KR970017999A - Sputtering device with improved collimator - Google Patents
Sputtering device with improved collimator Download PDFInfo
- Publication number
- KR970017999A KR970017999A KR1019950032999A KR19950032999A KR970017999A KR 970017999 A KR970017999 A KR 970017999A KR 1019950032999 A KR1019950032999 A KR 1019950032999A KR 19950032999 A KR19950032999 A KR 19950032999A KR 970017999 A KR970017999 A KR 970017999A
- Authority
- KR
- South Korea
- Prior art keywords
- collimator
- sputtering apparatus
- wafer
- heated
- sputtered particles
- Prior art date
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- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
스퍼터된 입자가 증착되는 것을 방지하는 구조를 갖는 콜리메이터를 구비하는 스퍼터장치가 개시된다.Disclosed is a sputtering apparatus having a collimator having a structure for preventing the sputtered particles from being deposited.
본 발명에 따른 스퍼터링장치는 챔버, 웨이퍼를 지지하는 지지대, 스퍼터소스, 상기 스퍼터소스로부터 스퍼터링된 입자의 직선성을 향상시켜 상기 웨이퍼에 투사시키기 위한 벌집모양의 콜리메이터를 갖는 스퍼터링장치에 있어서, 상기 콜리메이터는 전류도전에 의해 가열되는 가열체로 제조된 것임을 특징으로 한다.The sputtering apparatus according to the present invention is a sputtering apparatus having a chamber, a support for supporting a wafer, a sputter source, and a honeycomb collimator for projecting onto the wafer by improving the linearity of the sputtered particles from the sputter source. Is characterized in that it is made of a heating body heated by current conduction.
본 발명에 따른 스퍼터링장치에서는 콜리메이터에 증착되는 알루미늄이 다시 기화되거나 증착속도가 감소되어 웨이퍼에 증착되는 알루미늄이 감소되는 것을 방지하는 효과가 있다.The sputtering apparatus according to the present invention has the effect of preventing the aluminum deposited on the collimator is vaporized again or the deposition rate is reduced to reduce the aluminum deposited on the wafer.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제6도는 본 발명의 스퍼터링장치에 사용된 콜리에메터를 위에서 본 구조를 보이는 도면이다.6 is a view showing the structure of the collimator used in the sputtering apparatus of the present invention seen from above.
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950032999A KR970017999A (en) | 1995-09-29 | 1995-09-29 | Sputtering device with improved collimator |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950032999A KR970017999A (en) | 1995-09-29 | 1995-09-29 | Sputtering device with improved collimator |
Publications (1)
Publication Number | Publication Date |
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KR970017999A true KR970017999A (en) | 1997-04-30 |
Family
ID=66616118
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950032999A KR970017999A (en) | 1995-09-29 | 1995-09-29 | Sputtering device with improved collimator |
Country Status (1)
Country | Link |
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KR (1) | KR970017999A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017074633A1 (en) * | 2015-10-27 | 2017-05-04 | Applied Materials, Inc. | Biasable flux optimizer/collimator for pvd sputter chamber |
-
1995
- 1995-09-29 KR KR1019950032999A patent/KR970017999A/en not_active Application Discontinuation
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2017074633A1 (en) * | 2015-10-27 | 2017-05-04 | Applied Materials, Inc. | Biasable flux optimizer/collimator for pvd sputter chamber |
US10347474B2 (en) | 2015-10-27 | 2019-07-09 | Applied Materials, Inc. | Biasable flux optimizer / collimator for PVD sputter chamber |
US10727033B2 (en) | 2015-10-27 | 2020-07-28 | Applied Materials, Inc. | Biasable flux optimizer / collimator for PVD sputter chamber |
US11309169B2 (en) | 2015-10-27 | 2022-04-19 | Applied Materials, Inc. | Biasable flux optimizer / collimator for PVD sputter chamber |
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WITN | Withdrawal due to no request for examination |