KR970046908U - Semiconductor package with thermal plastic pattern tape - Google Patents

Semiconductor package with thermal plastic pattern tape

Info

Publication number
KR970046908U
KR970046908U KR2019950039843U KR19950039843U KR970046908U KR 970046908 U KR970046908 U KR 970046908U KR 2019950039843 U KR2019950039843 U KR 2019950039843U KR 19950039843 U KR19950039843 U KR 19950039843U KR 970046908 U KR970046908 U KR 970046908U
Authority
KR
South Korea
Prior art keywords
semiconductor package
thermal plastic
plastic pattern
pattern tape
tape
Prior art date
Application number
KR2019950039843U
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019950039843U priority Critical patent/KR970046908U/en
Publication of KR970046908U publication Critical patent/KR970046908U/en

Links

KR2019950039843U 1995-12-11 1995-12-11 Semiconductor package with thermal plastic pattern tape KR970046908U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950039843U KR970046908U (en) 1995-12-11 1995-12-11 Semiconductor package with thermal plastic pattern tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950039843U KR970046908U (en) 1995-12-11 1995-12-11 Semiconductor package with thermal plastic pattern tape

Publications (1)

Publication Number Publication Date
KR970046908U true KR970046908U (en) 1997-07-31

Family

ID=60877783

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950039843U KR970046908U (en) 1995-12-11 1995-12-11 Semiconductor package with thermal plastic pattern tape

Country Status (1)

Country Link
KR (1) KR970046908U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100299305B1 (en) * 1998-06-05 2001-11-30 노길섭 Tape for semiconductor package and manufacturing method thereof and package fabrication method using tape

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100299305B1 (en) * 1998-06-05 2001-11-30 노길섭 Tape for semiconductor package and manufacturing method thereof and package fabrication method using tape

Similar Documents

Publication Publication Date Title
DE69637720D1 (en) Tape carrier package
DE69619106D1 (en) HOMOGENEOUS COOLING SUBSTRATE
KR970046908U (en) Semiconductor package with thermal plastic pattern tape
DE69432168D1 (en) Semiconductor packages
KR960038755U (en) Semiconductor package
KR970046961U (en) Heat-resistant plastic semiconductor package
KR950004824U (en) Plastic semiconductor package
KR970019769U (en) Semiconductor package
KR970046772U (en) Semiconductor package
KR970046932U (en) Semiconductor Package
KR930024368U (en) Plastic semiconductor package
KR970011219U (en) Multi-chip package with patterned tape
KR970003274U (en) Semiconductor Package with Connection Holes
KR970046968U (en) Semiconductor package with grooves
KR970046929U (en) Chip On Tape Semiconductor Package
KR960025522U (en) Thin Semiconductor Package
KR950021465U (en) Molding free semiconductor package
KR970015329U (en) Semiconductor package
KR970046891U (en) Semiconductor package
KR970003282U (en) Semiconductor package
KR970003287U (en) Semiconductor package
KR970003288U (en) Semiconductor package
KR970007239U (en) Semiconductor package
KR960038754U (en) Semiconductor package
KR970019768U (en) Semiconductor package

Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination