KR970046918U - Multifaceted package - Google Patents
Multifaceted packageInfo
- Publication number
- KR970046918U KR970046918U KR2019950043144U KR19950043144U KR970046918U KR 970046918 U KR970046918 U KR 970046918U KR 2019950043144 U KR2019950043144 U KR 2019950043144U KR 19950043144 U KR19950043144 U KR 19950043144U KR 970046918 U KR970046918 U KR 970046918U
- Authority
- KR
- South Korea
- Prior art keywords
- multifaceted
- package
- multifaceted package
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950043144U KR0134816Y1 (en) | 1995-12-18 | 1995-12-18 | Multiside package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950043144U KR0134816Y1 (en) | 1995-12-18 | 1995-12-18 | Multiside package |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970046918U true KR970046918U (en) | 1997-07-31 |
KR0134816Y1 KR0134816Y1 (en) | 1999-01-15 |
Family
ID=19435338
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950043144U KR0134816Y1 (en) | 1995-12-18 | 1995-12-18 | Multiside package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0134816Y1 (en) |
-
1995
- 1995-12-18 KR KR2019950043144U patent/KR0134816Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0134816Y1 (en) | 1999-01-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE69633971D1 (en) | packaging | |
BR9611216A (en) | Structured packaging | |
FI951637A (en) | Packaging | |
KR970017821U (en) | Laita packaging case | |
KR970046918U (en) | Multifaceted package | |
DE69612015D1 (en) | PACKAGING | |
KR970009607U (en) | Laita packaging case | |
KR970046947U (en) | Multichip Package | |
KR960038755U (en) | Semiconductor package | |
FI98805B (en) | Packaging | |
KR970046900U (en) | Hi-pin package | |
KR970046923U (en) | Tape-on-chip package | |
KR970046892U (en) | Lead-on-chip package | |
KR970019769U (en) | Semiconductor package | |
FI961854A (en) | Packaging | |
FI952236A0 (en) | Packaging | |
UA1258S (en) | CHARUNKOVA PACKAGING | |
KR960035619U (en) | SOP package | |
KR970019777U (en) | Leadframe | |
KR970047012U (en) | Leadframe | |
KR970047013U (en) | Leadframe | |
KR970046972U (en) | Leadframe | |
KR970047000U (en) | Leadframe | |
KR960038753U (en) | Semiconductor package | |
KR970015329U (en) | Semiconductor package |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20050922 Year of fee payment: 8 |
|
LAPS | Lapse due to unpaid annual fee |