KR970063442A - Cooling water volume control device of semiconductor equipment - Google Patents

Cooling water volume control device of semiconductor equipment Download PDF

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Publication number
KR970063442A
KR970063442A KR1019960005094A KR19960005094A KR970063442A KR 970063442 A KR970063442 A KR 970063442A KR 1019960005094 A KR1019960005094 A KR 1019960005094A KR 19960005094 A KR19960005094 A KR 19960005094A KR 970063442 A KR970063442 A KR 970063442A
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KR
South Korea
Prior art keywords
cooling water
reservoir
main pipe
pump
processing unit
Prior art date
Application number
KR1019960005094A
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Korean (ko)
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KR0183825B1 (en
Inventor
박철규
Original Assignee
김광호
삼성전자 주식회사
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019960005094A priority Critical patent/KR0183825B1/en
Publication of KR970063442A publication Critical patent/KR970063442A/en
Application granted granted Critical
Publication of KR0183825B1 publication Critical patent/KR0183825B1/en

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67017Apparatus for fluid treatment
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67098Apparatus for thermal treatment
    • H01L21/67109Apparatus for thermal treatment mainly by convection
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring

Abstract

반도체장비의 냉각수 저장량 제어장치가 개시되어 있다. 본 발명은 공정을 제어하는 중앙처리장치, 고진공상태에서 공정이 진행되는 챔버, 상기 챔버의 온도를 조절하기 위한 냉각수를 저장시키는 레저브와 및 상기 레저브와 내에 저장된 냉각수의 양을 감지하여 상기 중앙처리장치로 신호를 보내는 레저브와 센서를 구비하는 레저브와부, 한 쪽 끝이 상기 레저브와부에 연결된 주 배관, 상기 주 배관의 다른 한쪽 끝과 연결되고 냉각수를 저장시키는 탱크, 상기 탱크에 저장된 냉각수의 양을 감지하여 상기 중앙처리장치로 신호를 보내는 탱크 센서, 상기 탱크와 인접한 부분의 주 배관에 개재되어 상기 탱크 내의 냉각수를 상기 레저브와 내부로 주입시키는 기능을 가지면서 상기 중앙처리장치에 의해 동작이 제어되는 펌프, 및 상기 펌프와 상기 레저브와부 사이의 주 배관에 개재되고 상기 중앙처리장치에 의해 개폐 상태가 제어되는 자동 밸브를 구비하는 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치를 제공한다. 본 발명에 의하면, 작업자의 작업능률 및 생산성을 크게 개선시킬 수 있다.A cooling water storage amount control device for semiconductor equipment is disclosed. The present invention relates to an apparatus and a method for controlling a temperature of a chamber, including a central processing unit for controlling a process, a chamber in which a process proceeds in a high vacuum state, a reservoir for storing cooling water for controlling the temperature of the chamber, A main pipe connected at one end to the reservoir part, a tank connected to the other end of the main pipe for storing cooling water, a reservoir for storing the amount of cooling water stored in the tank, And a control unit for controlling the operation of the central processing unit by the central processing unit while having a function of injecting cooling water in the tank into the inside of the reservoir interposed in the main pipe adjacent to the tank, And a pump connected to the main piping between the pump and the reservoir part, To provide a cooling water storage amount control apparatus for a semiconductor device characterized in that the opened and closed states is provided with an automatic valve controlled. According to the present invention, the work efficiency and productivity of the operator can be greatly improved.

Description

반도체장비의 냉각수 저장량 제어장치Cooling water volume control device of semiconductor equipment

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is a trivial issue, I did not include the contents of the text.

제2도는 본 발명에 의한 냉각수 저장량 제어장치를 설명하기 위한 개략도이다.FIG. 2 is a schematic view for explaining a cooling water storage amount control apparatus according to the present invention; FIG.

Claims (7)

