KR970018461A - Glass terminal and its manufacturing method - Google Patents

Glass terminal and its manufacturing method Download PDF

Info

Publication number
KR970018461A
KR970018461A KR1019960036293A KR19960036293A KR970018461A KR 970018461 A KR970018461 A KR 970018461A KR 1019960036293 A KR1019960036293 A KR 1019960036293A KR 19960036293 A KR19960036293 A KR 19960036293A KR 970018461 A KR970018461 A KR 970018461A
Authority
KR
South Korea
Prior art keywords
eyelet
plated film
base material
film
lead wire
Prior art date
Application number
KR1019960036293A
Other languages
Korean (ko)
Other versions
KR100225265B1 (en
Inventor
유지 꼬바야시
히데유끼 꼬바야시
요시히꼬 나까무라
Original Assignee
모기 쥰이찌
신꼬오덴기 고오교오 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 모기 쥰이찌, 신꼬오덴기 고오교오 가부시끼가이샤 filed Critical 모기 쥰이찌
Publication of KR970018461A publication Critical patent/KR970018461A/en
Application granted granted Critical
Publication of KR100225265B1 publication Critical patent/KR100225265B1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemically Coating (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

본 발명은 무전해도금을 가능하게 하고, 리드선의 굽힘등이 없는 유리단자 및 그 제조방법을 제공한다. 아일릿에 리드선(40)이 유리(42)에 의해 절연되어 고정된 유리단자(30)에 있어서, 아일릿에 모재(32)에 동도금 피막(34)이 형성되고, 이 동도금피막(34)상에 금도금피막(36)이 형성되고, 상기 양 도금피막(34, 36)이 형성된 아일릿모재(32) 및 상기 리드선(40)에 무전해니켈도금피막(44)이 형성되고, 또 무전해니켈도금피막(44)상에 무전해금 도금피막(46)이 형성되어 있는 것을 특징으로 하고 있다.The present invention enables electroless plating and provides a glass terminal without bending the lead wire and the like and a method of manufacturing the same. In the glass terminal 30 in which the lead wire 40 is insulated and fixed by the glass 42 to the eyelet, a copper plating film 34 is formed on the base material 32 on the eyelet, and gold plating is performed on the copper plating film 34. An electroless nickel plated film 44 is formed on the eyelet base material 32 and the lead wire 40 on which the two-coated films 34 and 36 are formed, and an electroless nickel plated film ( The electroless gold plating film 46 is formed on 44).

Description

유리단자 및 그 제조방법Glass terminal and its manufacturing method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

도1은 제1실시예를 나타낸 단면도1 is a cross-sectional view showing a first embodiment

Claims (16)

아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자에 있어서, 아일릿의 모재에 동도금피막이 형성되고, 이 동도금피막상에 금도금피막, 팔라이움도금피막 또는 니켈도금피막이 형성되고, 상기 양 도금피막이 형성된 아일릿모재에 철계합금의 리드선이 유리에 의해 절연되어 고정되고, 상기 양 도금피막이 형성된 아일릿모재 및 상기 리드선에 무전해니켈도금피막 또는 무전해코바트도금피막이 형성되어 있는 것을 특징으로 하는 유리단자.In a glass terminal in which a lead wire is insulated from glass and fixed to an eyelet, a copper plated film is formed on the base material of the eyelet, and a gold plated film, a palladium plated film or a nickel plated film is formed on the copper plated film, and the two plated film is formed on the eyelet. A lead terminal of an iron-based alloy is insulated and fixed to glass by a base material, and an eyelet base material on which both the plating films are formed, and an electroless nickel plated film or an electroless cobalt plated film are formed on the lead wire. 제1항에 있어서, 상기 동도금피막이 형성된 아일릿모재에 상기 금도금피막 또는 팔라디움도금피막이 형성되고, 양 도금피막이 형성된 아일릿모재에 상기 리드선과 같이 철계합금의 접지리드선이 고정되고, 접지리드선에도 상기 무전해니켈도금피막 또는 무전해코발트도금피막이 형성되어 있는 것을 특징으로 하는 유리단자.According to claim 1, wherein the gold plated film or the palladium plated film is formed on the eyelet base material formed with the copper plating film, the ground lead wire of the iron-based alloy is fixed to the eyelet base material formed with both plating film, as the lead wire, the electroless nickel also on the ground lead wire A glass terminal, characterized in that a plated film or an electroless cobalt plated film is formed. 아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자에 있어서, 아일릿의 모재에 동도금피막이 형성되고, 이 동도금피막상에 금도금피막, 팔라디움도금피막 또는 니켈도금피막이 형성되고, 상기 양 도금피막이 형성된 아일릿모재에 철계합금의 리드선이 유리에 의해 절연되어 고정되어 있는 것을 특징으로 하는 유리단자.In a glass terminal in which lead wires are insulated from glass and fixed by eyelets, a copper plating film is formed on the base material of the eyelet, and a gold plating film, a palladium plating film, or a nickel plating film is formed on the copper plating film, and the two plating films are formed. A glass terminal, wherein the lead wire of the iron alloy is insulated and fixed by glass. 제3항에 있어서, 상기 동도금피막이 형성된 아일릿모재에 상기 금도금피막 또는 팔라디움도금피막이 형성되고, 양 도금피막이 형성된 아일릿모재에 상기 리드선과 같이 철계합금의 접지리드선이 고정되어 있는 것을 특징으로 하는 유리단자.The glass terminal according to claim 3, wherein the gold plating film or the palladium plating film is formed on the eyelet base material on which the copper plating film is formed, and the ground lead wire of the iron alloy is fixed to the eyelet base material on which both plating films are formed, like the lead wire. 아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자에 있어서, 동 또는 동합금으로 되는 아일릿의 모재에 금도금피막, 팔라디움도금피막 또는 니켈도금피막이 형성되고, 도금피막이 형성된 아일릿모재에 철계합금의 리드선이 유리에 의해 절연되어 고정되고, 도금피막이 형성된 아일릿모재 및 상기 리드선에 무전해니켈도금피막 또는 무전해코발트도금피막이 형성되어 있는 것을 특징으로 하는 유리단자.In the glass terminal in which the lead wire is insulated and fixed to the eyelet by a glass, a gold plated film, a palladium plated film or a nickel plated film is formed on the base material of the islet made of copper or copper alloy, and the lead wire of the iron-based alloy is formed on the eyelet base material on which the plated film is formed. And an electroless nickel plated film or an electroless cobalt plated film formed on the eyelet base material, which is insulated and fixed by the plated film, and the lead wire. 제5항에 있어서, 상기 동 또는 동합금으로 되는 아일릿의 모재에 상기 금도금피막 또는 팔라디움도금피막이 형성되고 도금피막이 형성된 아일릿모재에 상기 리드선과 같이 철계합금의 접지리드선이 고정되고, 접지리드선에도 상기 무전해니켈도금피막 또는 무전해코발트도금피막이 형성되어 있는 것을 특징으로 하는 유리단자.6. The method of claim 5, wherein the gold plating film or palladium plating film is formed on the base material of the eyelet made of copper or copper alloy, and the ground lead wire of the iron-based alloy is fixed to the eyelet base material on which the plating film is formed. A glass terminal, wherein a nickel plated film or an electroless cobalt plated film is formed. 아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자에 있어서, 동 또는 동합금으로 되는 아일릿의 모재에 금도금피막, 팔라디움도금피막 또는 니켈도금피막이 형성되고, 도금피막이 형성된 아일릿모재에 철계합금의 리드선이 유리에 의해 절연되어 고정되어 있는 것을 특징으로 하는 유리단자.In the glass terminal in which the lead wire is insulated and fixed to the eyelet by a glass, a gold plated film, a palladium plated film or a nickel plated film is formed on the base material of the islet made of copper or copper alloy, and the lead wire of the iron-based alloy is formed on the eyelet base material on which the plated film is formed. It is insulated by and fixed by the glass terminal. 제7항에 있어서, 상기 동 또는 동합금으로 되는 아일릿의 모재에 상기 금도금피막 또는 팔라디움도금피막이 형성되고, 도금피막이 형성된 아일릿모재에 상기 리드선과 같이 철계합금의 접지리드선이 고정되어 있는 것을 특징으로 하는 유리단자.8. The glass according to claim 7, wherein the gold plated film or the palladium plated film is formed on the base material of the eyelet made of copper or copper alloy, and the ground lead wire of the iron-based alloy is fixed to the eyelet base material on which the plated film is formed. Terminals. 제1항 내지 제8항 중 어느 한항에 있어서, 최상층에 무전해금도금피막이 형성되어 있는 것을 특징으로 하는 유리단자.The glass terminal according to any one of claims 1 to 8, wherein an electroless plating film is formed on the uppermost layer. 