KR970018017A - Wafer mounting method for ion implantation - Google Patents

Wafer mounting method for ion implantation Download PDF

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Publication number
KR970018017A
KR970018017A KR1019950031662A KR19950031662A KR970018017A KR 970018017 A KR970018017 A KR 970018017A KR 1019950031662 A KR1019950031662 A KR 1019950031662A KR 19950031662 A KR19950031662 A KR 19950031662A KR 970018017 A KR970018017 A KR 970018017A
Authority
KR
South Korea
Prior art keywords
wafer
disk
mounting method
ion implantation
wafer mounting
Prior art date
Application number
KR1019950031662A
Other languages
Korean (ko)
Other versions
KR0151082B1 (en
Inventor
김성주
윤수한
신동진
윤재임
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950031662A priority Critical patent/KR0151082B1/en
Publication of KR970018017A publication Critical patent/KR970018017A/en
Application granted granted Critical
Publication of KR0151082B1 publication Critical patent/KR0151082B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68771—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting more than one semiconductor substrate

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 이온 주입을 위한 웨이퍼 장착 방법에 관해 개시한다. 본 발명에 따른 웨이퍼를 디스크에 장착할 때 디스크의 중앙에서 웨이퍼를 가로지르는 선을 세로축이라 하면 이 세로축과 직교하는 가로축과 웨이퍼의 플랫존이 이루는 각도가 45。보다 더 크게 함으로 웨이퍼의 수율을 향상시키고, 또한 이온 주입이 완료되어 디스크로부터 오리엔트부로 옮겨지는 웨이퍼들은 안정한 상태로 놓여져 웨이퍼들을 카세트로 되옮기는 과정에서 웨이퍼가 손상되거나 또는 드래깅(dragging)에 의한 웨이퍼의 깨어짐을 방지할 수 있다.The present invention discloses a wafer mounting method for ion implantation. When the wafer according to the present invention is mounted on the disk, the vertical axis is a line crossing the wafer at the center of the disk, so that the angle between the horizontal axis orthogonal to the vertical axis and the flat zone of the wafer is greater than 45 ° to improve the yield of the wafer. In addition, the wafers that are ion implanted and transferred from the disk to the orient portion may be placed in a stable state to prevent the wafer from being damaged or broken by dragging during the process of transferring the wafers to the cassette.

Description

이온 주입을 위한 웨이퍼 장착 방법Wafer mounting method for ion implantation

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제5도는 본 발명에 의해 디스크에 장착된 하나의 웨이퍼를 도시한 평면도이다,5 is a plan view showing one wafer mounted on a disk according to the present invention.

제6도는 상기 제5도의 웨이퍼를 카세트에 장착한 상태를 도시한 평면도이다,6 is a plan view showing a state in which the wafer of FIG. 5 is mounted in a cassette.

제7도는 상기 제6도에 도시한 웨이퍼의 단면도이다.FIG. 7 is a cross-sectional view of the wafer shown in FIG.

Claims (1)

이온 주입장치에 사용되는 디스크에 웨이퍼를 장착하는 방법에 있어서, 상기 웨이퍼에 형성된 플랫존이 디스크의 중앙에서 웨이퍼를 가로지르는 세로축에 대해 직각인 가로축과 이루는 각도를 45°보다 더 크게하는 것을 특징으로 하는 웨이퍼 장착 방법.A method of mounting a wafer on a disk for use in an ion implanter, wherein the flat zone formed in the wafer has an angle greater than 45 ° that forms a horizontal axis perpendicular to the longitudinal axis across the wafer at the center of the disk. Wafer mounting method. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950031662A 1995-09-25 1995-09-25 Wafer putting method for ion implant KR0151082B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950031662A KR0151082B1 (en) 1995-09-25 1995-09-25 Wafer putting method for ion implant

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950031662A KR0151082B1 (en) 1995-09-25 1995-09-25 Wafer putting method for ion implant

Publications (2)

Publication Number Publication Date
KR970018017A true KR970018017A (en) 1997-04-30
KR0151082B1 KR0151082B1 (en) 1998-12-01

Family

ID=19427753

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950031662A KR0151082B1 (en) 1995-09-25 1995-09-25 Wafer putting method for ion implant

Country Status (1)

Country Link
KR (1) KR0151082B1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100671159B1 (en) * 2005-08-25 2007-01-17 동부일렉트로닉스 주식회사 Method for arranging semiconductor wafer to ion-beam in disk-type implant

Also Published As

Publication number Publication date
KR0151082B1 (en) 1998-12-01

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