KR970046734U - Wafer polishing machine - Google Patents
Wafer polishing machineInfo
- Publication number
- KR970046734U KR970046734U KR2019950052643U KR19950052643U KR970046734U KR 970046734 U KR970046734 U KR 970046734U KR 2019950052643 U KR2019950052643 U KR 2019950052643U KR 19950052643 U KR19950052643 U KR 19950052643U KR 970046734 U KR970046734 U KR 970046734U
- Authority
- KR
- South Korea
- Prior art keywords
- polishing machine
- wafer polishing
- wafer
- machine
- polishing
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
- B24B37/102—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping the workpieces or work carriers being able to rotate freely due to a frictional contact with the lapping tool
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950052643U KR200173174Y1 (en) | 1995-12-29 | 1995-12-29 | Wafer polishing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950052643U KR200173174Y1 (en) | 1995-12-29 | 1995-12-29 | Wafer polishing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970046734U true KR970046734U (en) | 1997-07-31 |
KR200173174Y1 KR200173174Y1 (en) | 2000-03-02 |
Family
ID=19441826
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950052643U KR200173174Y1 (en) | 1995-12-29 | 1995-12-29 | Wafer polishing apparatus |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR200173174Y1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100414741B1 (en) * | 1996-06-29 | 2004-03-30 | 주식회사 하이닉스반도체 | Method for manufacturing semiconductor device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100841094B1 (en) | 2005-12-20 | 2008-06-25 | 주식회사 실트론 | Silicon wafer grinding apparatus, retaining assembly, and silicon wafer flatness correcting method |
-
1995
- 1995-12-29 KR KR2019950052643U patent/KR200173174Y1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100414741B1 (en) * | 1996-06-29 | 2004-03-30 | 주식회사 하이닉스반도체 | Method for manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
KR200173174Y1 (en) | 2000-03-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20091126 Year of fee payment: 11 |
|
EXPY | Expiration of term |