KR970010110B1 - Ceramic substrate for power module and manufacturing method of the same - Google Patents

Ceramic substrate for power module and manufacturing method of the same Download PDF

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Publication number
KR970010110B1
KR970010110B1 KR94019573A KR19940019573A KR970010110B1 KR 970010110 B1 KR970010110 B1 KR 970010110B1 KR 94019573 A KR94019573 A KR 94019573A KR 19940019573 A KR19940019573 A KR 19940019573A KR 970010110 B1 KR970010110 B1 KR 970010110B1
Authority
KR
South Korea
Prior art keywords
base material
manufacturing
same
power module
ceramic substrate
Prior art date
Application number
KR94019573A
Other languages
Korean (ko)
Other versions
KR960009812A (en
Inventor
Heung-Kyu Kwon
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to KR94019573A priority Critical patent/KR970010110B1/en
Publication of KR960009812A publication Critical patent/KR960009812A/en
Application granted granted Critical
Publication of KR970010110B1 publication Critical patent/KR970010110B1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H05K2201/066—Heatsink mounted on the surface of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

At the center of the ceramic base material(11) made of rectangular alumina, at least more than one slot is formed. And two seats(13) are formed on the base material to install semiconductor devices such as a power transistor. The wiring pattern(12) and semiconductor chip are bonded to wire. At the bottom of the base material(11) on which wiring pattern(12) is formed, a heat sink thin film(14) made of high conductive metal, such as copper, aluminum, and silver is formed for a better adhesion with heat sink. Therefore by forming slot on the ceramic base material, deformation caused by heat stress or mechanical reason can be prevented.
KR94019573A 1994-08-09 1994-08-09 Ceramic substrate for power module and manufacturing method of the same KR970010110B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR94019573A KR970010110B1 (en) 1994-08-09 1994-08-09 Ceramic substrate for power module and manufacturing method of the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR94019573A KR970010110B1 (en) 1994-08-09 1994-08-09 Ceramic substrate for power module and manufacturing method of the same

Publications (2)

Publication Number Publication Date
KR960009812A KR960009812A (en) 1996-03-22
KR970010110B1 true KR970010110B1 (en) 1997-06-21

Family

ID=19390024

Family Applications (1)

Application Number Title Priority Date Filing Date
KR94019573A KR970010110B1 (en) 1994-08-09 1994-08-09 Ceramic substrate for power module and manufacturing method of the same

Country Status (1)

Country Link
KR (1) KR970010110B1 (en)

Also Published As

Publication number Publication date
KR960009812A (en) 1996-03-22

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