KR970003891B1 - A sludge removal apparatus - Google Patents

Abstract

The device for removing sludge residual after a molding process of a semiconductor is characterized by the construction that a semiconductor package assembly(100) having an adhesion of a sludge(102) is held by pick-up tongs in a molding work of an operating unit(3), and is fixed by a pressure on top of a fixation die(10) of a fixation unit(2), and that in such a state, a pushing part(20) installed in an operation space part(11) of the fixation die(10) is pushed by an operation of an air cylinder(4) to a fore direction so as to progress an operation member(30) equipped in length in a slant shape by a slant face(21) in a lower part of an accommodating hole part(13), and that a cutter edge(43) of a cutter(40) set in a fore of the operation member(30) cuts a sludge end(103) minutely connected with a molding part(101) accommodated in a hydraulic hole(13-1) and pushes the sludge(102) to induce and drop the sludge(102) including the sludge end(103) by a drop induction space(14), whereby maximizing a working efficiency by taking a short time in removing sludge.

Description

Sludge removal device remaining after semiconductor molding process

1 is an exploded perspective view showing an example of a sludge removing apparatus according to the present invention.

Figure 2 (a) (b) is an explanatory diagram of the operation relationship of the main part according to the present invention.

Figure 3 (a) (b) is an exploded view of the operating member for removing the sludge in the present invention and a partial example of the fixed state.

Figure 4 (a) (b) (c) (d) is a diagram illustrating the operation of the sludge removal apparatus according to the present invention.

5 is an exemplary view showing a state in which a cutter removes sludge in the present invention in a plan view.

* Description of the symbols for the main parts of the drawings *

1: Sludge removal device 2: Fixing unit

3: moving unit 4: air cylinder

4-1: Air valve 10: Fixture

11: operating space 12: operation guide rod

13: storage hole 13-1: storage hole

14: drop induction space 15: finishing table

16, 17: guider 18: bolt

20: push rod 21: inclined side

22: request 23: return spring

24: roller 30: operating member

31: working arm 32: the back of the head

33: roller 34: support

35: front support piece 36: rear support piece

37: side support piece 38: fixing nut

39: return spring 40: cutter

41: flange 42: fixing hole

43: cutter surface 44: support step

45: bolt 50: upper support

51: upper support rod 52: air cylinder

53: support rod 54: support

55: bolt 56: air valve

57: spring 58: between operation

59: forceps 60: lower limb

61: space 62: storage hole

100: semiconductor package assembly 101: molding part

102: sludge 103: sludge tip

The present invention relates to an apparatus for removing a sludge remaining in the molding portion after mounting the semiconductor chip in the lead frame in order to manufacture a semiconductor package and molded with a resin or the like.

In more detail, a semiconductor chip is mounted on a lead frame and then mounted on a separate injection molding machine to inject a liquid molding resin into the injection molding machine, where the liquid molding resin is formed through each gate. Is injected into the mold. When the molding is completed and solidified by the injection of the liquid resin, the semiconductor package assembly must be separated from the injection molding machine. The semiconductor package assembly to be separated is separated with the resin remaining on the gate of the molding die. As described above, the present invention relates to an apparatus for removing residual resin parts, that is, unnecessary sludge parts, which are attached together to a molding part of a semiconductor package assembly.

Conventionally, the unnecessary sludge portion remaining in the molding portion of the semiconductor package assembly has been taken out of the injection molding machine and removed manually.

The sludge part exposed to the outside of semiconductor package assembly can be easily removed by bending it, but the sludge tip part directly attached to the lead frame together with the molding part can be removed by using separate work tools such as a sharp ripper and bench. Has been removed. However, this manual removal method is extremely inefficient because it takes too much time for removal, and care must be taken to ensure that the molding part of the package is not damaged during removal, and the removal is not neat and smooth. In some cases, the molded part may be damaged, thereby degrading the quality of the semiconductor product.

Accordingly, an object of the present invention is to solve the problems of the conventional sludge removal method by hand, to provide a sludge removal apparatus that can easily control the sludge remaining in the molding portion.

