KR970046882U - Mold removal device for semiconductor solder equipment - Google Patents
Mold removal device for semiconductor solder equipmentInfo
- Publication number
- KR970046882U KR970046882U KR2019950038872U KR19950038872U KR970046882U KR 970046882 U KR970046882 U KR 970046882U KR 2019950038872 U KR2019950038872 U KR 2019950038872U KR 19950038872 U KR19950038872 U KR 19950038872U KR 970046882 U KR970046882 U KR 970046882U
- Authority
- KR
- South Korea
- Prior art keywords
- removal device
- mold removal
- solder equipment
- semiconductor solder
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950038872U KR0132419Y1 (en) | 1995-12-07 | 1995-12-07 | Mold flash clearing apparatus of semiconductor soldering machine |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950038872U KR0132419Y1 (en) | 1995-12-07 | 1995-12-07 | Mold flash clearing apparatus of semiconductor soldering machine |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970046882U true KR970046882U (en) | 1997-07-31 |
KR0132419Y1 KR0132419Y1 (en) | 1998-12-01 |
Family
ID=19432442
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950038872U KR0132419Y1 (en) | 1995-12-07 | 1995-12-07 | Mold flash clearing apparatus of semiconductor soldering machine |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0132419Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100453692B1 (en) * | 1997-12-30 | 2005-02-24 | 앰코 테크놀로지 코리아 주식회사 | Apparatus for removing flash of leadframe for semiconductor package to remove flash of material passing through guide rail |
-
1995
- 1995-12-07 KR KR2019950038872U patent/KR0132419Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100453692B1 (en) * | 1997-12-30 | 2005-02-24 | 앰코 테크놀로지 코리아 주식회사 | Apparatus for removing flash of leadframe for semiconductor package to remove flash of material passing through guide rail |
Also Published As
Publication number | Publication date |
---|---|
KR0132419Y1 (en) | 1998-12-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20100825 Year of fee payment: 13 |
|
EXPY | Expiration of term |