KR970063704A - How to attach the film to the lead frame - Google Patents

How to attach the film to the lead frame Download PDF

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Publication number
KR970063704A
KR970063704A KR1019960005088A KR19960005088A KR970063704A KR 970063704 A KR970063704 A KR 970063704A KR 1019960005088 A KR1019960005088 A KR 1019960005088A KR 19960005088 A KR19960005088 A KR 19960005088A KR 970063704 A KR970063704 A KR 970063704A
Authority
KR
South Korea
Prior art keywords
film
lead frame
punch
insulating film
degrees
Prior art date
Application number
KR1019960005088A
Other languages
Korean (ko)
Other versions
KR100254257B1 (en
Inventor
서만철
Original Assignee
이대원
삼성항공산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이대원, 삼성항공산업 주식회사 filed Critical 이대원
Priority to KR1019960005088A priority Critical patent/KR100254257B1/en
Publication of KR970063704A publication Critical patent/KR970063704A/en
Application granted granted Critical
Publication of KR100254257B1 publication Critical patent/KR100254257B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Die Bonding (AREA)

Abstract

본 발명은 리드 프레임의 필름 부착 방법에 관한 것이다.The present invention relates to a method of attaching a film of a lead frame.

필름 부착 방법은 절연 필름을 120도 내지 380도의 범위 내에서 가열 건조 단계와, 전열 필름을 타발하는 펀치와 이 펀치에 비해 250도 내지 450도 높은 온도를 유지하는 히터 블록으로 상기 절연 필름과 리드 프레임을 가압착하는 단계 및 상기 펀치와 상기 펀치에 비해 350도 내지 450도 높은 온도를 유지하는 히터 블록으로 상기 절연 필름과 리드 프레임을 본압착하는 단계를 포함하여 고품질의 필름 부착 리드 프레임을 제조할 수 있다.The method for attaching a film includes heating and drying the insulating film within a range of 120 to 380 degrees, a punch for punching a heat transfer film, and a heater block for maintaining a temperature of 250 to 450 degrees higher than the punch, And pressing the insulating film and the lead frame with the heater block maintaining a temperature of 350 to 450 DEG higher than that of the punch and the punch, thereby manufacturing a lead frame with high quality film have.

Description

리드 프레임을 필름 부착 방법How to attach the lead frame to the film

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제1도는 테이핑 기계의 개략적 블록도이다.Figure 1 is a schematic block diagram of a taping machine.

Claims (1)

절연 필름을 120도 내지 380도의 범위 내에서 가열 건조 단계와, 절연 필름을 타발하는 펀치와 이 펀치에 비해 250도 내지 450도 높은 온도를 유지하는 히터 블록으로 상기 절연 필름과 리드 프레임을 가압착하는 단계 및 상기 펀치의 상기 펀치에 비해 350도 내지 450도 높은 온도를 유지하는 히터 블록으로 상기 절연 필름과 리드 프레임을 본압착하는 단계를 포함하는 것을 특징으로 하는 리드 프레임의 필름 부착 방법.Heating and drying the insulating film within a range of 120 to 380 degrees, punching the insulating film, and pressing the insulating film and the lead frame with a heater block maintaining a temperature of 250 to 450 degrees relative to the punch And a step of compressively bonding the lead frame and the insulating film to a heater block which maintains a temperature of 350 to 450 degrees higher than that of the punch of the punch. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960005088A 1996-02-28 1996-02-28 Method film adhesive of lead frame KR100254257B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960005088A KR100254257B1 (en) 1996-02-28 1996-02-28 Method film adhesive of lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960005088A KR100254257B1 (en) 1996-02-28 1996-02-28 Method film adhesive of lead frame

Publications (2)

Publication Number Publication Date
KR970063704A true KR970063704A (en) 1997-09-12
KR100254257B1 KR100254257B1 (en) 2000-05-01

Family

ID=19452073

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960005088A KR100254257B1 (en) 1996-02-28 1996-02-28 Method film adhesive of lead frame

Country Status (1)

Country Link
KR (1) KR100254257B1 (en)

Also Published As

Publication number Publication date
KR100254257B1 (en) 2000-05-01

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