KR970024123A - Pin-to-pin grid array package with small pins inserted into the board holes - Google Patents
Pin-to-pin grid array package with small pins inserted into the board holes Download PDFInfo
- Publication number
- KR970024123A KR970024123A KR1019950038143A KR19950038143A KR970024123A KR 970024123 A KR970024123 A KR 970024123A KR 1019950038143 A KR1019950038143 A KR 1019950038143A KR 19950038143 A KR19950038143 A KR 19950038143A KR 970024123 A KR970024123 A KR 970024123A
- Authority
- KR
- South Korea
- Prior art keywords
- pin
- grid array
- array package
- circuit board
- package
- Prior art date
Links
Abstract
본 발명은 볼 그리드 어레이 패키지와 핀 그리드 어레이 패키지의 장점을 모두 취할 수 있는 핀 삽입형 그리드 어레이 패키지에 관한 것으로서, 소정의 전도성 패턴을 갖는 회로 기판과, 상기 회로 기판에 실장되는 반도체 칩과, 상기 반도체 칩과 상기 회로 기판을 전기적으로 연결하는 본딩 와이어를 구비하는 패키지로서, 상기 회로 기판은 복수개의 그리드 어레이 형태로 배열된 구멍을 가지고, 상기 구멍 각각에는 핀이 삽입되고 상기 핀의 한쪽 면은 상기 패키지가 실장되는 시스템의 기판에 면실장되는 것을 특징으로 하는 핀 삽입 그리드 어레이 패키지가 개시되어 있다.The present invention relates to a pin-insertable grid array package that can take advantage of both a ball grid array package and a pin grid array package. The present invention relates to a circuit board having a predetermined conductive pattern, a semiconductor chip mounted on the circuit board, and a semiconductor. A package having bonding wires electrically connecting a chip and the circuit board, wherein the circuit board has holes arranged in the form of a plurality of grid arrays, each of the holes having a pin inserted therein and one side of the pin being the package. A pin insertion grid array package is disclosed, which is surface mounted on a substrate of a system in which is mounted.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제3A도 및 제3B도는 핀 삽입 그리드 어레이 패키지의 단면도 및 부분 상세도.3A and 3B are cross-sectional and partial detailed views of the pin insertion grid array package.
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038143A KR970024123A (en) | 1995-10-30 | 1995-10-30 | Pin-to-pin grid array package with small pins inserted into the board holes |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950038143A KR970024123A (en) | 1995-10-30 | 1995-10-30 | Pin-to-pin grid array package with small pins inserted into the board holes |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970024123A true KR970024123A (en) | 1997-05-30 |
Family
ID=66584697
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950038143A KR970024123A (en) | 1995-10-30 | 1995-10-30 | Pin-to-pin grid array package with small pins inserted into the board holes |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970024123A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100481424B1 (en) * | 1998-05-29 | 2005-06-08 | 삼성전자주식회사 | Method for manufacturing chip scale package |
KR100646489B1 (en) * | 2004-11-12 | 2006-11-15 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor Device and Method of fabricating the same |
KR100952322B1 (en) * | 2007-12-17 | 2010-04-09 | 케이. 에이. 이 (주) | A receptacle connector for a battery in the mobile electric device |
-
1995
- 1995-10-30 KR KR1019950038143A patent/KR970024123A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100481424B1 (en) * | 1998-05-29 | 2005-06-08 | 삼성전자주식회사 | Method for manufacturing chip scale package |
KR100646489B1 (en) * | 2004-11-12 | 2006-11-15 | 앰코 테크놀로지 코리아 주식회사 | Semiconductor Device and Method of fabricating the same |
KR100952322B1 (en) * | 2007-12-17 | 2010-04-09 | 케이. 에이. 이 (주) | A receptacle connector for a battery in the mobile electric device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |