KR970067803A - Resin bag molding method of electronic parts - Google Patents

Resin bag molding method of electronic parts Download PDF

Info

Publication number
KR970067803A
KR970067803A KR1019970008764A KR19970008764A KR970067803A KR 970067803 A KR970067803 A KR 970067803A KR 1019970008764 A KR1019970008764 A KR 1019970008764A KR 19970008764 A KR19970008764 A KR 19970008764A KR 970067803 A KR970067803 A KR 970067803A
Authority
KR
South Korea
Prior art keywords
resin
mold
air
resin tablet
port
Prior art date
Application number
KR1019970008764A
Other languages
Korean (ko)
Other versions
KR100340979B1 (en
Inventor
미찌오 오사다
Original Assignee
반도오 가즈히꼬
토와 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 반도오 가즈히꼬, 토와 가부시끼가이샤 filed Critical 반도오 가즈히꼬
Publication of KR970067803A publication Critical patent/KR970067803A/en
Application granted granted Critical
Publication of KR100340979B1 publication Critical patent/KR100340979B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/565—Moulds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like

Abstract

전자부품의 수지봉지 성형체에 보이드(void)가 형성되는 것을 방지하는데 목적이 있다. 예비가열되어 있지 않은 상온의 수지 타블렛(tablet)(113)을 포트(108)내로 공급함과 아울러, 이것을 진공흡인공정(감압)하에서 가열팽창시킨다. 그리고, 수지가압 공정에서의 플런저(114)의 이동속도(상승동작속도)를 포트(108)내로 공급한 상온수지 타블렛(113)의 가열팽창 공정이 종료할 때까지의 사이(152)는 소정의 속도보다도 늦으 속도로 되도록 설정하고, 이 상태에서, 외기차단 공간부(140)의 공기 및 수분, 상온 수지 타블렛(113)의 가열 팽창시에 그 내부로부터 유출되고 개방된 공기 및 수분 및 상온 수지 타블렛(113)의 가열시에 발생한 가스류의 전부를 모둘드부(상하 양모울드101,102)의 외부로 효율좋고 또한 강제적으로 흡인배출할 수 있게 구성한다.An object is to prevent the formation of voids in the resin-encapsulated molded article of the electronic component. The resin tablet 113 at room temperature, which is not preheated, is supplied into the pot 108 and heated and expanded under a vacuum suction step (decompression). Then, the interval 152 until the end of the heat-expanding step of the room temperature resin tablet 113 supplied with the moving speed (rising operation speed) of the plunger 114 in the resin pressing step into the port 108 is determined. It is set so as to be later than the speed, and in this state, air and moisture in the outside air-blocking space 140 and air and moisture and room temperature resin tablets which flow out from the inside and are opened at the time of thermal expansion of the room temperature resin tablet 113 are opened. All of the gas streams generated during the heating of the 113 can be efficiently and forcibly sucked out to the outside of the module portions (both upper and lower molds 101 and 102).

Description

전자부품의 수지봉지 성형방법Resin bag molding method of electronic parts

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 전자부품의 수지봉지 성형장치에 있어서 금형의 요부를 개략적으로 나타내는 일부 절결 종단면도로서, 수지봉지 성형전의 몰드 열림상태를 나타내고 있다. 제2도는 도1에 대응하는 금형 요부의 일부 절결 종단면도로서, 상온 수지타블렛 및 전자부품을 장착한 리드 프레임의 공급상태를 나타내고 있다.FIG. 1 is a partially cut-away longitudinal sectional view schematically showing the main parts of a mold in the resin encapsulation molding apparatus for electronic parts, and shows the mold opening state before the resin encapsulation. FIG. 2 is a partially cut-away longitudinal sectional view of the mold recess corresponding to FIG. 1, showing the supply state of the lead frame in which the room temperature resin tablet and the electronic component are mounted.

Claims (4)

