KR970025346A - Chip Mounting Device for LOC Package - Google Patents

Chip Mounting Device for LOC Package Download PDF

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Publication number
KR970025346A
KR970025346A KR1019950034403A KR19950034403A KR970025346A KR 970025346 A KR970025346 A KR 970025346A KR 1019950034403 A KR1019950034403 A KR 1019950034403A KR 19950034403 A KR19950034403 A KR 19950034403A KR 970025346 A KR970025346 A KR 970025346A
Authority
KR
South Korea
Prior art keywords
base block
cam
drive unit
chip mounting
chip
Prior art date
Application number
KR1019950034403A
Other languages
Korean (ko)
Other versions
KR0154291B1 (en
Inventor
김강산
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019950034403A priority Critical patent/KR0154291B1/en
Publication of KR970025346A publication Critical patent/KR970025346A/en
Application granted granted Critical
Publication of KR0154291B1 publication Critical patent/KR0154291B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/4826—Connecting between the body and an opposite side of the item with respect to the body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73215—Layer and wire connectors

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

본 발명은 캠을 이용하여 베이스 블록의 상향이동을 조절하여 리드에 발생할 수 있는 응력을 방지할 수 있도록 구성한 엘오씨 패캐이지용 칩 마운팅 장치를 개시한다. 본 발명은 구동부와, 구동부의 회전력을 맏아 수직이송을 실시하는 수직이송수단과, 상기 구동부의 회전력을 직선운동으로 변환하여 상기 수직이송수단에 전달하는 캠과, 수직이송수단상에 설치된 베이스 블록과, 하향이송가능하며, 베이스 블록과 대응하는 헤드 블록과, 레일상의 리드 프레임과 베이스 블록간의 간격을 감지하여 그 감지신호를 통하여 구동부의 회전방향을 제어하는 감지 및 제어수단으로 이루어져 베이스 블록이 설정높이 이상으로 상승시 감지 및 제어수단이 이를 감지하여 구동부를 역으로 회전시켜 캠으로 하여금 베이스 불록의 위치를 설정위치로 보정할 수 있도록 구성하였다.The present invention discloses a chip mounting device for an ELC package configured to prevent the stress that may occur in the lead by adjusting the upward movement of the base block using a cam. The present invention includes a drive unit, a vertical transfer means for vertically transferring the rotational force of the drive unit, a cam for converting the rotational force of the drive unit into a linear motion and transmitting it to the vertical transfer means; The base block includes a head block corresponding to the base block and a sensing and control means for detecting a distance between the lead frame and the base block on the rail and controlling the rotation direction of the driving unit through the detection signal. As described above, the sensing and control means detects this and rotates the driving unit in reverse so that the cam can correct the position of the base block to the set position.

Description

엘오씨 패캐이지용 칩 마운팅 장치Chip Mounting Device for LOC Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 엘오씨 패캐이지의 정단면도,Figure 1 is a cross-sectional front view of LOC Package,

제5도는 제4도 "가"부의 상세도Figure 5 is a detailed view of the fourth part "a" part

Claims (6)

