KR970014567A - Semiconductor device test device - Google Patents

Semiconductor device test device Download PDF

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Publication number
KR970014567A
KR970014567A KR1019950031418A KR19950031418A KR970014567A KR 970014567 A KR970014567 A KR 970014567A KR 1019950031418 A KR1019950031418 A KR 1019950031418A KR 19950031418 A KR19950031418 A KR 19950031418A KR 970014567 A KR970014567 A KR 970014567A
Authority
KR
South Korea
Prior art keywords
semiconductor device
lead
pusher
contactor
plunger
Prior art date
Application number
KR1019950031418A
Other languages
Korean (ko)
Other versions
KR0166788B1 (en
Inventor
강정호
Original Assignee
문정환
Lg 반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 문정환, Lg 반도체 주식회사 filed Critical 문정환
Priority to KR1019950031418A priority Critical patent/KR0166788B1/en
Publication of KR970014567A publication Critical patent/KR970014567A/en
Application granted granted Critical
Publication of KR0166788B1 publication Critical patent/KR0166788B1/en

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Environmental & Geological Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

본 발명은 반도체소자 테스트시 반도체소자를 소켓에 삽입하지 않도고 간단히 테스트 장치에 로딩하여 테스트를 수행할 수 있을 뿐만 아니라, 오픈 탑형 소켓 및 캄형 소켓보다 사용 수명이 연장됨과 동시에 반도체소자의 장착시 발생하는 리드 밴트 현상을 감소시킬 수 있도록 한 것이다.The present invention not only inserts a semiconductor device into a socket when testing a semiconductor device, but also can be loaded and loaded into a test apparatus to perform a test, and also extends the service life of an open top socket and a cam type socket and occurs when the semiconductor device is mounted. This is to reduce the lead bent phenomenon.

이를 위해, 본 발명은 베이스(1)의 상면에 설치되며 테스트되는 반도체소자(2)가 안착되는 네스트(3)와, 상기 네스트(3)에 안착된 반도체소자(2)의 리드(4)와 일정 간격 이격 설치된 상태에서 외력에 의해 변위되어 반도체소자(2)의 리드(4)에 접촉되는 접촉자(5)와, 상기 접촉자(5)를 밀어 반도체소자(2)의 리드(4)에 접촉자(5)를 접촉시킨 전기적으로 접속되도록 하는 푸싱 수단으로 구성된 반도체 소자 테스트 장치이다.To this end, the present invention is a nest (3) is installed on the upper surface of the base 1 and the semiconductor device 2 to be tested, and the lead (4) of the semiconductor device 2 seated on the nest (3) and A contactor 5 which is displaced by an external force and is in contact with the lead 4 of the semiconductor element 2 in a spaced apart state, and the contactor 5 pushes the contactor 5 to the lead 4 of the semiconductor element 2. It is a semiconductor element test apparatus comprised of the pushing means which is made to electrically connect and contacted 5).

Description

반도체소자 테스트 장치Semiconductor device test device

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 반도체소자 테스트 장치를 나타낸 평면도,1 is a plan view showing a semiconductor device test apparatus of the present invention,

제2도는 제2도의 A-A선을 나타낸 종단면도,FIG. 2 is a longitudinal sectional view showing the A-A line of FIG.

제3도는 본 발명에 따른 정방형 바의 작동상태를 나타낸 평면도.3 is a plan view showing an operating state of the square bar according to the present invention.

Claims (5)

