KR970067747A - Pattern inspection method and device - Google Patents

Pattern inspection method and device Download PDF

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KR970067747A
KR970067747A KR1019970004732A KR19970004732A KR970067747A KR 970067747 A KR970067747 A KR 970067747A KR 1019970004732 A KR1019970004732 A KR 1019970004732A KR 19970004732 A KR19970004732 A KR 19970004732A KR 970067747 A KR970067747 A KR 970067747A
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South Korea
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image
window
pattern
pixel
tested
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KR100268147B1 (en
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야스시 사사
다카오 카나이
히로유키 오오니시
테쯔오 호오키
이찌로오 만다이
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이시다 아키라
다이닛뽕 스크린 세이조오 가부키가이샤
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
    • G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
    • G03F1/84—Inspecting
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95676—Masks, reticles, shadow masks

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Image Analysis (AREA)
  • Image Processing (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

적절하고 정확하게 결함검출이 가능한 패턴검사방법을 제공한다, 피검사패턴을 가지는 피검사화상(I1)과 표준화상(Io1)을 겹치게 하고, 화소마다 배타적논리합을 구하고, 이 배타적논리합을 화소치로서 가지는 상위화상(Ie1)을 얻는다. 상위화상(Ie1)상에 윈도우(W1)를 설정하고, 윈도우(W1)를 화소를 단위로 하여 상위화상(Ie1) 위를 주사시킨다, 위도우(W1)의 각 위치에서 윈도우(W1)내의 화소의 화소치의 합(윈도우측징량)을 구하고, 이 값과 미리 설정된 판정기준치와 비교한다. 윈도우(W1)의 어느 하나의 위치에서 윈도우 특징량이 판정기준치를 초과한 경우, 피검사화상(1)에는 결함이 존재하는 것으로 판정한다.A pattern inspection method capable of detecting defects properly and accurately is provided. The inspection image I1 and the normalized image I1 having the inspected pattern are superimposed, an exclusive logic sum is obtained for each pixel, and the exclusive logic sum has a pixel value. The higher picture Ie1 is obtained. The window W1 is set on the upper image Ie1, and the window W1 is scanned on the upper image Ie1 in units of pixels, and the pixels in the window W1 are positioned at the respective positions of the widow W1. The sum of the pixel values (window measurement) is obtained, and this value is compared with a predetermined reference value. When the window feature amount at any one position of the window W1 exceeds the determination reference value, it is determined that a defect exists in the inspected image 1.

Description

패턴 검사방법 및 장치Pattern inspection method and device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명의 패턴 검사방법의 설명도.1 is an explanatory diagram of a pattern inspection method of the present invention.

Claims (5)

