KR970013141A - Known Good Die Manufacturing Equipment Using Package - Google Patents
Known Good Die Manufacturing Equipment Using Package Download PDFInfo
- Publication number
- KR970013141A KR970013141A KR1019950027674A KR19950027674A KR970013141A KR 970013141 A KR970013141 A KR 970013141A KR 1019950027674 A KR1019950027674 A KR 1019950027674A KR 19950027674 A KR19950027674 A KR 19950027674A KR 970013141 A KR970013141 A KR 970013141A
- Authority
- KR
- South Korea
- Prior art keywords
- chip
- good die
- known good
- package
- leads
- Prior art date
Links
Abstract
본 발명은 노운 굿 다이 제조장치에 관한 것으로, 내부리드들과, 그 내부리드들에 각기 대응된 외부리드들과; 상기 내부리드들의 일부분의 내재·봉지되어 있으며, 상기 칩이 착탈되도록 일측면이 개방된 패키지 몸체와; 상기 내부리드들이 실장될 칩의 본딩패드들에 각기 대응하여 전기적 연결되도록 상기 칩의 일측면을 압착하는 누름판과 그 누름판과 일체형이며, 상기 일측면상이 개방된 패키지 몸체의 상부면에 재치되는 부분을 갖는 덮개를 포함하는 것을 패키지를 이용한 노운 굿 다이 제조장치를 제공함으로써, 저가의 노운 굿 다이의 제조 및 대량생산을 할 수 있는 특징을 갖는다.The present invention relates to a known good die manufacturing apparatus, comprising: inner leads and outer leads respectively corresponding to the inner leads; A package body in which an inner portion of the inner leads is encapsulated and opened, and one side of which is opened to detach the chip; The inner plate is integral with the pressing plate and the pressing plate for pressing one side of the chip so as to be electrically connected to the bonding pads of the chip to be mounted, and the one side is mounted on the upper surface of the open package body. By providing a known good die manufacturing apparatus using a package including a lid having a cover, it is possible to manufacture and mass-produce a low cost known good die.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.
제1A도는 본 발명의 실시예에 의한 패키지를 이용한 노운 굿 다이 제조장치를 나타내는 분리 사시도,1A is an exploded perspective view showing a no-good die manufacturing apparatus using a package according to an embodiment of the present invention,
제1B도는 제1A의 단면도,1B is a cross-sectional view of FIG. 1A,
제2도는 본 발명의 다른 실시예에 의한 패키지를 이용한 노운 굿 다이 제조장치를 나타내는 분리 사시도.Figure 2 is an exploded perspective view showing a good good die manufacturing apparatus using a package according to another embodiment of the present invention.
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950027674A KR970013141A (en) | 1995-08-30 | 1995-08-30 | Known Good Die Manufacturing Equipment Using Package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950027674A KR970013141A (en) | 1995-08-30 | 1995-08-30 | Known Good Die Manufacturing Equipment Using Package |
Publications (1)
Publication Number | Publication Date |
---|---|
KR970013141A true KR970013141A (en) | 1997-03-29 |
Family
ID=66596819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950027674A KR970013141A (en) | 1995-08-30 | 1995-08-30 | Known Good Die Manufacturing Equipment Using Package |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR970013141A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100416658B1 (en) * | 2001-06-28 | 2004-01-31 | 동부전자 주식회사 | Flip chip type semiconductor package |
KR100439934B1 (en) * | 2001-12-28 | 2004-07-12 | 동부전자 주식회사 | spring ceramic pin grid array package |
-
1995
- 1995-08-30 KR KR1019950027674A patent/KR970013141A/en not_active Application Discontinuation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100416658B1 (en) * | 2001-06-28 | 2004-01-31 | 동부전자 주식회사 | Flip chip type semiconductor package |
KR100439934B1 (en) * | 2001-12-28 | 2004-07-12 | 동부전자 주식회사 | spring ceramic pin grid array package |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR970077555A (en) | Stacked bottom lead package | |
KR950004467A (en) | Semiconductor device and manufacturing method | |
KR970018433A (en) | Connection structure for attaching semiconductor device to substrate | |
JPS63249345A (en) | Flexible mounting substrate | |
KR940001363A (en) | Low Profile Overmolded Pad Array Semiconductor Device and Manufacturing Method Thereof | |
KR980006167A (en) | Bottom Lead Semiconductor Package | |
KR970013141A (en) | Known Good Die Manufacturing Equipment Using Package | |
JPS6352461A (en) | Semiconductor device | |
JPS63200550A (en) | Lead frame | |
JPH0521698A (en) | Semiconductor device | |
JPH06103731B2 (en) | Semiconductor package | |
KR100218335B1 (en) | Chip-sized package | |
KR890001183A (en) | Semiconductor device | |
KR100273226B1 (en) | Bottom leaded plastic package and fabricating method thereof | |
JPH0366150A (en) | Semiconductor integrated circuit device | |
JPS61199052U (en) | ||
KR200286322Y1 (en) | Semiconductor package | |
KR970013255A (en) | Grooved leadframe pads and chip packages using them | |
KR920010851A (en) | Resin-sealed semiconductor device | |
KR950034695A (en) | Reverse laminated ultra-thin package and manufacturing method | |
JPH0316344U (en) | ||
JPH02105495A (en) | Hybrid integrated circuit device | |
KR970013254A (en) | Chip Packages with Die Pads for Thermal Stress Reduction | |
JPS6352430A (en) | Semiconductor device | |
JPH0493051A (en) | Thin module |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
WITN | Withdrawal due to no request for examination |