베이스의 상면에 설치되며 테스트되는 반도체소자가 안착되는 네스트와, 상기 네스트에 안착된 반도체소자의 리드와 일정 간격 이격 설치된 상태에서 외력에 의해 변위되어 반도체소자의 리드에 접촉되는 접촉자와, 상기 접촉자를 밀어 반도체소자의 리드에 접촉자를 접촉시켜 전기적으로 접속되도록 하는 푸싱 수단으로 구성된 것을 특징으로 하는 반도체소자 테스트 장치.Nest that is installed on the upper surface of the base and the semiconductor device being tested is seated, a contactor which is displaced by external force in contact with the lead of the semiconductor device in a state spaced apart from the lead of the semiconductor device seated on the nest at a predetermined interval, the contactor And a pushing means for pushing and contacting the contact with the leads of the semiconductor element so as to be electrically connected. 제1항에 있어서, 상기 푸싱 수단은 고정프레임에 결합되며 내장된 플런저를 전진 또는 후진시키는 구동실린더와, 상기 플런저의 선단에 장착되어 플런저와 함께 직선운동하는 랙과, 상기 랙에 맞물려 랙의 직선운동을 회전운동으로 변환시키는 피니언과, 상기 피니언과 결합되어 플런저의 전 후진시 베이스에 고정된 회전축을 중심으로 피니언과 함께 로테이션하는 정방형 바(Quad Bar)와, 상기 정방형 바의 각 모서리에 대응되게 설치되어 정방형 바의 회전운동시 탄성부재인 인장스프링의 탄력을 받으며 정방형 바의 외주면에 접한 상태로 베이스에 형성된 각 장공을 따라 수평이동하는 각 푸셔축과, 상기 각 푸셔축 상부에 결합되어 푸셔축과 함께 이동하면서 접촉자를 리드와 접속 및 분리시키는 푸셔 어셈블리로 구성되는 반도체소자 테스트 장치.According to claim 1, The pushing means is coupled to the fixed frame drive cylinder for advancing or retracting the built-in plunger, a rack mounted on the front end of the plunger and linear movement with the plunger, the rack linearly engaged with the rack A pinion for converting a motion into a rotational motion, a square bar coupled with the pinion to rotate together with the pinion about a rotation axis fixed to the base when the plunger moves forward, and corresponding to each corner of the square bar. Each pusher shaft installed horizontally along each long hole formed in the base while receiving elasticity of the tension spring, which is an elastic member, in contact with the outer circumferential surface of the square bar, and the pusher shaft coupled to the upper pusher shaft. And a pusher assembly configured to connect and disconnect the contactor from the lead while moving together with the lead. 제2항에 있어서, 상기 각 푸셔 어셈블리의 하부에 안내턱이 형성된 LM 가이드를 설치하여 상기 안내턱에 푸셔 어셈블리의 설치홈이 결합되도록 함을 특징으로 하는 반도체소자 테스트 장치.The semiconductor device test apparatus according to claim 2, wherein an LM guide having guide jaws formed in the lower parts of the pusher assemblies is installed to couple the installation grooves of the pusher assembly to the guide jaws. 제2항에 있어서, 각 푸셔 어셈블리의 일측에 상기 푸셔 어셈블리의 직선 운동량을 제어함과 동시에 직선 운동시 발생되는 운동에너지를 흡수하기 위한 완충기를 설치함을 특징으로 하는 반도체소자 테스트 장치.The semiconductor device test apparatus according to claim 2, wherein a buffer is provided on one side of each pusher assembly to control the linear momentum of the pusher assembly and to absorb the kinetic energy generated during the linear motion. 제2항에 있어서, 상기 각 푸셔축의 하단 외주면에는 구동실린더에 장착된 플런저의 전 ·후진에 따라 연동하는 정방형 바와 푸셔축과의 상대운동시 발생하는 마찰력을 감소시키기 위한 볼 베어링이 장착되는 반도체소자 테스트 장치.3. The semiconductor device according to claim 2, wherein the lower outer circumferential surface of each pusher shaft is provided with a ball bearing for reducing a frictional force generated during relative movement with a square bar and a pusher shaft which interlock with the plunger mounted on the driving cylinder. Testing device. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950031418A 1995-09-22 1995-09-22 Semiconductor device tester KR0166788B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950031418A KR0166788B1 (en) 1995-09-22 1995-09-22 Semiconductor device tester

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950031418A KR0166788B1 (en) 1995-09-22 1995-09-22 Semiconductor device tester

Publications (2)

Publication Number Publication Date
KR970014567A true KR970014567A (en) 1997-04-28
KR0166788B1 KR0166788B1 (en) 1999-03-20

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KR1019950031418A KR0166788B1 (en) 1995-09-22 1995-09-22 Semiconductor device tester

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395747B1 (en) * 2000-12-09 2003-08-27 내일시스템주식회사 Contact device of handler

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100618392B1 (en) * 2003-10-09 2006-08-30 한미반도체 주식회사 Back-light block for Semiconductor vision system
KR102654553B1 (en) * 2023-12-13 2024-04-04 주식회사 프로이천 Nest plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100395747B1 (en) * 2000-12-09 2003-08-27 내일시스템주식회사 Contact device of handler

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Publication number Publication date
KR0166788B1 (en) 1999-03-20

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