KR970018459A - Solder ball adsorption device with groove adsorption port - Google Patents
Solder ball adsorption device with groove adsorption port Download PDFInfo
- Publication number
- KR970018459A KR970018459A KR1019950033404A KR19950033404A KR970018459A KR 970018459 A KR970018459 A KR 970018459A KR 1019950033404 A KR1019950033404 A KR 1019950033404A KR 19950033404 A KR19950033404 A KR 19950033404A KR 970018459 A KR970018459 A KR 970018459A
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- KR
- South Korea
- Prior art keywords
- adsorption
- solder ball
- tube
- vacuum
- suction hole
- Prior art date
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
본 발명은 볼 그리드 어레이 패키지의 솔더 볼을 흡착하여 볼 그리드 어레이 기판 상에 솔더 볼을 공급하는 장치에 관한 것으로, BGA 기판상에 형성된 솔더 패드들에 각기 대응되어 안착될 솔더 볼들이 흡착된 흡착장치의 흡착부에 그 솔더볼들의 흡착을 강화시키는 흡착 요흠을 형성시키는 제조된 BGA 패키지의 신뢰성을 보장할 수 있는 것을 특징으로 한다.The present invention relates to an apparatus for supplying solder balls on a ball grid array substrate by adsorbing solder balls of a ball grid array package, and an apparatus for adsorbing solder balls to be seated corresponding to solder pads formed on a BGA substrate, respectively. It is characterized in that the reliability of the manufactured BGA package to form the adsorption recesses to enhance the adsorption of the solder balls in the adsorption portion of the.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제3도는 본 발명에 의한 고정 요흠을 갖는 솔더 볼 흡착장치를 나타내는 사시도.3 is a perspective view showing a solder ball adsorption device having a fixed recess according to the present invention.
제4도는 제3도의 B-B선 단면도.4 is a cross-sectional view taken along the line B-B in FIG.
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950033404A KR970018459A (en) | 1995-09-30 | 1995-09-30 | Solder ball adsorption device with groove adsorption port |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950033404A KR970018459A (en) | 1995-09-30 | 1995-09-30 | Solder ball adsorption device with groove adsorption port |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970018459A true KR970018459A (en) | 1997-04-30 |
Family
ID=66583245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950033404A KR970018459A (en) | 1995-09-30 | 1995-09-30 | Solder ball adsorption device with groove adsorption port |
Country Status (1)
Country | Link |
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KR (1) | KR970018459A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100320384B1 (en) * | 1999-04-12 | 2002-01-12 | 이영철 | A Solder-Ball Bumping Machine for Semiconductor Packaging System |
KR100479914B1 (en) * | 1997-09-22 | 2005-06-16 | 삼성테크윈 주식회사 | Solder ball holding apparatus for bga type ic package |
KR20220001741A (en) * | 2020-06-30 | 2022-01-06 | (주)대일테크 | Vacuum jig apparatus for processing |
-
1995
- 1995-09-30 KR KR1019950033404A patent/KR970018459A/en not_active Application Discontinuation
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100479914B1 (en) * | 1997-09-22 | 2005-06-16 | 삼성테크윈 주식회사 | Solder ball holding apparatus for bga type ic package |
KR100320384B1 (en) * | 1999-04-12 | 2002-01-12 | 이영철 | A Solder-Ball Bumping Machine for Semiconductor Packaging System |
KR20220001741A (en) * | 2020-06-30 | 2022-01-06 | (주)대일테크 | Vacuum jig apparatus for processing |
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Legal Events
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WITN | Withdrawal due to no request for examination |