KR970065635A - Epoxy resin composition for automobile ignition coil - Google Patents

Epoxy resin composition for automobile ignition coil Download PDF

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Publication number
KR970065635A
KR970065635A KR1019960006836A KR19960006836A KR970065635A KR 970065635 A KR970065635 A KR 970065635A KR 1019960006836 A KR1019960006836 A KR 1019960006836A KR 19960006836 A KR19960006836 A KR 19960006836A KR 970065635 A KR970065635 A KR 970065635A
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South Korea
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resin composition
weight
carbon
epoxy resin
curing agent
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KR1019960006836A
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Korean (ko)
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KR100373980B1 (en
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강면의
김영준
김재신
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성재갑
주식회사 Lg 화학
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C08K9/06—Ingredients treated with organic substances with silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/003—Additives being defined by their diameter
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/004—Additives being defined by their length
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

본 발명은 자동차 이크니션 코일용 2액형 에폭시수지 조성물에 관한 것으로 환상지한식 에폭시수지와 디글리시딜에테르비스페놀 에폭시를 고온에서 예비반응시킨 수지 조성물에 실란 처리된 규회석 및 유리 단섬유를 함유하는 충진제를 전체 주제 수지 조성물의 45 내지 80중량%가 되도록 혼합한 것을 주제 수지 조성물 하고, 지환족 또는 지방족 산 무수물을, 분자내에 1개 이상의 카복실 기와 알렌 기를 포함하는 탄소원자 수 4 내지 32개인 폴리에스테르지방산으로 변성시킨 경화제를 상기 주제 수지 조성물의 100중량부를 기준으로 하여 20 내지 60 중량부로 혼합하는 것을 특징으로 하는 2액형 수지 조성물을 사용함으로써 함침성, 열충격 시험, 내구성 시험에서 더욱 우수한 물리적 특성을 나타낸다.The present invention relates to a two-component epoxy resin composition for automobile ignition coils, and more particularly, to a resin composition prepared by preliminarily reacting a cyclic epoxy resin and a diglycidyl ether bisphenol epoxy at a high temperature with a filler containing silane- 45 to 80% by weight of the total resin composition is a resin composition comprising an alicyclic or aliphatic acid anhydride as a polyester fatty acid having 4 to 32 carbon atoms and containing at least one carboxyl group and an allene group in the molecule And the modified curing agent is mixed in an amount of 20 to 60 parts by weight based on 100 parts by weight of the main resin composition. By using the two-component type resin composition, more excellent physical properties are exhibited in the impregnation property, thermal shock test and durability test.

Description

자동차 이그니션 코일용 에폭시수지 조성물Epoxy resin composition for automobile ignition coil

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

Claims (6)

