KR970030703A - LOC package without bus bar - Google Patents

LOC package without bus bar Download PDF

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Publication number
KR970030703A
KR970030703A KR1019950039645A KR19950039645A KR970030703A KR 970030703 A KR970030703 A KR 970030703A KR 1019950039645 A KR1019950039645 A KR 1019950039645A KR 19950039645 A KR19950039645 A KR 19950039645A KR 970030703 A KR970030703 A KR 970030703A
Authority
KR
South Korea
Prior art keywords
bus bar
loc package
semiconductor chip
wire
adhesive tape
Prior art date
Application number
KR1019950039645A
Other languages
Korean (ko)
Inventor
문성천
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950039645A priority Critical patent/KR970030703A/en
Publication of KR970030703A publication Critical patent/KR970030703A/en

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  • Lead Frames For Integrated Circuits (AREA)

Abstract

버스 바(bus bar)가 없는 리드 온 칩(lead on chip:LOC) 패키지에서는 반도체 칩의 센터 본딩 패드들과 와이어 본딩되는 리드 프레임의 내부 리드들의 영역으로부터 외부 리드쪽으로 일정한 거리에 위치하는 영역의 내부 리드상에 버스 바를 대신하는 전도성 박막이 입혀진 비전도성 접착 테이프가 접착되어 본딩 와이어가 버스 바에 접촉하는 것을 방지하고, 버스 바를 반도체 칩에 접착하기 위한 접착 테이프에 의한 반도체 칩의 상부면의 절연층의 균열이 방지되어 신뢰성이 향상되는 효과가 있다.In a lead on chip (LOC) package without a bus bar, the interior of an area located at a constant distance from the area of the inner leads of the lead frame to the wire bonding with the center bonding pads of the semiconductor chip. A non-conductive adhesive tape coated with a conductive thin film in place of the bus bar is bonded on the lid to prevent the bonding wires from contacting the bus bar, and the insulating layer on the upper surface of the semiconductor chip by the adhesive tape for bonding the bus bar to the semiconductor chip. There is an effect that the crack is prevented to improve the reliability.

Description

버스 바(bus bar)가 없는 엘오씨(LOC) 패키지LOC package without bus bar

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제 2도는 본 발명에 의한 버스 바(bus bar)가 없는 엘오씨(LOC) 패키지의 구조를 나타낸 부분 절개 사시도.Figure 2 is a partial cutaway perspective view showing the structure of the bus bar (LOC) package without the bus bar according to the present invention.

제 3도는 본 발명에 의한 버스 바가 없는 엘오씨(LOC) 패키지의 구조의 다른 예를 나타낸 부분 절개 사시도이다.3 is a partial cutaway perspective view showing another example of the structure of an LOC package without a bus bar according to the present invention.

Claims (4)

LOC패키지에 있어서, 센터 본딩 패드가 형성된 반도체 칩과, 접착 테이프에 의해 그 반도체 칩상에 접착되는 내부 리드를 갖는 리드 프레임과, 그 센터 본딩 패드에 내부 리드를 대응하여 와이어 본딩하는 와이어와, 그 내부 리드상에 설치되는 버스 바를 포함하는 버스 바가 없는 LOC패키지.In a LOC package, a semiconductor chip having a center bonding pad formed thereon, a lead frame having an inner lead bonded to the semiconductor chip by an adhesive tape, a wire for correspondingly wire bonding the inner lead to the center bonding pad, and the inside thereof LOC package without bus bars, including bus bars installed on the leads. 제 1항에 있어서, 그 버스 바가 전도성 박막이 입혀진 비전도성 접착 테이프를 갖는 것을 특징으로 하는 버스 바가 없는 LOC패키지.2. A bus bar free LOC package according to claim 1, wherein the bus bar has a nonconductive adhesive tape coated with a conductive thin film. 제 1항에 있어서, 그 버스 바가 센터 본딩 패드로부터 와이어 본딩되는 영역보다 먼 영역의 내부리드에 설치되는 것을 특징으로 하는 버스 바가 없는 LOC패키지.2. A bus bar-free LOC package according to claim 1, wherein the bus bar is provided on an inner lead of an area farther from the area of wire bonding from the center bonding pad. 제 1항에 있어서, 그 버스 바에 그 내부 리드가 와이어에 의해 와이어 본딩되는 것을 특징으로 하는 버스바가없는 LOC패키지.2. A bus bar-free LOC package according to claim 1, wherein an inner lead of the bus bar is wire bonded by a wire. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950039645A 1995-11-03 1995-11-03 LOC package without bus bar KR970030703A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950039645A KR970030703A (en) 1995-11-03 1995-11-03 LOC package without bus bar

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950039645A KR970030703A (en) 1995-11-03 1995-11-03 LOC package without bus bar

Publications (1)

Publication Number Publication Date
KR970030703A true KR970030703A (en) 1997-06-26

Family

ID=66587428

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950039645A KR970030703A (en) 1995-11-03 1995-11-03 LOC package without bus bar

Country Status (1)

Country Link
KR (1) KR970030703A (en)

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