KR970018459A - Solder ball adsorption device with groove adsorption port - Google Patents

Solder ball adsorption device with groove adsorption port Download PDF

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Publication number
KR970018459A
KR970018459A KR1019950033404A KR19950033404A KR970018459A KR 970018459 A KR970018459 A KR 970018459A KR 1019950033404 A KR1019950033404 A KR 1019950033404A KR 19950033404 A KR19950033404 A KR 19950033404A KR 970018459 A KR970018459 A KR 970018459A
Authority
KR
South Korea
Prior art keywords
adsorption
solder ball
tube
vacuum
suction hole
Prior art date
Application number
KR1019950033404A
Other languages
Korean (ko)
Inventor
조영래
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950033404A priority Critical patent/KR970018459A/en
Publication of KR970018459A publication Critical patent/KR970018459A/en

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Abstract

본 발명은 볼 그리드 어레이 패키지의 솔더 볼을 흡착하여 볼 그리드 어레이 기판 상에 솔더 볼을 공급하는 장치에 관한 것으로, BGA 기판상에 형성된 솔더 패드들에 각기 대응되어 안착될 솔더 볼들이 흡착된 흡착장치의 흡착부에 그 솔더볼들의 흡착을 강화시키는 흡착 요흠을 형성시키는 제조된 BGA 패키지의 신뢰성을 보장할 수 있는 것을 특징으로 한다.The present invention relates to an apparatus for supplying solder balls on a ball grid array substrate by adsorbing solder balls of a ball grid array package, and an apparatus for adsorbing solder balls to be seated corresponding to solder pads formed on a BGA substrate, respectively. It is characterized in that the reliability of the manufactured BGA package to form the adsorption recesses to enhance the adsorption of the solder balls in the adsorption portion of the.

Description

요흠 흡착구를 갖는 솔도 볼 흡착장치Soldo Ball Adsorption System

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제3도는 본 발명에 의한 고정 요흠을 갖는 솔더 볼 흡착장치를 나타내는 사시도.3 is a perspective view showing a solder ball adsorption device having a fixed recess according to the present invention.

제4도는 제3도의 B-B선 단면도.4 is a cross-sectional view taken along the line B-B in FIG.

Claims (3)

적어도 하나 이상의 진공 관통관과, 그 진공 관통관이 내재된 지주부와; 그 지주부의 일측 말단부에 설치되어 있으며, 상기 진공관에 1 : 1로 대응되며 솔더 볼이 각기 대응되어 흡착될 적어도 하나 이상의 흡착구와 그 흡착구가 일측 상면 상에 형성된 흡착부를 포함하는 솔더 볼 흡착장치에 있어서, 흡착될 솔더 볼의 흡착 효율을 증대하기 위해 상기 흡착구에 곡형의 요흠이 형성된 요흠 흡착구를 갖는 것을 특징으로 하는 요흠 흡착구를 갖는 솔더 볼 흡착장치.At least one vacuum through tube and a support portion in which the vacuum through tube is embedded; A solder ball adsorption device which is installed at one end of the support portion and has a one-to-one correspondence to the vacuum tube and includes at least one adsorption port to which the solder balls are respectively corresponded and the adsorption port is formed on one side of the upper surface. The solder ball adsorption apparatus having a recessed suction hole, wherein the suction hole has a recessed suction hole formed with a curved recess in the suction hole to increase the suction efficiency of the solder ball to be adsorbed. 제1항에 있어서, 상기 요흠 흡착구의 형상이 반구형인 것을 특징으로 하는 요흠 흡착구를 갖는 솔더 볼 흡착장치.The solder ball adsorption device having a recessed hole suction hole according to claim 1, wherein the recessed hole suction hole has a hemispherical shape. 제1항에 있어서, 상기 진공 관통관이 주 진공 관통관과 적어도 하나 이상의 부 진공 관통관으로 분리 설치된 것을 특징으로 하는 요흠 흡착구를 갖는 솔더 볼 흡착장치.The solder ball adsorption apparatus according to claim 1, wherein the vacuum through tube is separated into a main vacuum through tube and at least one sub vacuum through tube. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950033404A 1995-09-30 1995-09-30 Solder ball adsorption device with groove adsorption port KR970018459A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950033404A KR970018459A (en) 1995-09-30 1995-09-30 Solder ball adsorption device with groove adsorption port

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950033404A KR970018459A (en) 1995-09-30 1995-09-30 Solder ball adsorption device with groove adsorption port

Publications (1)

Publication Number Publication Date
KR970018459A true KR970018459A (en) 1997-04-30

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ID=66583245

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950033404A KR970018459A (en) 1995-09-30 1995-09-30 Solder ball adsorption device with groove adsorption port

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KR (1) KR970018459A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100320384B1 (en) * 1999-04-12 2002-01-12 이영철 A Solder-Ball Bumping Machine for Semiconductor Packaging System
KR100479914B1 (en) * 1997-09-22 2005-06-16 삼성테크윈 주식회사 Solder ball holding apparatus for bga type ic package
KR20220001741A (en) * 2020-06-30 2022-01-06 (주)대일테크 Vacuum jig apparatus for processing

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100479914B1 (en) * 1997-09-22 2005-06-16 삼성테크윈 주식회사 Solder ball holding apparatus for bga type ic package
KR100320384B1 (en) * 1999-04-12 2002-01-12 이영철 A Solder-Ball Bumping Machine for Semiconductor Packaging System
KR20220001741A (en) * 2020-06-30 2022-01-06 (주)대일테크 Vacuum jig apparatus for processing

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