공정을 제어하는 중앙처리장치; 고진공 상태에서 공정이 진행되는 챔버; 상기 챔버의 온도를 조절하기 위한 냉각수를 저장시키는 레저브와 및 상기 레저브와 내에 저장된 냉각수의 양을 감지하여 상기 중앙처리장치로 신호를 보내는 레저브와 센서를 구비하는 레저브와부; 한 쪽 끝이 상기 레저브와부에 연결된 주 배관; 상기 주 배관의 다른 한쪽 끝과 연결되고 냉각수를 저장시키는 탱크; 상기 탱크에 저장된 냉각수의 양을 감지하여 상기 중앙처리장치로 신호를 보내는 탱크 센서; 상기 탱크와 인접한 부분의 주 배관에 개재되어 상기 탱크 내의 냉각수를 상기 레저브와 내부로 주입시키는 기능을 가지면서 상기 중앙처리장치에 의해 동작이 제어되는 펌프; 및 상기 펌프와 상기 레저브와부 사이의 주 배관에 개재되고 상기 중앙처리장치에 의해 개폐 상태가 제어되는 자동 밸브를 구비하는 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치.A central processing unit for controlling the process; A chamber in which the process proceeds in a high vacuum state; A reservoir for storing the cooling water for controlling the temperature of the chamber, and a reservoir and a sensor for sensing an amount of the cooling water stored in the reservoir and sending a signal to the central processing unit; A main pipe having one end connected to the reservoir part; A tank connected to the other end of the main pipe for storing cooling water; A tank sensor sensing the amount of cooling water stored in the tank and sending a signal to the central processing unit; A pump interposed in a main pipe adjacent to the tank and having a function of injecting cooling water in the tank into the reservoir, the operation being controlled by the central processing unit; And an automatic valve interposed in the main piping between the pump and the reservoir part and controlled by the central processing unit to open and close. 제1항에 있어서, 상기 자동 밸브와 상기 펌프 사이의 주 배관에 개재되어 냉각수의 역류를 방지하는 기능을 갖는 역류방지 밸브를 더 구비하는 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치.The cooling water storage amount control apparatus of claim 1, further comprising a backflow prevention valve interposed in the main pipe between the automatic valve and the pump and having a function of preventing reverse flow of cooling water. 제2항에 있어서, 상기 역류방지 밸브와 상기 펌프 사이의 주 배관에 개재되어 상기 주 배관을 통하여 흐르는 냉각수에 포함된 이물질을 차단시키는 필터를 더 구비하는 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치.The cooling water amount control apparatus according to claim 2, further comprising a filter interposed in the main pipe between the check valve and the pump to block foreign substances contained in the cooling water flowing through the main pipe . 제3항에 있어서, 상기 필터와 상기 역류방지 밸브 사이의 주 배관에 설치되어 상기 필터를 통과한 냉각수의 압력을 측정하는 출력 압력 게이지를 더 구비하는 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치.The apparatus according to claim 3, further comprising an output pressure gauge installed in a main pipe between the filter and the check valve to measure the pressure of the cooling water passing through the filter. 제3항 또는 제4항에 있어서, 상기 필터와 상기 펌프 사이의 주 배관에 설치되어 상기 펌프로부터 배출된 냉각수의 압력을 측정하는 입력 압력 게이지를 더 구비하는 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치.The apparatus according to claim 3 or 4, further comprising an input pressure gauge installed in a main piping between the filter and the pump for measuring a pressure of the cooling water discharged from the pump. Device. 제1항에 있어서, 상기 자동 밸브와 상기 펌프 사이의 주 배관으로부터 분기된 적어도 하나 이상의 부배관; 상기 각각의 부 배관의 끝 부분과 연결된 또 다른 레저브와부; 및 상기 또 다른 레저브와부와 인접한 부 배관에 개재되어 상기 중앙처리장치에 의해 개폐 상태가 제어되는 또 다른 자동 밸브를 더 구비하는 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치.The automatic transmission according to claim 1, further comprising: at least one auxiliary pipe branched from a main pipe between the automatic valve and the pump; Another reservoir portion connected to an end of each of the sub-pipes; And another automatic valve interposed in a sub pipe adjacent to the other reservoir part and controlled to be opened or closed by the central processing unit. 제1항에 있어서, 상기 자동 밸브는 에어밸브 및 솔레노이드 밸브중 선택된 어느 하나인 것을 특징으로 하는 반도체장비의 냉각수 저장량 제어장치.The apparatus of claim 1, wherein the automatic valve is any one of an air valve and a solenoid valve. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: It is disclosed by the contents of the first application.
KR1019960005094A 1996-02-28 1996-02-28 Control apparatus of cooling water of semiconductor equipment KR0183825B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019960005094A KR0183825B1 (en) 1996-02-28 1996-02-28 Control apparatus of cooling water of semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019960005094A KR0183825B1 (en) 1996-02-28 1996-02-28 Control apparatus of cooling water of semiconductor equipment

Publications (2)

Publication Number Publication Date
KR970063442A true KR970063442A (en) 1997-09-12
KR0183825B1 KR0183825B1 (en) 1999-04-15

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Publication number Priority date Publication date Assignee Title
KR100891838B1 (en) * 2002-09-12 2009-04-07 주식회사 포스코 Apparatus for controlling flow rate of cooling water in drive unit of blast furnace
KR100850175B1 (en) * 2003-12-31 2008-08-04 동부일렉트로닉스 주식회사 System for automatic supply of cooling water

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