KR970046882U - Mold removal device for semiconductor solder equipment - Google Patents

Mold removal device for semiconductor solder equipment

Info

Publication number
KR970046882U
KR970046882U KR2019950038872U KR19950038872U KR970046882U KR 970046882 U KR970046882 U KR 970046882U KR 2019950038872 U KR2019950038872 U KR 2019950038872U KR 19950038872 U KR19950038872 U KR 19950038872U KR 970046882 U KR970046882 U KR 970046882U
Authority
KR
South Korea
Prior art keywords
removal device
mold removal
solder equipment
semiconductor solder
semiconductor
Prior art date
Application number
KR2019950038872U
Other languages
Korean (ko)
Other versions
KR0132419Y1 (en
Inventor
윤현준
Original Assignee
엘지반도체주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘지반도체주식회사 filed Critical 엘지반도체주식회사
Priority to KR2019950038872U priority Critical patent/KR0132419Y1/en
Publication of KR970046882U publication Critical patent/KR970046882U/en
Application granted granted Critical
Publication of KR0132419Y1 publication Critical patent/KR0132419Y1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
KR2019950038872U 1995-12-07 1995-12-07 Mold flash clearing apparatus of semiconductor soldering machine KR0132419Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950038872U KR0132419Y1 (en) 1995-12-07 1995-12-07 Mold flash clearing apparatus of semiconductor soldering machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950038872U KR0132419Y1 (en) 1995-12-07 1995-12-07 Mold flash clearing apparatus of semiconductor soldering machine

Publications (2)

Publication Number Publication Date
KR970046882U true KR970046882U (en) 1997-07-31
KR0132419Y1 KR0132419Y1 (en) 1998-12-01

Family

ID=19432442

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950038872U KR0132419Y1 (en) 1995-12-07 1995-12-07 Mold flash clearing apparatus of semiconductor soldering machine

Country Status (1)

Country Link
KR (1) KR0132419Y1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453692B1 (en) * 1997-12-30 2005-02-24 앰코 테크놀로지 코리아 주식회사 Apparatus for removing flash of leadframe for semiconductor package to remove flash of material passing through guide rail

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100453692B1 (en) * 1997-12-30 2005-02-24 앰코 테크놀로지 코리아 주식회사 Apparatus for removing flash of leadframe for semiconductor package to remove flash of material passing through guide rail

Also Published As

Publication number Publication date
KR0132419Y1 (en) 1998-12-01

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EXPY Expiration of term