A) 환상지환식 에폭시수지와 디글리시딜에테르비스페놀 에폭시를 고온에서 예비반응시킨 수지 조성물에 실란 처리된 규회석 및 유리 단섬유를 함유하는 충진제를 주제 수지 조성물 전체의 45 내지 80중량%가 되도록 혼합한 것을 주제 수지 조성물로 하고, B) 지환족 또는 지방족 산 무수물을, 분자내에 1개 이상의 카복실기와 알켄기를 포함하는 탄소원자 수 4 내지 32개인 폴리에스테르지방산으로 변성시킨 경화제를 상기 주제 수지 조성물 100중량부를 기준으로 하여 20 내지 60중량부로 혼합한 2액형 수지 조성물.A) A filler containing silane-treated wollastonite and short staple fibers is preliminarily reacted with a cyclic alicyclic epoxy resin and a diglycidyl ether bisphenol epoxy at a high temperature to prepare a filler containing 45 to 80% by weight of the whole resin composition A curing agent obtained by modifying an alicyclic or aliphatic acid anhydride with a polyester fatty acid having 4 to 32 carbon atoms and containing at least one carboxyl group and an alkenyl group in the molecule, And 20 to 60 parts by weight based on 100 parts by weight of the resin. 제1항에 있어서, A)의 예비 혼합 교반시킨 수지 조성물이 환상지환족 에폭시수지 10 내지 45중량%와 상기 디글리시딜에케르비스페놀 55 내지 90중량%로 구성된 것을 특징으로 하는 수지 조성물.The resin composition according to claim 1, wherein the resin composition to be preliminarily mixed and stirred is 10 to 45% by weight of a cyclic alicyclic epoxy resin and 55 to 90% by weight of diglycidyl etherbisphenol. 제1항에 있어서, 상기 규회석이 평균 입경 7 내지 35㎛, 최대 입경 120㎛ 이하이며, 상기 주제 수지 조성물의 25 내지 75중량%로 포함되고, 유리 단섬유가 길이 0.1 내지 0.5㎜, 직경이 0.001 내지 0.1㎜이되, 상기 직경에 대한 길이의 비가 100 이상이고, 표면적이 5 내지 12m2/g이며, 상기 주제 수지 조성물의 5 내지 20중량%로 포함되는 것을 특징으로 하는 수지 조성물.The glass fiber according to claim 1, wherein the wollastonite has an average particle diameter of 7 to 35 탆 and a maximum particle diameter of 120 탆 or less and is contained in an amount of 25 to 75% by weight of the resin composition of the present invention, the glass staple fiber has a length of 0.1 to 0.5 mm, To 0.1 mm, wherein the ratio of the length to the diameter is 100 or more, the surface area is 5 to 12 m 2 / g, and the resin composition contains 5 to 20% by weight of the resin composition. 제1항에 있어서, 상기 규회석 및 유기 단섬유가 알파글리시톡시프로필트리메톡시실란으로 처리된 것을 특징으로 하는 수지 조성물.The resin composition according to claim 1, wherein the wollastonite and the organic staple fiber are treated with alpha-glycidoxypropyltrimethoxysilane. 제1항에 있어서, B)의 변성된 경화제가 하기의 구조를 갖는 것을 특징으로 하는 수지 조성물 :The resin composition according to claim 1, wherein the modified curing agent of (B) has the following structure: 상기 식에서, R1알킬 기(탄소 1 내지 12개)이고, R2저급 알킬 기(탄소 1 내지 5개), 또는 수소이고, X는 알켄 기(탄소 1 내지 4개), 아릴 기(탄소 6 내지 12개), 폴리사이클로알칸(탄소 1 내지 10개) 또는 알킬로 치환된 아릴(탄소 6 내지 15개)이다.And wherein R, R 1 alkyl groups (carbon 1 to 12), R 2 a lower alkyl group and (carbon 1 to 5), or hydrogen, X is alkenyl group (carbon 1 to 4), an aryl group (carbon 6 To 12), polycycloalkane (1 to 10 carbons) or aryl (6 to 15 carbons) substituted with alkyl. 제1항 또는 제3항에 있어서, 상기 변성된 경화제가 65 내지 95중량%의 산 무수물을 0.01 내지 3중량%의 경화 촉진제 존재하에 2 내지 32중량%의 폴리에스테르지방산에 의해 변성되는 수지 조성물.4. The resin composition according to claim 1 or 3, wherein the modified curing agent is modified with 2 to 32% by weight of polyester fatty acid in the presence of from 0.01 to 3% by weight of an acid anhydride of 65 to 95% by weight of a curing accelerator. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960006836A 1996-03-14 1996-03-14 Expoxy resin composition of ignition coil for motor vehicles KR100373980B1 (en)

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KR1019960006836A KR100373980B1 (en) 1996-03-14 1996-03-14 Expoxy resin composition of ignition coil for motor vehicles

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Application Number Priority Date Filing Date Title
KR1019960006836A KR100373980B1 (en) 1996-03-14 1996-03-14 Expoxy resin composition of ignition coil for motor vehicles

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KR970065635A true KR970065635A (en) 1997-10-13
KR100373980B1 KR100373980B1 (en) 2003-05-12

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Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0455463A (en) * 1990-06-26 1992-02-24 Meidensha Corp Production of epoxy resin composition
KR930012974A (en) * 1991-12-31 1993-07-21 공정곤 Epoxy resin composition
JPH0680803A (en) * 1992-09-03 1994-03-22 Matsushita Electric Works Ltd Resin-impregnated base material and electrical laminate
KR0124545B1 (en) * 1993-12-01 1997-12-01 박홍기 Moulding epoxy resin composition
KR0184985B1 (en) * 1995-06-21 1999-05-01 김광호 Method expressing the rest of battery by digital in camcoder
KR0164398B1 (en) * 1995-07-18 1999-02-18 김광호 High speed spare decoder for semiconductor memory

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