아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자의 제조방법에 있어서, 아일릿의 모재에 동도금피막을 형성하는 공정과, 동도금피막이 형성된 아일릿의 모재에 금도금피막, 팔라디움도금피막 또는 니켈도금피막을 형성하는 공정과 상기 동도금피막 및 금도금피막, 팔라디움도금피막 또는 니켈도금피막이 형성된 아일릿의 모재에 철계합금의 리드선을 유리에 의해 절연하여 고착하는 공정과, 상기 리드선이 고착된 아일릿모재 및 리드선에 무전해니켈도금피막 또는 무전해코발트도금피막을 형성하는 공정을 포함하는 것을 특징으로 하는 유리단자의 제조방법In the method for manufacturing a glass terminal in which the lead wire is insulated from the eyelet and fixed by the glass, a step of forming a copper plated film on the base material of the eyelet, and a gold plated film, palladium plated film or nickel plated film is formed on the base material of the eyelet on which the copper plated film is formed. And a step of insulating and fixing the lead wire of iron-based alloy by glass to the base material of the eyelet on which the copper plating film, the gold plating film, the palladium plating film, or the nickel plating film are formed, and the electroless nickel on the eyelet base material and the lead wire to which the lead wire is fixed. Method of manufacturing a glass terminal, comprising the step of forming a plating film or an electroless cobalt plating film 아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자의 제조방법에 있어서, 아일릿의 모재에 동도금피막을 형성하는 공정과, 동도금피막이 형성된 아일릿의 모재에 금도금피막, 팔라디움도금피막 또는 니켈도금피막을 형성하는 공정과, 상기 동도금피막 및 금도금피막, 팔라디움도금피막 또는 니켈도금피막이 형성된 아일릿의 모재에 철계합금의 리드선을 유리에 의해 절연하여 고착하는 공정을 포함하는 것을 특징으로 하는 유리단자의 제조방법In the method for manufacturing a glass terminal in which the lead wire is insulated from the eyelet and fixed by the glass, a step of forming a copper plated film on the base material of the eyelet, and a gold plated film, palladium plated film or nickel plated film is formed on the base material of the eyelet on which the copper plated film is formed. And a step of insulating and fixing the lead wire of the iron-based alloy by glass to the base material of the eyelet on which the copper plating film, the gold plating film, the palladium plating film, or the nickel plating film are formed. 제10항 또는 제11항에 있어서, 상기 동도금피막 및 금도금피막 또는 팔라디움도금피막이 형성된 아일릿의 모재에 철계합금의 리드선을 유리에 의해 절연하여 고착하는 공정전에, 아릿에 철계합금의 접지리드선을 용접하여 고정하는 것을 특징으로 하는 유리단자의 제조방법.12. The ground lead wire of the iron alloy is welded to the arylet according to claim 10 or 11, before the step of insulating and fixing the lead wire of the iron alloy by glass to the base material of the eyelet on which the copper plating film, the gold plating film or the palladium plating film is formed. Method of manufacturing a glass terminal, characterized in that fixed. 아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자의 제조방법에 있어서, 동 또는 동합금으로 되는 아일릿의 모재에 금도금피막, 팔라디움도금피막 또는 니켈도금피막을 형성하는 공정과, 상기 금도금피막, 팔라디움도금피막 또는 니켈도금피막이 형성된 아일릿의 모재에 철계합금의 리드선을 유리에 의해 절연하여 고착하는 공정과, 상기 리드선이 고착된 아일릿모재 및 리드선에 무전해니켈도금피막 또는 무전해코발트도금피막을 형성하는 공정을 포함하는 것을 특징으로 하는 유리단자의 제조방법A method of manufacturing a glass terminal in which lead wires are insulated from glass and fixed to an eyelet, the method comprising: forming a gold plated film, a palladium plated film, or a nickel plated film on a base material of an eyelet made of copper or copper alloy; and the gold plated film and palladium plated film. Insulating and fixing the lead wire of iron-based alloy by glass to the base material of the eyelet on which the coating or nickel plating film is formed, and forming an electroless nickel plating film or an electroless cobalt plating film on the eyelet base material and the lead wire to which the lead wire is fixed. Glass terminal manufacturing method comprising a 아일릿에 리드선이 유리에 의해 절연되어 고정된 유리단자의 제조방법에 있어서, 동 또는 동합금으로 되는 아일릿의 모재에 금도금피막, 팔라디움도금피막 또는 니켈도금피막을 형성하는 공정과, 상기 금도금피막 또는 팔라디움도금피막이 형성된 아일릿의 모재에 철계합금의 리드선을 유리에 의해 절연하여 고착하는 공정을 포함하는 것을 특징으로 하는 유리단자의 제조방법A method of manufacturing a glass terminal in which lead wires are insulated from glass and fixed to an eyelet, the method comprising: forming a gold plated film, a palladium plated film, or a nickel plated film on a base material of an eyelet made of copper or copper alloy; and the gold plated film or palladium plating A method of manufacturing a glass terminal comprising the step of insulating and fixing a lead wire of an iron-based alloy to a base material of an eyelet having a film formed thereon by glass. 제13항 또는 14항에 있어서, 상기 금도금피막 또는 팔라이움도금피막이 형성된 아일릿의 모재에 철계합금의 리드선을 유리에 의해 절연하여 고착하는 공정전에, 아일릿에 철계합금의 접지리드선을 용접하여 고정하는 것을 특징으로 하는 유리단자의 제조방법.15. The method of claim 13 or 14, wherein the ground lead wire of the iron alloy is welded and fixed to the eyelet before the step of insulating and fixing the lead wire of the iron alloy to the base material of the eyelet on which the gold plating film or the palladium plating film is formed by glass. Method for producing a glass terminal, characterized in that. 제10항 내지 제15항중 어느 한항에 있어서, 최상층에 무전해금도금피막을 형성하는 공정을 포함하는 것을 특징으로 하는 유리단자의 제조방법.The method for manufacturing a glass terminal according to any one of claims 10 to 15, comprising the step of forming an electroless plating film on the uppermost layer.
KR1019960036293A 1995-09-04 1996-08-29 Glass terminal and its manufacture KR100225265B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP95-226229 1995-09-04
JP22622995A JP3349624B2 (en) 1995-09-04 1995-09-04 Glass terminal and method of manufacturing the same