피검사패턴을 가지는 피검사화상과, 비교기준으로 되는 표준패턴을 가지는 표준화상을 화소단위로 비교함으로써, 상기 피검사패턴의 결함을 검출하는 패턴검사방법에 있어서, (a) 상기 피검사화상과 상기 표준화상을 화소단위로 상호 비교하고, 상기 피검사화상과 상기 표준화상의 상위부분을 화소단위의 상위패턴으로 표현한 상위화상을 생성하는 상위화상 생성공정과, (b) 상기 상위화상을 소정 사이즈의 윈도우로 주사하는 윈도우 주사공정과, (c) 상기 주사의 각각의 위치에 있어서, 상기 상위패턴중 상기 윈도우내에 존재하는 부분의 화소수에 따른 윈도우 특징량을 구하는 연산공정과, (d)상기 윈도우 특징량과 소정의 판정기준치를 비교하여 상기 피검사패턴에서의 결함의 유무를 판정하는 판정공정을 가지는 것을 특징으로 하는 패턴 검사방법.In the pattern inspection method which detects the defect of the to-be-tested pattern by comparing the to-be-tested image which has a to-be-tested pattern and the standardized image which has a standard pattern used as a comparative reference on a pixel basis, (a) the said to-be-tested image and A higher image generation step of comparing the normalized images in pixel units and generating an upper image in which the inspected image and an upper portion of the normalized image are expressed in an upper pattern in pixel units; and (b) the upper image is a predetermined size. A window scanning step of scanning into a window, (c) a calculation step of obtaining a window feature amount corresponding to the number of pixels of a portion of the upper pattern existing in the window at each position of the scanning; and (d) the window And a determination step of determining the presence or absence of a defect in the inspected pattern by comparing the feature amount with a predetermined criterion value. 제1항에 있어서, 상기 연산공정이, (c1) 상기 표준패턴의 에지를 검출하는 공정과, (c2) 상기 에지에 대응하는 상기 상위화상의 화소에 대하여 다른 화소보다 큰 가중보정을 하면서 상기 화소수의 카운트를 행하여 상기 윈도우특징량을 구하는 공정을 가지고, 상기 판정기준치가 상기 윈도우의 사이즈에 대응하는 화소수의 12에 상응하는 값보다 작은 값으로 되어 있는 것을 특징으로 하는 패턴검사방법.2. The pixel as claimed in claim 1, wherein the computing step comprises: (c1) detecting an edge of the standard pattern; and (c2) performing weighted correction larger than another pixel on the pixel of the upper image corresponding to the edge. And counting the number to obtain the window feature amount, wherein the determination criterion value is smaller than the value corresponding to 12 of the number of pixels corresponding to the size of the window. 제1항에 있어서, 상기 연산공정이, (c1) 상기 표준패턴의 에지를 검출하는 공정과, (c2) 상기 에지에 대응하는 상기 상위화상의 화소에 대해 다른 화소보다 작은 가중보정을 하면서 상기 화소수의 카운트를 행하여 상기 윈도우특징량을 구하는 공정을 가지고, 상기 판정기준치가 상기 윈도우의 사이즈에 대응하는 화소수의 1/2에 상응하는 값보다 큰 값으로 되어 있는 특징으로 하는 패턴검사방법.2. The pixel as claimed in claim 1, wherein the computing step comprises: (c1) detecting an edge of the standard pattern; and (c2) performing a weighted correction smaller than other pixels with respect to the upper picture pixel corresponding to the edge. And counting the number to obtain the window feature amount, wherein the determination criterion value is larger than a value corresponding to 1/2 of the number of pixels corresponding to the size of the window. 피검사패턴을 가지는 피검사화상과, 비교기준으로 되는 표준패턴을 가지는 표준화상을 화소단위로 비교함으로써, 상기 피검사패턴의 결함을 검출하는 패턴감사장치에 있어서, (A) 상기 피검사화상을 입력하는 피검사 화상입력수단과, (B)는 상기 표준화상을 입력하는 표준화상입력수단과, (C) 상기 피검사화상과 상기 표준화상이 배타적논리합을 화소마다 구함으로써, 상기 피검사화상과 상기 표준화상의 상위부분을 화소단위의 상위패턴으로서 표현한 상위화상을 생성하는 상위화상 생성수단과, (D) 상기 상위화상을 소정 사이즈의 윈도우로 주사하는 윈도우 주사수단과, (E) 상기 주사의 각각의 위치에 있어서, 상기 상위패턴중, 상기 윈도우내에 존재하는 부분의 화소수에 상응하는 윈도우특징량을 구하는 연산수단과, (F) 상기 윈도우특징량과 소정의 판정기준치를 비교하고, 상기 피검사패턴에서 결함의 유무를 판정하는 판정수단을 가지는 것을 특징으로 하는 패턴검사장치.In the pattern inspection apparatus which detects the defect of the to-be-tested pattern by comparing the to-be-tested image which has a to-be-tested pattern and the standardized image which has a standard pattern used as a comparative reference on a pixel basis, (A) The to-be-tested image is The inspected image input means for inputting, (B) the normalized image input means for inputting the normalized image, (C) the inspected image and the normalized image by obtaining an exclusive logical sum of the inspected image and the normalized image for each pixel; Upper image generating means for generating an upper image in which upper portions of the normalized image are expressed as upper patterns in pixel units, (D) window scanning means for scanning the upper image into a window having a predetermined size, and (E) each of the scanning Calculation means for calculating a window feature amount corresponding to the number of pixels of the portion of the upper pattern in the window at the position; (F) the window feature amount and the predetermined And a judging means for comparing the judging reference values and determining the presence or absence of a defect in the inspected pattern. 제4항에 있어서, 상기 연산수단이 (E1) 상기 배타적 논리함을 구하는 각 화소가 상기 표준패턴의 에지에 대응하는 화소인지 아닌지의 에지정보를 생성하는 에지정보 생성수단과, (E2) 상기 에지정보에 의거하여 상기 배타적논리함의 값을 보정하는 보정수단을 가지는 것을 특징으로 하는 패턴검사장치.5. An edge information generating means according to claim 4, wherein said computing means (E1) generates edge information of whether or not each pixel for which said exclusive logic is a pixel corresponding to an edge of said standard pattern, and (E2) said edge And a correction means for correcting the value of the exclusive logic based on the information.
KR1019970004732A 1996-03-04 1997-02-17 Pattern inspection method and device Expired - Fee Related KR100268147B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP96-46151 1996-03-04
JP8046151A JPH09236416A (en) 1996-03-04 1996-03-04 Method and device for inspecting pattern

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KR970067747A true KR970067747A (en) 1997-10-13
KR100268147B1 KR100268147B1 (en) 2000-11-01

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100755372B1 (en) 2006-08-25 2007-09-04 삼성전자주식회사 Wafer Inspection Method
CN116203036A (en) * 2021-12-01 2023-06-02 先进半导体材料(深圳)有限公司 Flaw detection method of lead frame and detection template based on standard lead frame
CN114152627B (en) * 2022-02-09 2022-05-03 季华实验室 Chip circuit defect detection method and device, electronic equipment and storage medium

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04212432A (en) * 1990-08-23 1992-08-04 Sharp Corp Wiring pattern inspection equipment
JP2533245B2 (en) * 1991-03-28 1996-09-11 株式会社東芝 Pattern defect inspection system

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