KR970060184U - 반도체 패키지의 열 방출 장치 - Google Patents
반도체 패키지의 열 방출 장치Info
- Publication number
- KR970060184U KR970060184U KR2019960007218U KR19960007218U KR970060184U KR 970060184 U KR970060184 U KR 970060184U KR 2019960007218 U KR2019960007218 U KR 2019960007218U KR 19960007218 U KR19960007218 U KR 19960007218U KR 970060184 U KR970060184 U KR 970060184U
- Authority
- KR
- South Korea
- Prior art keywords
- heat dissipation
- semiconductor package
- dissipation device
- package
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3733—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh, porous structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960007218U KR0137944Y1 (ko) | 1996-04-04 | 1996-04-04 | 반도체 패키지의 열 방출 장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019960007218U KR0137944Y1 (ko) | 1996-04-04 | 1996-04-04 | 반도체 패키지의 열 방출 장치 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970060184U true KR970060184U (ko) | 1997-11-10 |
| KR0137944Y1 KR0137944Y1 (ko) | 1999-05-15 |
Family
ID=19453316
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019960007218U KR0137944Y1 (ko) | 1996-04-04 | 1996-04-04 | 반도체 패키지의 열 방출 장치 |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0137944Y1 (ko) |
-
1996
- 1996-04-04 KR KR2019960007218U patent/KR0137944Y1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR0137944Y1 (ko) | 1999-05-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20051021 Year of fee payment: 8 |
|
| LAPS | Lapse due to unpaid annual fee |