KR970008453A - Thin Film Thickness Meter SRM for Semiconductor Devices - Google Patents

Thin Film Thickness Meter SRM for Semiconductor Devices Download PDF

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Publication number
KR970008453A
KR970008453A KR1019950023187A KR19950023187A KR970008453A KR 970008453 A KR970008453 A KR 970008453A KR 1019950023187 A KR1019950023187 A KR 1019950023187A KR 19950023187 A KR19950023187 A KR 19950023187A KR 970008453 A KR970008453 A KR 970008453A
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KR
South Korea
Prior art keywords
film thickness
srm
thickness
thin film
same
Prior art date
Application number
KR1019950023187A
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Korean (ko)
Inventor
신정우
마사키 와다
이명섭
Original Assignee
김광호
삼성전자 주식회사
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Application filed by 김광호, 삼성전자 주식회사 filed Critical 김광호
Priority to KR1019950023187A priority Critical patent/KR970008453A/en
Publication of KR970008453A publication Critical patent/KR970008453A/en

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Abstract

반도체장치의 박막두께 계측기 SRM을 개시한다. 더블폴리싱된(Double-Polished)웨이퍼를 사용하여 제작된 박막 두께 계측기 SRM은 고집적 반도체장치의 두께 측정의 정확도를 높일 수 있다. 본 발명에 의하면, 첫째, 더블 폴리싱된 웨이퍼로 제작하여 막두께에 대해서 계측기의 소자 스테이지에 의한 기판의 영향을 고려할 수 있다. 둘째, 동일막 두께에 대해 동일제조조건으로 제조설비, 온도, 가스, 압력등을 적용함으로서, 향후 박막제작시 동일막두께의 재현이 가능하다. 셋째, 여러 다양한 두께별로 나누어(Split thickness)제작 되어 소자의 전스텝에 대해 보증이 가능하다. 50~7000Å까지 50Å 간격으로 나누어진 두께의 SiO2SRM이 제공되었다. 넷째, 8인치 막두께 SRM 제작으로 국제적인 검증을 거쳐 향후 16M, 64M, 256MDRAM인 고집적 소자에 보증할 수 있는 표준 계측기준시료(Standard Reference)로 사용 할 수 있다.A thin film thickness meter SRM of a semiconductor device is disclosed. The thin-film thickness gauge SRM, which is manufactured using double-polished wafers, can increase the accuracy of the thickness measurement of highly integrated semiconductor devices. According to the present invention, first, the influence of the substrate by the device stage of the measuring instrument on the film thickness by fabricating a double polished wafer can be considered. Second, by applying manufacturing facilities, temperature, gas, pressure, etc. to the same manufacturing conditions for the same film thickness, it is possible to reproduce the same film thickness when manufacturing the thin film in the future. Third, the split thickness is manufactured to guarantee the whole step of the device. SiO 2 SRMs were provided with thicknesses separated by 50 ms intervals from 50 to 7000 ms. Fourth, the 8-inch film thickness SRM has been internationally verified and can be used as a standard reference standard to guarantee high integration devices of 16M, 64M, and 256MDRAM in the future.

Description

반도체장치의 박막두께 계측기 SRMThin Film Thickness Meter SRM for Semiconductor Devices

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 더블 폴리싱된 웨이퍼와 싱글 폴리싱된 웨이퍼의 표준 정도 벗어남의 비교 그래프이다.1 is a comparative graph of off-standard deviations of a double polished wafer and a single polished wafer.

Claims (4)

고집적 반도체장치의 박막 두께 계측기에 사용할 수 있는 더블폴리싱된(Double-Polished) 웨이퍼로 제작된 것을 특징으로 하는 SRM.SRM, characterized in that it is made of a double-polished wafer that can be used in the thin film thickness meter of the highly integrated semiconductor device. 제조설비, 온도, 가스, 압력 등 동일공정조건으로 동일두께 제조에 적용해, 향후 동일한 막두께의 재현이 가능한 것을 특징으로 하는 SRM.SRM, which is applied to the same thickness manufacturing under the same process conditions such as manufacturing equipment, temperature, gas, and pressure, so that the same film thickness can be reproduced in the future. 고집적 소자에 대응하기 위해 SiO2막두께를 8인치 웨이퍼로 제작한 것을 특징으로 하는 SRM.SRM, characterized in that the SiO 2 film thickness is made of an 8-inch wafer to cope with the high density device. SiO2두께가 50~7000Å까지 50Å 간격으로 나눠진 두께를 갖는 것을 특징으로 하는 SRM.SRM characterized in that the SiO 2 thickness having a thickness divided by 50Å interval from 50 ~ 7000Å. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950023187A 1995-07-31 1995-07-31 Thin Film Thickness Meter SRM for Semiconductor Devices KR970008453A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950023187A KR970008453A (en) 1995-07-31 1995-07-31 Thin Film Thickness Meter SRM for Semiconductor Devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950023187A KR970008453A (en) 1995-07-31 1995-07-31 Thin Film Thickness Meter SRM for Semiconductor Devices

Publications (1)

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KR970008453A true KR970008453A (en) 1997-02-24

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030001006A (en) * 2001-06-28 2003-01-06 동부전자 주식회사 Wafer having multi thin film

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030001006A (en) * 2001-06-28 2003-01-06 동부전자 주식회사 Wafer having multi thin film

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