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

1 is a view showing an embodiment in which the present invention is embodied, and (a) (b) of FIG. 2 is an exemplary view showing an operation relationship of main parts according to FIG. In the semiconductor package assembly 100 drawn out from an injection molding machine (not shown), molding portions 101 are formed on the upper and lower sides of each package portion by resin, and the gates are formed in the mold of the molding machine during extrusion. Sludge 102 remaining in the mold (not shown) is also integrally attached to one side of the molding part 101.

In the present invention, a state in which the sludge 102 is attached to the lower side of the semiconductor package assembly 100 will be described by way of example.

1 is a sludge removing apparatus of the present invention, which accommodates a semiconductor package assembly 100 with sludge 102 and a semiconductor package with sludge 102 and a fixing unit 2 to remove sludge 102. The assembly 100 is largely classified into a moving unit 3 which allows the semiconductor package assembly 100 from which the assembly 100 is taken from the injection molding machine and the sludge 102 is removed by the fixing unit 2 to be sent to the next process.

The moving unit 3 is mounted on a separate device (not shown), and the semiconductor package assembly is repeatedly performed while the contact unit is detached from the pair of guiders 16 and 17 provided on the upper side of the fixed unit 2. 100 will be replaced.

The fixing unit 2 is configured as follows.

The length of the working space (11) in the longitudinal direction of the fixing stand 10 in the longitudinal direction of the fixing section 10 is fixed to the finishing table 15 on the upper side of the operating space 11, the lower side is equipped with an air cylinder (4), The working shaft of the air cylinder 4 is equipped with a push rod 20 which is operated in the working space portion 11, but the return spring 23 is mounted at the tip of the push rod 20.

The pusher 20 has a roller 24 on one side thereof and is constricted to the outer side of the working space 11, and on the other side, the inclined side 21 and the request 22 alternately maintain an appropriate length. It is repeated.

The operation guide rod 12 communicates with the operation space 11 and is arranged to be in a line extending at right angles to the inclined side 21, and the drop guide space 14 is inclined at the end of the operation guide rod 12. It is cut, and the upper side of each operation guide rod 12, the recessed storage hole 13 of the storage hole (13-1) is formed in a row arranged in a row while maintaining an appropriate interval with the drop induction space (14) operation guide rod 12 is made to penetrate the lower end of the accommodating hole 13 with the upper surface open.

A pair of guiders 16 and 17 are fixed to the bolts 18 against each other while maintaining proper spacing at both ends of the storage holes 13 arranged in a row. Each operation guide rod 12 is inserted with the operation member 30 as shown in (a) (b) of FIG.

Actuating member 30 is roller 33 is condensed on the back of the head (32) and the other side to form a thin working arm 31 with a gradual monolayer, at the end of the rectangular columnar side support piece 37 and the front surface The inclined front support piece 35 is installed integrally at intervals, and the fixing nut part 38 is provided in these rear parts, and the rear support piece 36 is integrated into the rear side of the fixing nut 38 on the same line. It is. By the way, the cutter 40 is fixed to the fixing nut part 38 as the bolt 45 between these front support pieces 35, the side support pieces 37, and the rear support pieces 36. As shown in FIG.

The cutter 40 has a fixing hole 42 penetrating through the center of the rectangular flange 41, and a support step 44 is protruded from the right side of each cutter surface 43 based on the fixing hole 42. have. In addition, at the lower end of the actuating arm 31, a supporting rod 34 protrudes, and has a return spring 39 at its tip. The return spring 39 is abutted and fixed to the fixing table 10 at the other end.

In addition, the configuration of the movable unit 3 is as follows.

The upper support 50 and the lower support 60 are coupled by supporting rods 54 on both sides and a support 54 in the center. On the upper side of the upper support 50, a pair of upper support rods 51 are placed at intervals to be installed in a separate device.