Publications (2)

Publication Number Publication Date
KR970018461A true KR970018461A (en) 1997-04-30
KR100225265B1 KR100225265B1 (en) 1999-10-15

Family

ID=16841925

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960036293A KR100225265B1 (en) 1995-09-04 1996-08-29 Glass terminal and its manufacture

Country Status (2)

Country Link
JP (1) JP3349624B2 (en)
KR (1) KR100225265B1 (en)

Also Published As

Publication number Publication date
JPH0974150A (en) 1997-03-18
JP3349624B2 (en) 2002-11-25
KR100225265B1 (en) 1999-10-15

Similar Documents

Publication Publication Date Title
US6451449B2 (en) Terminal material and terminal
KR920002319A (en) TAB tape
CA2118758C (en) Lead frame for integrated circuits
TW369689B (en) Multi-layer plated lead frame
JP3072735B2 (en) Wire bonding method to double metal coated pad surface and electric card structure including the wire bonding
US20050249968A1 (en) Whisker inhibition in tin surfaces of electronic components
US5444293A (en) Structure and method for providing a lead frame with enhanced solder wetting leads
ATE434843T1 (en) ELECTRICAL PLUG CONTACTS AND A SEMI-FINISHED PRODUCT FOR THEIR PRODUCTION
JP2000269398A (en) Aluminum lead frame for semiconductor device and manufacture thereof
KR970018461A (en) Glass terminal and its manufacturing method
MY118571A (en) Method for the manufacture of a leadless substrate especially a solder layer
US7432584B2 (en) Leadframe for use in a semiconductor package
KR910017367A (en) Thin film magnetic head and its production method
US5530283A (en) Lead frame and lead frame material
JPH09293817A (en) Electronic part
KR100225778B1 (en) Semiconductor package using lead frame
JP3757539B2 (en) Stem for semiconductor device
KR100254268B1 (en) Lead frame for semiconductor device having multi-plated layers
JP2826650B2 (en) Lead frame for semiconductor device
EP3497756B1 (en) Multiple diameter wire connection
JPH03188253A (en) Tinned copper alloy material
JPS59205106A (en) Refractory conductor
JPS6214452A (en) Lead frame for semiconductor
JPS6417450A (en) Formation of bump
JP4914009B2 (en) Electrical conductor

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20120621

Year of fee payment: 14

FPAY Annual fee payment

Payment date: 20130621

Year of fee payment: 15

LAPS Lapse due to unpaid annual fee