KR970030703A - LOC package without bus bar - Google Patents
LOC package without bus bar Download PDFInfo
- Publication number
- KR970030703A KR970030703A KR1019950039645A KR19950039645A KR970030703A KR 970030703 A KR970030703 A KR 970030703A KR 1019950039645 A KR1019950039645 A KR 1019950039645A KR 19950039645 A KR19950039645 A KR 19950039645A KR 970030703 A KR970030703 A KR 970030703A
- Authority
- KR
- South Korea
- Prior art keywords
- bus bar
- loc package
- semiconductor chip
- wire
- adhesive tape
- Prior art date
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
버스 바(bus bar)가 없는 리드 온 칩(lead on chip:LOC) 패키지에서는 반도체 칩의 센터 본딩 패드들과 와이어 본딩되는 리드 프레임의 내부 리드들의 영역으로부터 외부 리드쪽으로 일정한 거리에 위치하는 영역의 내부 리드상에 버스 바를 대신하는 전도성 박막이 입혀진 비전도성 접착 테이프가 접착되어 본딩 와이어가 버스 바에 접촉하는 것을 방지하고, 버스 바를 반도체 칩에 접착하기 위한 접착 테이프에 의한 반도체 칩의 상부면의 절연층의 균열이 방지되어 신뢰성이 향상되는 효과가 있다.In a lead on chip (LOC) package without a bus bar, the interior of an area located at a constant distance from the area of the inner leads of the lead frame to the wire bonding with the center bonding pads of the semiconductor chip. A non-conductive adhesive tape coated with a conductive thin film in place of the bus bar is bonded on the lid to prevent the bonding wires from contacting the bus bar, and the insulating layer on the upper surface of the semiconductor chip by the adhesive tape for bonding the bus bar to the semiconductor chip. There is an effect that the crack is prevented to improve the reliability.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제 2도는 본 발명에 의한 버스 바(bus bar)가 없는 엘오씨(LOC) 패키지의 구조를 나타낸 부분 절개 사시도.Figure 2 is a partial cutaway perspective view showing the structure of the bus bar (LOC) package without the bus bar according to the present invention.
제 3도는 본 발명에 의한 버스 바가 없는 엘오씨(LOC) 패키지의 구조의 다른 예를 나타낸 부분 절개 사시도이다.3 is a partial cutaway perspective view showing another example of the structure of an LOC package without a bus bar according to the present invention.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950039645A KR970030703A (en) | 1995-11-03 | 1995-11-03 | LOC package without bus bar |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950039645A KR970030703A (en) | 1995-11-03 | 1995-11-03 | LOC package without bus bar |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970030703A true KR970030703A (en) | 1997-06-26 |
Family
ID=66587428
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950039645A KR970030703A (en) | 1995-11-03 | 1995-11-03 | LOC package without bus bar |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970030703A (en) |
-
1995
- 1995-11-03 KR KR1019950039645A patent/KR970030703A/en not_active Application Discontinuation
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |