KR970004982A - LCD (liquid crystal display) module mounting method - Google Patents

LCD (liquid crystal display) module mounting method Download PDF

Info

Publication number
KR970004982A
KR970004982A KR1019950018034A KR19950018034A KR970004982A KR 970004982 A KR970004982 A KR 970004982A KR 1019950018034 A KR1019950018034 A KR 1019950018034A KR 19950018034 A KR19950018034 A KR 19950018034A KR 970004982 A KR970004982 A KR 970004982A
Authority
KR
South Korea
Prior art keywords
lcd
chip
module mounting
mounting method
lcd module
Prior art date
Application number
KR1019950018034A
Other languages
Korean (ko)
Inventor
김경중
Original Assignee
김주용
현대전자산업 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 김주용, 현대전자산업 주식회사 filed Critical 김주용
Priority to KR1019950018034A priority Critical patent/KR970004982A/en
Publication of KR970004982A publication Critical patent/KR970004982A/en

Links

Landscapes

  • Wire Bonding (AREA)
  • Liquid Crystal (AREA)

Abstract

본 발명은 LCD모듈 실장방법에 관한것으로, 특히 기판 부착시 범프 또는 와이어를 형성하지 않고, 이방성 접착제를 이용하여 IC칩 LCD 또는 보드에 실장함으로써 경박단소형화의 모듈을 형성할 수 있는 LCD모듈 실장방법에 관한 것으로, 반도체 IC를 LCD소자 또는 보드에 부착시키는 공정에서 있어서 종래의 범프 형성을 부착시키는 공정을 배제하고, 기존의 금속 전극부의 소정 부분을 절연 패턴을 이용하여 노출시키고, IC칩과 LCD 또는 보드 사이에 도전형 볼을 포함한 이방성 도전성 접착제 삽입하여 실장함으로써 범프 형성공정의 배제로 기술적 난이도를 줄일 수 있고, 절연층으로 IC의 도전 영역의 폭을 원하는 대로 노출시킬 수 있고, 와이어 본딩 공정의 배제로 경박단소한 모듈을 구성할 수 있으며, 금속 대 금속의 본딩시 오정렬을 방지할 수 있어 소자의 신뢰성을 향상시킬 수 있다.The present invention relates to a method for mounting an LCD module, and in particular, without mounting bumps or wires when attaching a substrate, an LCD module mounting method capable of forming a thin and thin module by mounting on an IC chip LCD or board using an anisotropic adhesive. In the step of attaching the semiconductor IC to the LCD element or board, except for the step of attaching the conventional bump formation, to expose a predetermined portion of the existing metal electrode portion using an insulating pattern, IC chip and LCD or By inserting and mounting an anisotropic conductive adhesive including a conductive ball between boards, the technical difficulty can be reduced by eliminating the bump forming process, and the width of the conductive region of the IC can be exposed as desired with an insulating layer, and the wire bonding process is eliminated. It is possible to configure a light and simple module, and to prevent misalignment when bonding metal to metal. It is possible to improve the reliability.

Description

LCD(liquid crystal display)모듈 실장방법LCD (liquid crystal display) module mounting method

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제4도 및 제5도는 본 발명에 따는 COG 방식의 LCD모듈 실장방법을 나타낸 단면도.4 and 5 are cross-sectional views showing a method of mounting a COG type LCD module according to the present invention.

Claims (8)

반도체 IC칩을 LCD의 ITO전극에 실장하는 LCD모듈 실장방법에 있어서, 상기 IC칩에 절연층을 형성하고, 상기 절연층을 소정의 패턴으로 패터닝하여 상기 IC칩의 도전영역의 일정 부분을 노출시킨 다음, 상기 일정 부분이 노출된 도전 영역과 상기 LCD의 ITO전극을 접착제로 접속하여 실장하는 것을 특징으로 하는 LCD모듈 실장방법.In an LCD module mounting method for mounting a semiconductor IC chip on an ITO electrode of an LCD, an insulating layer is formed on the IC chip, and the insulating layer is patterned in a predetermined pattern to expose a predetermined portion of the conductive region of the IC chip. Next, the LCD module mounting method characterized in that the conductive portion exposed to the predetermined portion and the ITO electrode of the LCD is connected by mounting with an adhesive. 제1항에 있어서, 상기 IC칩의 도전 영역의 노출 폭은 절연 패턴의 폭보다 적은 것을 특징으로 하는 LCD모듈 실장방법.The LCD module mounting method according to claim 1, wherein an exposure width of the conductive region of the IC chip is smaller than a width of the insulating pattern. 제1항에 있어서, 상기 절연패턴은 IC칩의 도전 영역의 일부를 덮고 있는 것을 특징으로 하는 LCD모듈 실장방법.The method of claim 1, wherein the insulating pattern covers a portion of a conductive region of an IC chip. 제1항에 있어서, 상기 LCD의 ITO전극과 노출된 도전영역을 접속하는 공정단계에서, 상기 절연 패턴이 LCD의 ITO전극의 가장자리에 중첩되는 상태에서 행해지는 것을 특징으로 하는 LCD모듈 실장방법.2. The LCD module mounting method according to claim 1, wherein in the process step of connecting the exposed ITO electrode and the ITO electrode of the LCD, the insulating pattern is overlapped with an edge of the ITO electrode of the LCD. 제1항에 있어서, 상기 접착제는 도전성 볼을 포함한 이방성 도전성 접착제인것을 특징으로 하는 LCD모듈 실장방법.The method of claim 1, wherein the adhesive is an anisotropic conductive adhesive including conductive balls. 제1항 또는 제2항에 있어서, 상기 절연 패턴의 폭과 높이는 상기 접착제내의 도전성 볼이 유동할 수 없을 정도의 크기로 형성하는 것을 특징으로 하는 LCD모듈 실장방법.The LCD module mounting method according to claim 1 or 2, wherein the width and height of the insulating pattern are formed to a size such that the conductive balls in the adhesive cannot flow. 반도체 IC칩을 보드에 실장하는 LCD모듈 실장방법에 있어서, 상기 IC칩에 절연층을 형성하고, 상기 절연층을 소정의 패턴으로 패터닝하여 상기 IC칩의 도전 영역의 일정 부분을 노출시킨 다음, 상기 일정 부분이 노출된 도전 영역과 상기 보드를 접착제로 접속하여 실장하는 것을 특징으로 하는 LCD모듈 실장방법.In the LCD module mounting method for mounting a semiconductor IC chip on a board, forming an insulating layer on the IC chip, patterning the insulating layer in a predetermined pattern to expose a predetermined portion of the conductive region of the IC chip, and then LCD module mounting method characterized in that the mounting portion is connected to the conductive area exposed to a certain portion and the board. 제7항에 있어서, 상기 보드와 노출된 도전영역을 접속하는 공정단계에서, 상기 절연 패턴이 LCD의 ITO전극의 가장자리에 중첩되는 상태에서 행해지는 것을 특징으로 하는 LCD모듈 실장방법.8. The LCD module mounting method according to claim 7, wherein in the process step of connecting the board and the exposed conductive region, the insulating pattern is performed in a state overlapping the edge of the ITO electrode of the LCD. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950018034A 1995-06-29 1995-06-29 LCD (liquid crystal display) module mounting method KR970004982A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950018034A KR970004982A (en) 1995-06-29 1995-06-29 LCD (liquid crystal display) module mounting method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950018034A KR970004982A (en) 1995-06-29 1995-06-29 LCD (liquid crystal display) module mounting method

Publications (1)

Publication Number Publication Date
KR970004982A true KR970004982A (en) 1997-01-29

Family

ID=66526030

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019950018034A KR970004982A (en) 1995-06-29 1995-06-29 LCD (liquid crystal display) module mounting method

Country Status (1)

Country Link
KR (1) KR970004982A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100516488B1 (en) * 1998-04-02 2006-02-28 주식회사 엘지생활건강 Manufacturing method of nonionic absorbent and manufacturing method of fabric softener-containing detergent using same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100516488B1 (en) * 1998-04-02 2006-02-28 주식회사 엘지생활건강 Manufacturing method of nonionic absorbent and manufacturing method of fabric softener-containing detergent using same

Similar Documents

Publication Publication Date Title
US7714974B2 (en) Liquid crystal display device and method of fabricating the same
US5084961A (en) Method of mounting circuit on substrate and circuit substrate for use in the method
US7109575B2 (en) Low-cost flexible film package module and method of manufacturing the same
KR970072373A (en) Tape Carrier Package and Liquid Crystal Display
KR960036879A (en) Circuit board connection structure and connection method, and liquid crystal device
KR100242874B1 (en) Liquid crystal display and method of producing the same
KR20030035888A (en) compressive structure of Flexible circuit board
JPH11119241A (en) Printed circuit board structure and lcd module using the structure
CN100407029C (en) Liquid crystal display device and method of fabricating the same
US6111629A (en) Display device
JPH0432541B2 (en)
JP2730536B2 (en) Liquid crystal display
KR100252051B1 (en) Tap tape having a camber protecting layer
KR970004982A (en) LCD (liquid crystal display) module mounting method
JP2004221320A (en) Semiconductor device and method for manufacturing the same
KR100194690B1 (en) Liquid crystal display module
JPH0766518A (en) Wiring circuit board connecting flexible substrate
JPH0643471A (en) Liquid crystal display device
JP3747484B2 (en) Film wiring board and connection structure thereof
CN1327502C (en) Inspection device and method for manufacturing the same, method for manufacturing electro-optic device and method for manufacturing semiconductor device
KR0172899B1 (en) Tcp structure
JP3026205B1 (en) Electronic circuit device and display device
JPH04283722A (en) Liquid crystal display device
JPH11258618A (en) Liquid crystal display element and its manufacture
KR970009492A (en) Chip mounting method using anisotropic film

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E601 Decision to refuse application