A pair of air cylinders 53 are mounted on the upper support 50 on both sides of the support section 54. On both sides of each of the air cylinders 53, an operation section 58 which is operated by the inflow and outflow of air is a spring 57. It is compressed by the shaft (58-1) to be shot by the operation between the operation 58, the forceps 59 are coupled to the bolt, the lower support 60 is coupled to the operation force 58 to the forceps (59) The space 61 is formed to operate.

In addition, the lower surface of the base 60, the storage hole 62 is recessed upward while maintaining the same distance as the molding portion 101 to accommodate the upper side of the molding portion 101 of the semiconductor package assembly 100 have.

The operation relationship of the sludge removal apparatus 1 of this invention comprised in this way is demonstrated.

In FIG. 4 (a) (b) (c) (d), an operation process of the sludge removal apparatus 1 is illustrated in detail.

The operation of the sludge removing apparatus 1 according to the present invention will be described after the molding portion 101 is completely molded in the semiconductor package assembly 100 in the injection molding machine, and is drawn out with the sludge 102 attached thereto. .

As shown in (a) of FIG. 4, the moving unit 3 brings the semiconductor package assembly 100 withdrawn from the injection machine. When air is injected into the air valve 56 by a separate device, the air cylinder 52 operates the inter-operation 58, so that the tongs 59 fixed to the inter-operation 58 allow the upper molding portion 101 to be accommodated in the storage hole 62 of the base 60. The package assembly 100 is gripped. As such, the technique of operating the forceps 39 by the injection of air is known in the art, and thus the specific structure and operation relationship of the air cylinder 52 will be omitted.

The movable unit 3 is brought closer to the upper side of the fixing table 10 of the fixing unit 2 by a separate device in a state of holding the semiconductor package assembly 100 to which the sludge 102 is attached, and then the fourth unit. As shown in FIG. 2B, when the semiconductor package assembly 100 is downward, the semiconductor package assembly 100 is inserted between the guiders 16 and 17 on both sides, and the lower molding part 101 is a receiving hole 13 of the receiving hole part 13. It is stored in -1) and detained by the main part.

At this time, the sludge tip 103 is inclinedly exposed to the outside of the front front storage hole 13-1 of the cutter 40 as shown in FIG. 5 and the sludge 102 is extended to the outside of the drop induction space 14. The exposed state.

Thus, the air valve 4 of the air cylinder 4 in the state in which the semiconductor package assembly 100 is located between the lower support zone 60 of the movable unit 3 and the fixed support 10 of the fixed unit 2. When air is supplied to -1), the air cylinder 4 operates as shown in (b) of FIG. 2 to advance the pusher 20. Since the rollers 24 are condensed on the pusher 20, the slide 24 moves smoothly and moves forward, and the pusher 21 pushes the operating member 30 while moving forward the inclined side 21 of the pusher 20. ) Roller 33 is condensed and is pushed while sliding smoothly.

When the operation member 30 advances while extruding the return spring 39 at the lower end, as shown in FIGS. 4 (5) and 5, the cutter 40 mounted in front of the operation arm 31 moves forward. Since the sludge tip 103 is pushed and pushed, the sludge 102 including the sludge tip 103 is detached from the semiconductor package assembly 100 as shown in FIG. 4 (d) to the drop induction space 14. Induced to fall. After the sludge 102 is removed and the air is removed from the air cylinder 4, the push rod 20 is returned to its original state by the elastic force that the compressed return spring 23 is extended.

In this way, when the sludge 102 is removed, the movable unit 3 is raised to move to the next step, and when the air applied to the air cylinder 50 is removed, the tongs 59 are extended to the compressed spring 57. Since the semiconductor package assembly 100 is opened and held to the left and right by the resilience force, the semiconductor package assembly 100 is placed at a specific position for the next process.

Meanwhile, the sludge 102 cut by the cutter 40 may be disposed in a separate collection box and disposed of. In particular, the cutter 40 to be mounted to the operation member 30 in the present invention has a cutter surface 43 is formed on the side of the cutter 40, so that when one side cutter surface 43 is used continuously, the cutter is used. Since 40 can be cut by the other cutter surface 43 by rotating 40, it has a characteristic that it can be used as one cutter 40 for a long time.

The sludge removal apparatus 1 of the present invention can design various shapes of the storage holes 13-1 and 62 according to the type of each package of the semiconductor package assembly 100. And depending on the characteristics, the arrangement can be changed organically.

As described above, the sludge removal apparatus of the present invention is extremely short in time to remove the sludge, thereby maximizing efficiency, and in particular, the cut surface is smoothly and neatly processed to improve the quality of the package.

Claims (7)

During the molding operation of the semiconductor package assembly 100, the semiconductor package assembly 100 having the sludge 102 attached thereto is gripped by the tongs 59 of the moving unit 3 to be mounted on the fixing table 10 of the fixing unit 2. As the push rod 20 mounted on the operating space 11 of the holder 10 in the fixed state is pushed forward by the operation of the air cylinder 4, the operation member 30 mounted inclinedly is stored. The molding which is advanced by the inclined surface 21 at the lower end of the hole 13 and stored in the storage hole 13-1 of the cutter surface 43 of the cutter 40 which is mounted in front of the operating member 30. The sludge 102 including the sludge tip 103 cut and pushed to the sludge 102 while cutting the sludge tip 103 finely spoken with the part 101 is guided by the drop-inducing space 14 to fall. Sludge removal device remaining after semiconductor molding process. According to claim 1, wherein the working space 11 is provided on one side of the fixing stand 10 in the longitudinal direction, the upper side of the operating space 11 is fixed to the finishing table 15 and the lower side of the air cylinder ( 4) is mounted, and the working shaft of the air cylinder (4) after the semiconductor molding process, characterized in that the push rod 20 is provided with a return spring 23 at the tip that is operated in the working space (11). Residual sludge removal device. According to claim 1, wherein the pusher 20 is a roller 24 is condensed on one side and adjacent to the outer side of the working space 11, the other side is inclined side 21 and the request 22 alternately Sludge removal apparatus remaining after the semiconductor molding process, characterized in that it was formed repeatedly. The method of claim 1, wherein the operation guide rod 12 is in communication with the operating space 11 is arranged to be in a line extending at right angles to the inclined side 21, the end of the operation guide rod 12 induction of the drop induction The space 14 is obliquely cut, and the upper side of each of the operation guide rods 12 is arranged in a row in a row while maintaining the space between the drop-inducing space 14 and the storage hole 13, the storage hole 13-1 is recessed The operation guide rod 12 is a sludge removal apparatus remaining after the semiconductor molding process, characterized in that the upper surface is opened to pass through the lower end of the receiving hole (13). According to claim 1, wherein the actuating member 30 has a roller 33 is condensed on the back of the head 32 and the other side to form an actuating arm 31 with a single layer, at the end of the rectangular columnar side support piece 37 ) And the front support piece 35 and the rear support piece 36, in which the front surface is inclined, are integrally placed at intervals, and the fixing nut part 38 is provided at the center thereof to cut the cutter 40 into the bolt 45. Sludge removal device remaining after the semiconductor molding process, characterized in that the fixed. 6. The cutter 40 according to claim 1 or 5, wherein a fixing hole 42 penetrates through a center of a rectangular flange 41, and a right portion of each cutter surface 42 based on the fixing hole 42. The sludge removal apparatus remaining after the semiconductor molding process, characterized in that the protrusion stepped by 44. According to claim 1, wherein the upper support 50 and the lower support 60 is coupled by the lower support rod 53 on both sides and the support between the center 54, the upper support 50 is a pair of upper limbs to the upper side The supporting rods 51 are spaced apart from each other, and a pair of air cylinders 53 are mounted on the lower side, and shafts 58 are provided on both sides of the respective air cylinders 53 so that the operating rod 58 is shot by the springs 57. -1) and the tongs 59 are coupled to the bolts between the operation 58, the space 60 so as to operate the forceps 59 coupled to the operation 58 to the base zone 60. The sludge removal apparatus remaining after the semiconductor molding process characterized by forming 61.