고정형과 상기 고정형의 대향배치된 가동형으로 이루어지는 수지성형용 몰드부 및 상기 몰드부에 마련된 적어도 수지 타블렛 공급용 포트와 수지성형용의 캐비티와 상기 포트와 상기 캐비티와의 사이를 연통접속시킨 용융수지 재료의 유로부에 잔류하는 공기·수분을 상기 몰드부의 외부로 강제적으로 흡인배출하는 진공흡인수단을 갖춘 수지성형용 금형을 사용하며, 상기 몰드부의 캐비티 내에 공급된 전자부품의 주위에 수지를 성형하는 것에 의해서 상기 전자부품을 봉지하는 방법으로서, 상기 전자부품을 상기 캐비내에 공급하는 전자부품의 공급공정과, 예비가열되어 있지 않은 상온의 수지 타블렛을 상기 포트 내로 공급하는 상온수지 타블렛의 공급 공정과, 상기 몰드부에 마련된 적어도 상기 포트와 상기 캐비티 및 상기 수지유로를 외기로부터 차단하는 외기차단 공정과, 상기 포트내에 공급된 상기 상온 수지 타블렛을 상기 포트내에서 가열팽창시키는 상온 수지 타블렛의 가열팽창공정과, 상기 외기차단 공정에 의해서 유지되는 외기차단 범위내의 공기·수분을 상기 몰드부의 외부로 강제적으로 흡인배출하는 진공흡인공정과, 상기 외기차단 공정 및 진공흡인공정을 유지하면서, 상기 고정형과 상기 가동형을 접합하여 완전히 금형 체결하는 완전금형 체결공정과, 상기 플런저를 이동시켜 상기 포트내에 공급된 상기수지 타블렛을 가압하는 수지 타블렛 가압공정과, 상기 코트내에서 가열용융화된 용융수지 재료를 상기 수지유로를 통하여 상기 캐비티내에 주입 충진시키고, 상기 캐비티내의 상기 전자부품의 주위에 수지를 성형하는 수지주입공정을 포함하며, 더욱, 상기 수지 타블렛 가압공정에 있어서 상기 플런저의 이동속도를, 상기 포트내에 공급된 상기 상온 수지타블렛의 상기 가열팽창공정이 종료할 때 까지의 사이는 소정의 속도보다도 늦은 속도가 되도록 설정함으로써, 상기 외기차단 범위내의 공기 및 수분의 흡입배출과, 상기 수지타블렛의 상기 가열팽창에 의하여 그내부로부터 유출되어 개방된 공기 및 수분과, 상기 수지 타블렛의 상기 가열시에 발생한 가스류의 전부를 상기 몰드부의 외부로 강제적으로 흡인배출하는 것을 특징으로 하는 전자부품의 수지봉지 성형방법.A resin molding mold portion comprising a fixed mold and a movable mold disposed opposite to the fixed mold, and at least a resin tablet supply port and a resin molding cavity provided in the mold portion, and a molten resin communicating between the port and the cavity. A resin molding die having a vacuum suction means for forcibly sucking and discharging air and moisture remaining in the flow path portion of the material to the outside of the mold portion is used, and the resin is molded around the electronic component supplied in the cavity of the mold portion. A method of encapsulating the electronic component, the supplying step of supplying the electronic component into the cabinet, and the supplying step of the normal temperature resin tablet supplying the resin tablet of normal temperature not preheated into the pot; At least the port, the cavity, and the resin flow path provided in the mold part include an outside air portion. The air-blocking step of blocking, the heat-expanding step of the normal-temperature resin tablet which heat-expands the normal-temperature resin tablet supplied into the port in the port, and the air and moisture within the air-blocking range maintained by the external air-blocking step A vacuum suction step of forcibly sucking and discharging to the outside of the mold part, a complete mold fastening step of joining the fixed mold and the movable mold to complete mold and maintaining the external air blocking step and vacuum suction step, and moving the plunger A resin tablet pressurizing step of pressurizing the resin tablet supplied into the port, and injecting and filling a molten resin material heated and melted in the coat into the cavity through the resin flow path, and surrounding the electronic component in the cavity. It includes a resin injection process for molding a resin, and further, the resin tablet In the process, the moving speed of the plunger is set so as to be later than a predetermined speed until the heating expansion process of the room temperature resin tablet supplied into the port is completed, so that air in the outside air blocking range and The suction discharge of water, the air and water which flowed out from the inside by the said heat expansion of the said resin tablet, and all the gas flow which generate | occur | produced at the time of the said heating of the said resin tablet are forcibly suctioned out of the said mold part. Resin bag molding method of an electronic component, characterized in that. 청구항 1에 있어서, 상기 완전 금형 체결공정전에, 상기 고정형과 상기 가동형과의 대향면 사이에, 공기·수분 및 가스류의 흡인 배출용 간격을 남기는 상기 고정형과 상기 가동형과의 중간금형 체결공정을 갖춘 것을 특징으로 하는 전자부품의 수지봉지 성형방법.The intermediate mold fastening step of the fixed mold and the movable mold according to claim 1, wherein a space for suction and discharge of air, moisture, and gas is left between the stationary mold and the movable surface before the complete mold tightening process. Resin bag molding method of an electronic component comprising a. 청구항 2에 있어서, 상기 중간금형 체결공정에 있어서, 상기 외기차단범위내의 공기·수분 및 발생 가스류를 흡인배출하는 진공흡인공정을 갖춘 것을 특징으로 하는 전자부품의 수지봉지 성형방법.3. The resin encapsulation molding method for electronic parts according to claim 2, wherein said intermediate mold fastening step includes a vacuum suction step of sucking and discharging air, moisture, and generated gas streams within the outside air blocking range. 청구항 1 내지 청구항 3항중 어느 하나의 항에 있어서, 상기 외기차단공정에 있어서, 상기 몰드부에 마련된 적어도 상기 포트와 상기 캐비티 및 상기 수지유로를 외기로부터 차단함과 아울러, 상기 외기차단 범위내의 진공도를 1토르 이하로 설정하고, 이 상태에서, 상기 포트내로 공급된 상기 상온 수지 타블렛을 가열팽창시키는 상온 수지 타블렛 가열팽창공정을 행함을 특징으로 하는 전자부품의 수지봉지 성형방법.The said external air blocking process WHEREIN: The vacuum degree in the said outside air blocking range is interrupted | blocked while the said at least a port provided in the said mold part, the said cavity, and the said resin flow path are cut off from outside air. A resin bag molding method for an electronic part, characterized in that it is set to 1 Torr or less, and in this state, a normal temperature resin tablet heating expansion step of thermally expanding the normal temperature resin tablet supplied into the pot is performed.
KR1019970008764A 1996-03-14 1997-03-14 Resin bag molding method of electronic parts KR100340979B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP96-087568 1996-03-14
JP96087568 1996-03-14
JP8087568A JPH09252017A (en) 1996-03-14 1996-03-14 Method for molding resin sealing of electronic component