리드 프래임의 이송을 안내하는 레일, 리드 프레임 저면에 부착되어지는 칩이 로딩되며 테이블상에 설치된 베이스 블록 및 베이스 블록을 향하여 하향이송되어 리드 프레임과 칩을 가압하는 헤드 블록으로 이루어진 엘오씨 패캐이지용 칩 마운팅 장치에 있어서, 구동부와, 구동부의 회전력을 받아 수직이송을 실시하는 수직이송수단과, 상기 구동부의 회전력을 직선운동으로 변환하여 상기 수직이송수단에 전달하는 캠과, 상기 수직이송수단상에 설치된 베이스 블록과, 하향이송가능하며, 상기 베이스 블록과 대응하는 헤드 블록과, 상기 레일상의 리드 프레임과 베이스 블록간의 간격을 감지하여 그 감지신호를 통하여 상기 구동부의 회전방향을 제어하는 감지 및 제어수단으로 이루어져 상기 베이스 블록이 설정높이 이상으로 상승시 상기 감지 및 제어수단이 구동부를 역으로 회전시켜 상기 캠으로 하여금 상기 베이스 블록의 위치를 설정위치로 보정할 수 있도록 구성한 것을 특징으로 하는 엘오씨 패캐이지용 칩 마운팅 장치.The rail for guiding the lead frame, the chip attached to the bottom of the lead frame is loaded, and the base block installed on the table and the lower chip toward the base block and the head block for pressurizing the lead frame and chip for chip A mounting apparatus, comprising: a drive unit, a vertical transfer means for vertical transfer under rotational force of a drive unit, a cam for converting the rotational force of the drive unit into a linear motion and transmitting it to the vertical transfer means, and installed on the vertical transfer means. Sensing and control means for sensing the distance between the base block, the head block and the head block corresponding to the base block, the lead frame on the rail and the base block and control the rotation direction of the drive unit through the detection signal The detection and detection when the base block rises above the set height. And a means for rotating the driving unit to reversely drive the cam to correct the position of the base block to a set position. 제1항에 있어서, 상기 수직이송수단은 리니어 슬라이더로서, 가이드 플레이트를 따라서 상하향 이송이 가능한 것을 특징으로 하는 엘오씨 패캐이지용 칩 마운팅 장치.The chip mounting apparatus of claim 1, wherein the vertical conveying means is a linear slider, and the vertical conveying means is capable of vertically conveying along a guide plate. 제2항에 있어서, 상기 리니어 슬라이더는 상기 캠 면과 접촉하는 베어링을 더 구비하여 상기 캠의 회전에 따라 상향 또는 하향이송할 수 있도록 구성한 것을 특징으로 하는 엘오씨 패캐이지용 칩 마운팅 장치.The chip mounting device of claim 2, wherein the linear slider further includes a bearing in contact with the cam surface to move upward or downward according to the rotation of the cam. 제2항 또는 제3항에 있어서, 상기 리이너 슬라이더에는 일단이 테이블에 고정된 스프링의 또 다른 일단이 고정되어 있어 상기 캠의 장축면에 접촉한 상기 베어링이 상기 갱의 단축면에 접촉하는 경우 상기 스프링의 복원력으로 인하여 하향이송되도록 구성한 것을 특징으로 하는 엘오씨 패캐이지용 칩 마운팅 장치.According to claim 2 or 3, wherein one end of the spring fixed to the table is fixed to the liner slider, the bearing in contact with the long axis surface of the cam contacting the short axis surface of the gang The chip mounting device for LCC package, characterized in that configured to be transported downward due to the restoring force of the spring. 제1항에 있어서, 상기 베이스 블록은 상기 리니어 슬라이더에 고정된 수직부재 및 수평부재로 이루어진 ㄱ 자형의 브라켓트의 수평부재상에 고정되며, 상기 수평부재와 상기 베이스 블록간에는 절연 플레이트가 게재되어 있는 것을 특징으로 하는 엘오씨 패캐이지용 칩 마운팅 장치.According to claim 1, wherein the base block is fixed on the horizontal member of the bracket of the a-shaped bracket consisting of a vertical member and a horizontal member fixed to the linear slider, the insulating plate is placed between the horizontal member and the base block A chip mounting device for ELC package. 제1항에 있어서, 상기 감지 및 제어수단은, 상기 베이스 블록의 연변에 설치되되, 상기 베이스 블록의 표면과 수명이 되도록 설치된 센서와, 상기 센서와 접속되며, 상기 구동부에 접속되어 상기 센서의 감지신호에 따라 상기 구동부의 회전방향을 제어하는 엘오씨 패캐이지용 칩 마운팅 장치.The sensor of claim 1, wherein the sensing and control means is installed at the edge of the base block, the sensor is installed to extend the surface of the base block, and is connected to the sensor. The chip mounting device for the LCC package for controlling the rotation direction of the drive unit in accordance with the signal.
KR1019950034403A 1995-10-07 1995-10-07 Lead on chip package mounting device KR0154291B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950034403A KR0154291B1 (en) 1995-10-07 1995-10-07 Lead on chip package mounting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950034403A KR0154291B1 (en) 1995-10-07 1995-10-07 Lead on chip package mounting device

Publications (2)

Publication Number Publication Date
KR970025346A true KR970025346A (en) 1997-05-30
KR0154291B1 KR0154291B1 (en) 1998-10-15

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950034403A KR0154291B1 (en) 1995-10-07 1995-10-07 Lead on chip package mounting device

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KR (1) KR0154291B1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744872A (en) * 2012-07-06 2012-10-24 陈长贵 Calibrating and bending device before encapsulation

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102744872A (en) * 2012-07-06 2012-10-24 陈长贵 Calibrating and bending device before encapsulation

Also Published As

Publication number Publication date
KR0154291B1 (en) 1998-10-15

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