 일측 및 그 반대편에 설치된 제1로울러 및제2로울러와, 상기 상부양극 및 하부양극의 좌측 및 우측에 설치된 제2로울러 및 제4로울러를 구비하여, 상기 리드프레임이 상기 제1로울러, 상기 제3로울러, 상기 양극 사이, 상기 제2로울러 그리고 상기 제4로울러를 따라 이동되거나 그 반대방향으로 이동되는 것을 특징으로 하는 리드프레임 스트라이크 도금장치.An upper anode and a lower anode arranged vertically separated from each other at a predetermined interval in the plating vessel, and an upper anode and a lower anode provided in the plating vessel, the upper anode and the lower anode being disposed inside the lead frame, And a circulation means for circulating the plating liquid in the plating vessel to another plating liquid provided in the plating vessel. The apparatus for plating a lead frame is characterized in that one side of the upper side of the plating vessel and the other side And a second roller and a fourth roller provided on the left and right sides of the upper anode and the lower anode, wherein the lead frame is disposed between the first roller, the third roller, , The second roller and the fourth roller, or is moved in the opposite direction Wherein the lead frame strike plating apparatus is a lead frame strike plating apparatus. 제1항에 있어서, 상기 순환수단은 상기 도금용기를 포위하여 설치되는 회수용기와, 상기 도금용기에 도금액을 공급하기 위해 마련된 도금액탱크와, 상기 도금액탱크와 상기 도금용기를 연결하는 제1파이프와, 상기 제1파이프에 설치되어 상기 도금액탱크의 도금액을 상기 도금용기로 압송하는 펌프와, 상기 회수탱크에 회수된 도금액이 상기 도금액탱크로 이동하도록 설치된 제2파이프 또는 제1구멍을 구비하는 것을 특징으로 하는 리드프레임 스트라이크 도금장치.The plating apparatus according to claim 1, wherein the circulating means comprises: a recovery container installed to surround the plating container; a plating liquid tank provided to supply the plating liquid to the plating container; a first pipe connecting the plating liquid tank and the plating container; A pump installed in the first pipe for feeding the plating liquid of the plating liquid tank to the plating vessel by pressure and a second pipe or first hole provided for allowing the plating liquid recovered in the recovery tank to move to the plating liquid tank Lead frame strike plating apparatus. 제2항에 있어서, 상기 제1로울러와 제3로울러 사이 또는 제2로울러와 상기 제4로울러 사이의 도금용기에 형성된 다수개의 제2구멍을 더 구비하여, 상기 펌프에 의해 압송된 도금액이 상기 제2구멍을 통하여 상기 회수 탱크로 흐르는 것을 특징으로 하는 리드프레임 스트라이크 도금장치.The plating apparatus according to claim 2, further comprising a plurality of second holes formed in the plating vessel between the first and third rollers or between the second and fourth rollers, 2 hole to the recovery tank. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960009867A 1996-04-02 1996-04-02 Strike plating device for lead frame KR100203328B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960009867A KR100203328B1 (en) 1996-04-02 1996-04-02 Strike plating device for lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960009867A KR100203328B1 (en) 1996-04-02 1996-04-02 Strike plating device for lead frame

Publications (2)

Publication Number Publication Date
KR970070250A true KR970070250A (en) 1997-11-07
KR100203328B1 KR100203328B1 (en) 1999-06-15

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KR1019960009867A KR100203328B1 (en) 1996-04-02 1996-04-02 Strike plating device for lead frame

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020231454A1 (en) * 2019-05-14 2020-11-19 Western Technologies, Inc. Continuous galvanizing apparatus for multiple rods
US11149337B1 (en) 2017-04-18 2021-10-19 Western Technologies, Inc. Continuous galvanizing apparatus and process
US11242590B2 (en) 2017-04-18 2022-02-08 Western Technologies, Inc. Continuous galvanizing apparatus for multiple rods

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11149337B1 (en) 2017-04-18 2021-10-19 Western Technologies, Inc. Continuous galvanizing apparatus and process
US11242590B2 (en) 2017-04-18 2022-02-08 Western Technologies, Inc. Continuous galvanizing apparatus for multiple rods
WO2020231454A1 (en) * 2019-05-14 2020-11-19 Western Technologies, Inc. Continuous galvanizing apparatus for multiple rods

Also Published As

Publication number Publication date
KR100203328B1 (en) 1999-06-15

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