Publications (2)

Publication Number Publication Date
KR970067803A true KR970067803A (en) 1997-10-13
KR100340979B1 KR100340979B1 (en) 2002-11-23

Family

ID=13918610

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019970008764A KR100340979B1 (en) 1996-03-14 1997-03-14 Resin bag molding method of electronic parts

Country Status (2)

Country Link
JP (1) JPH09252017A (en)
KR (1) KR100340979B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116277767A (en) * 2023-04-27 2023-06-23 佛山市峡谷电子科技有限公司 Plastic molding precision machining die

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2524955B2 (en) * 1993-04-22 1996-08-14 トーワ株式会社 Method and apparatus for resin sealing molding of electronic parts
JP3423766B2 (en) * 1994-03-11 2003-07-07 Ｔｏｗａ株式会社 Resin encapsulation molding method and mold device for electronic components

Also Published As

Publication number Publication date
JPH09252017A (en) 1997-09-22
KR100340979B1 (en) 2002-11-23

Similar Documents

Publication Publication Date Title
US5603879A (en) Method of molding resin to seal electronic parts using two evacuation steps
JP3282988B2 (en) Resin molding method and resin molding apparatus
KR100196575B1 (en) Resin sealing formation of electronic part and die device
KR920015493A (en) Resin bag molding method and apparatus for semiconductor device
US6491857B2 (en) Process of packaging semiconductor chip in synthetic resin produced from pressurized granular synthetic resin and molding die used therein
JPH04147814A (en) Mold for resin seal molding
JP3321023B2 (en) Resin molding method and resin molding apparatus using liquid resin
KR970067803A (en) Resin bag molding method of electronic parts
JP3110880B2 (en) Resin sealing molding method for electronic parts
JP3241553B2 (en) Resin molding device using release film
JPH0462118A (en) Method for molding of hollow resin molded item
JPH05326597A (en) Sealing and molding device for electronic component with resin, and releasing method for molded item from mold
JP3581759B2 (en) Method and apparatus for resin sealing molding of electronic parts
JPS646266Y2 (en)
JPH1158457A (en) Injection molding machine
JPS5911232A (en) Resin sealing method
JPH06132331A (en) Semiconductor sealing mold
JP2639858B2 (en) Resin sealing molding method for electronic parts
JPH08108455A (en) Mold for sealing semiconductor resin
JPH11129277A (en) Method and apparatus for injection molding
KR920002325B1 (en) Manufactured method of shoes sole
JPH09252018A (en) Method for molding resin sealing of electronic component
JPS6112313A (en) Method and apparatus for preparing resin molded product
JP2002187175A (en) Method for taking out semiconductor resin sealed molded article
JP2002113739A (en) Resin sealing apparatus and method

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130524

Year of fee payment: 12

FPAY Annual fee payment

Payment date: 20140530

Year of fee payment: 13

LAPS Lapse due to unpaid annual fee