KR970013141A - Known Good Die Manufacturing Equipment Using Package - Google Patents

Known Good Die Manufacturing Equipment Using Package Download PDF

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Publication number
KR970013141A
KR970013141A KR1019950027674A KR19950027674A KR970013141A KR 970013141 A KR970013141 A KR 970013141A KR 1019950027674 A KR1019950027674 A KR 1019950027674A KR 19950027674 A KR19950027674 A KR 19950027674A KR 970013141 A KR970013141 A KR 970013141A
Authority
KR
South Korea
Prior art keywords
chip
good die
known good
package
leads
Prior art date
Application number
KR1019950027674A
Other languages
Korean (ko)
Inventor
김강수
이영민
Original Assignee
김광호
삼성전자 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950027674A priority Critical patent/KR970013141A/en
Publication of KR970013141A publication Critical patent/KR970013141A/en

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Abstract

본 발명은 노운 굿 다이 제조장치에 관한 것으로, 내부리드들과, 그 내부리드들에 각기 대응된 외부리드들과; 상기 내부리드들의 일부분의 내재·봉지되어 있으며, 상기 칩이 착탈되도록 일측면이 개방된 패키지 몸체와; 상기 내부리드들이 실장될 칩의 본딩패드들에 각기 대응하여 전기적 연결되도록 상기 칩의 일측면을 압착하는 누름판과 그 누름판과 일체형이며, 상기 일측면상이 개방된 패키지 몸체의 상부면에 재치되는 부분을 갖는 덮개를 포함하는 것을 패키지를 이용한 노운 굿 다이 제조장치를 제공함으로써, 저가의 노운 굿 다이의 제조 및 대량생산을 할 수 있는 특징을 갖는다.The present invention relates to a known good die manufacturing apparatus, comprising: inner leads and outer leads respectively corresponding to the inner leads; A package body in which an inner portion of the inner leads is encapsulated and opened, and one side of which is opened to detach the chip; The inner plate is integral with the pressing plate and the pressing plate for pressing one side of the chip so as to be electrically connected to the bonding pads of the chip to be mounted, and the one side is mounted on the upper surface of the open package body. By providing a known good die manufacturing apparatus using a package including a lid having a cover, it is possible to manufacture and mass-produce a low cost known good die.

Description

패키지를 이용한 노운 굿 다이 제조장치Known Good Die Manufacturing Equipment Using Package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1A도는 본 발명의 실시예에 의한 패키지를 이용한 노운 굿 다이 제조장치를 나타내는 분리 사시도,1A is an exploded perspective view showing a no-good die manufacturing apparatus using a package according to an embodiment of the present invention,

제1B도는 제1A의 단면도,1B is a cross-sectional view of FIG. 1A,

제2도는 본 발명의 다른 실시예에 의한 패키지를 이용한 노운 굿 다이 제조장치를 나타내는 분리 사시도.Figure 2 is an exploded perspective view showing a good good die manufacturing apparatus using a package according to another embodiment of the present invention.

Claims (5)

노운 굿 다이를 제조하는 장치에 있어서, 내부리드들과; 그 내부리드들에 각기 대응된 외부리드들과; 상기 내부리드들의 일부분이 내재·봉지되어 있으며, 상기 칩이 착탈되도록 일측면이 개방된 패키지 몸체와; 상기 내부리드들이 실장될 칩의 본딩패드들에 각기 대응하여 전기적 연결되도록 상기 칩의 일측면을 압착하는 누름판과, 그 누름판과 일체형이며, 상기 일측면상이 개방된 패키지 몸체의 상부면에 재치되는 부분을 갖는 덮개를 포함하는 것을 패키지를 이용한 노운 굿 다이 제조장치.An apparatus for manufacturing a known good die, comprising: internal leads; External leads corresponding to the internal leads, respectively; A portion of the inner lead is enclosed and encapsulated, and a package body having one side open to detach the chip; A pressing plate for pressing one side of the chip to be electrically connected to the bonding pads of the chip to be mounted, and an integral part of the pressing plate, the portion being mounted on the upper surface of the open package body. Known good die manufacturing apparatus using a package that includes a cover having a. 제1항에 있어서, 상기 칩의 본딩패드들과 각기 대응되어 전기적 연결되기 위해 내부리드들의 상부면상의 소정 영역에 범프가 형성된 것을 패키지를 이용한 노운 굿 다이 제조장치.The apparatus of claim 1, wherein bumps are formed in predetermined regions on the upper surfaces of the inner leads in order to be electrically connected to the bonding pads of the chip, respectively. 제1항에 있어서, 상기 내부리드들의 하부면에 상기 패키지 몸체에 고정하기 위해 폴리이미드 테이프가 부착된 것을 패키지를 이용한 노운 굿 다이 제조장치.The apparatus of claim 1, wherein the polyimide tape is attached to the lower surfaces of the inner leads to fix the package body. 제1항에 있어서, 상기 실장될 칩과 상기 내부리드들의 기계적 접촉을 방지하기 위해 상기 내부리드들의 상면상에 완층 테이프가 부착된 것을 패키지를 이용한 노운 굿 다이 제조장치.The apparatus of claim 1, wherein a complete tape is attached to the upper surfaces of the inner leads to prevent mechanical contact between the chip to be mounted and the inner leads. 제4항에 있어서, 상기 완층 테이프가 일면 접착성 폴리이미드 테이프인 것을 패키지를 이용한 노운 굿 다이 제조장치.The know-good die manufacturing apparatus using the package of Claim 4 whose said completed layer tape is a single-sided adhesive polyimide tape.
KR1019950027674A 1995-08-30 1995-08-30 Known Good Die Manufacturing Equipment Using Package KR970013141A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950027674A KR970013141A (en) 1995-08-30 1995-08-30 Known Good Die Manufacturing Equipment Using Package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950027674A KR970013141A (en) 1995-08-30 1995-08-30 Known Good Die Manufacturing Equipment Using Package

Publications (1)

Publication Number Publication Date
KR970013141A true KR970013141A (en) 1997-03-29

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950027674A KR970013141A (en) 1995-08-30 1995-08-30 Known Good Die Manufacturing Equipment Using Package

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KR (1) KR970013141A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100416658B1 (en) * 2001-06-28 2004-01-31 동부전자 주식회사 Flip chip type semiconductor package
KR100439934B1 (en) * 2001-12-28 2004-07-12 동부전자 주식회사 spring ceramic pin grid array package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100416658B1 (en) * 2001-06-28 2004-01-31 동부전자 주식회사 Flip chip type semiconductor package
KR100439934B1 (en) * 2001-12-28 2004-07-12 동부전자 주식회사 spring ceramic pin grid array package

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