KR970010104A - Anisotropic conductive film - Google Patents

Anisotropic conductive film Download PDF

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Publication number
KR970010104A
KR970010104A KR1019950027166A KR19950027166A KR970010104A KR 970010104 A KR970010104 A KR 970010104A KR 1019950027166 A KR1019950027166 A KR 1019950027166A KR 19950027166 A KR19950027166 A KR 19950027166A KR 970010104 A KR970010104 A KR 970010104A
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KR
South Korea
Prior art keywords
metal
particles
anisotropic conductive
conductive film
particle
Prior art date
Application number
KR1019950027166A
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Korean (ko)
Inventor
정일영
김일용
석재한
강승구
정창범
이해주
Original Assignee
이웅열
주식회사 코오롱
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 이웅열, 주식회사 코오롱 filed Critical 이웅열
Priority to KR1019950027166A priority Critical patent/KR970010104A/en
Publication of KR970010104A publication Critical patent/KR970010104A/en

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Abstract

절연성 접착제 중에 도전성 입자로서 입자경이 작고 경도가 큰 금속 분말 입자와 입자경이 크고 경도가 낮은 고분자 입자 표면에 금속피막을 피복시킨 금속 피복 고분자 입자를 혼합한 것을 사용하여 제조한 이방 전도성 필름은, 다수의 미세회로간의 접속을 접속 두께가 일정하고, 또한 각 접속회로간의 접속저항치의 편차가 극히 작으며, 높은 접속신뢰성을 보이는 우수한 이방 도전성 필름이다.The anisotropic conductive film manufactured by mixing the metal powder particle with small particle diameter and big hardness, and the metal coating polymer particle which coat | covered the metal film on the surface of a polymer particle with a large particle diameter as an electroconductive particle in an insulating adhesive agent is many, It is an excellent anisotropic conductive film in which connection thickness between a microcircuit is constant, the deviation of the connection resistance value between each connection circuit is extremely small, and shows high connection reliability.

Description

이방도전성 필름Anisotropic conductive film

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 본 발명의 일 실시예에 따른 이방 도전성 필름의 개략적인 단면도이고,1 is a schematic cross-sectional view of an anisotropic conductive film according to an embodiment of the present invention,

제2도는 본 발명의 일 실시예에 따른 이방 도전성 필름을 적용한 상태의 회로 기판의 개략적인 단면도이다.2 is a schematic cross-sectional view of a circuit board in which an anisotropic conductive film is applied according to an embodiment of the present invention.

Claims (4)

이형 필름과; 상기 이형 필름위에 절연성 접착제와 도전성 입자를 포함하는 도전층을 포함하는 이방성 도전 필름에 있어서, 상기 도전성 입자의 첨가량은 절연성 접착제중 수지성분에 대해 5~10체적%이며, 상기한 도전성 입자는 금속 입자와 고분자 표면에 금속 분말을 피복시킨 금속 피복 고분자 입자를 포함하며, 상기한 금속 입자는 상기한 금속 피복 고분자 입자 보다 직경이 작으며, 경도는 큰 것을 특징으로 하는 이방 도전성 필름.Release film; In the anisotropic conductive film comprising a conductive layer containing an insulating adhesive and conductive particles on the release film, the amount of the conductive particles added is 5 to 10% by volume relative to the resin component in the insulating adhesive, the conductive particles are metal particles And metal-coated polymer particles coated with metal powder on the surface of the polymer, wherein the metal particles have a smaller diameter and greater hardness than the metal-coated polymer particles. 제1항에 있어서, 상기한 도전성 입자는 각각 입도분포에서 입자경의 편차가 ±0.2㎛인 이방 도전성 필름.The anisotropic conductive film of claim 1, wherein the conductive particles each have a variation in particle diameter of ± 0.2 μm in a particle size distribution. 제1항에 있어서, 상기한 금속 입자와 금속 피복 고분자 입자는 20~40% 범위의 반경차이를 갖는 이방 도전성 필름.The anisotropic conductive film of claim 1, wherein the metal particles and the metal-coated polymer particles have a radius difference of 20 to 40%. 제1항에 있어서, 상기한 금속 입자와 금속 피복 고분자 입자의 배합비는 금속 입자가 30~80체적%인 이방 도전성 필름.The anisotropic conductive film according to claim 1, wherein the mixing ratio of the metal particles and the metal-coated polymer particles is 30 to 80% by volume of the metal particles. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950027166A 1995-08-29 1995-08-29 Anisotropic conductive film KR970010104A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950027166A KR970010104A (en) 1995-08-29 1995-08-29 Anisotropic conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950027166A KR970010104A (en) 1995-08-29 1995-08-29 Anisotropic conductive film

Publications (1)

Publication Number Publication Date
KR970010104A true KR970010104A (en) 1997-03-27

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ID=66596777

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950027166A KR970010104A (en) 1995-08-29 1995-08-29 Anisotropic conductive film

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KR (1) KR970010104A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398314B1 (en) * 2001-07-19 2003-09-19 한국과학기술원 High Adhesion Triple layered anisotropic conductive adhesive film
KR100932088B1 (en) * 2006-11-17 2009-12-16 티디케이가부시기가이샤 Transparent conductive film and manufacturing method thereof
KR101117768B1 (en) * 2004-12-27 2012-03-20 회명산업 주식회사 Anisotropic Conductive Film

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100398314B1 (en) * 2001-07-19 2003-09-19 한국과학기술원 High Adhesion Triple layered anisotropic conductive adhesive film
KR101117768B1 (en) * 2004-12-27 2012-03-20 회명산업 주식회사 Anisotropic Conductive Film
KR100932088B1 (en) * 2006-11-17 2009-12-16 티디케이가부시기가이샤 Transparent conductive film and manufacturing method thereof

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