KR970053114A - How to prevent corrosion of metal wiring in semiconductor devices - Google Patents
How to prevent corrosion of metal wiring in semiconductor devices Download PDFInfo
- Publication number
- KR970053114A KR970053114A KR1019950050980A KR19950050980A KR970053114A KR 970053114 A KR970053114 A KR 970053114A KR 1019950050980 A KR1019950050980 A KR 1019950050980A KR 19950050980 A KR19950050980 A KR 19950050980A KR 970053114 A KR970053114 A KR 970053114A
- Authority
- KR
- South Korea
- Prior art keywords
- pure water
- wafer
- cleaning
- ammonia gas
- weakly alkaline
- Prior art date
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- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명은 금속식각 공정 후 순수를 사용하여 세정하는 공정에서 순수에 소량의 암모니아 가스를 용해시켜 순수를 약알카리성으로 변하게 하여 이 용액이 기판 위에 잔존하는 염소이온과 중화반응을 일으키면서 세정을 염소이온을 완벽하게 제거하고, 또한 순수에 암모니아 가스를 용해시켜 주므로서 순수의 비저항값을 저하시켜 국부전지 효과에 의해 금속배선층이 떨어져 나가는 것을 방지할 수 있는 반도체 소자의 금속배선 부식 방지 방법을 제공하는데 그 목적이 있다.The present invention dissolves a small amount of ammonia gas in the pure water in the process of cleaning using pure water after the metal etching process to change the pure water into weak alkali, causing the solution to neutralize the chlorine ions remaining on the substrate while washing the chlorine ion To remove metals completely and to dissolve ammonia gas in pure water, thereby lowering the resistivity of pure water, thereby preventing metal wiring layers from falling off due to local battery effects. There is a purpose.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950050980A KR0171735B1 (en) | 1995-12-16 | 1995-12-16 | Method of preventing metal wire of semiconductor device from etching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950050980A KR0171735B1 (en) | 1995-12-16 | 1995-12-16 | Method of preventing metal wire of semiconductor device from etching |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970053114A true KR970053114A (en) | 1997-07-29 |
KR0171735B1 KR0171735B1 (en) | 1999-03-30 |
Family
ID=19440767
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950050980A KR0171735B1 (en) | 1995-12-16 | 1995-12-16 | Method of preventing metal wire of semiconductor device from etching |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0171735B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100461743B1 (en) * | 2001-05-14 | 2004-12-14 | 샤프 가부시키가이샤 | Method For Plasma Etching Of Ir-Ta-O Electrode And For Post-Etch Cleaning |
-
1995
- 1995-12-16 KR KR1019950050980A patent/KR0171735B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100461743B1 (en) * | 2001-05-14 | 2004-12-14 | 샤프 가부시키가이샤 | Method For Plasma Etching Of Ir-Ta-O Electrode And For Post-Etch Cleaning |
Also Published As
Publication number | Publication date |
---|---|
KR0171735B1 (en) | 1999-03-30 |
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