KR970003769U - Heat dissipation device for circuit board integrated circuit elements - Google Patents

Heat dissipation device for circuit board integrated circuit elements

Info

Publication number
KR970003769U
KR970003769U KR2019950013161U KR19950013161U KR970003769U KR 970003769 U KR970003769 U KR 970003769U KR 2019950013161 U KR2019950013161 U KR 2019950013161U KR 19950013161 U KR19950013161 U KR 19950013161U KR 970003769 U KR970003769 U KR 970003769U
Authority
KR
South Korea
Prior art keywords
heat dissipation
dissipation device
circuit board
board integrated
integrated circuit
Prior art date
Application number
KR2019950013161U
Other languages
Korean (ko)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to KR2019950013161U priority Critical patent/KR970003769U/en
Publication of KR970003769U publication Critical patent/KR970003769U/en

Links

KR2019950013161U 1995-06-12 1995-06-12 Heat dissipation device for circuit board integrated circuit elements KR970003769U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950013161U KR970003769U (en) 1995-06-12 1995-06-12 Heat dissipation device for circuit board integrated circuit elements

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950013161U KR970003769U (en) 1995-06-12 1995-06-12 Heat dissipation device for circuit board integrated circuit elements

Publications (1)

Publication Number Publication Date
KR970003769U true KR970003769U (en) 1997-01-24

Family

ID=60871127

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950013161U KR970003769U (en) 1995-06-12 1995-06-12 Heat dissipation device for circuit board integrated circuit elements

Country Status (1)

Country Link
KR (1) KR970003769U (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980030992A (en) * 1996-10-30 1998-07-25 김광호 Heat dissipation method of IC
KR100660126B1 (en) * 2004-06-24 2006-12-21 주식회사에스엘디 A circuit board having heat sink plate
KR100775449B1 (en) * 2005-06-30 2007-11-12 주식회사에스엘디 A circuit board having heat sink layer
KR101388976B1 (en) * 2006-12-01 2014-04-25 엘지디스플레이 주식회사 Tape carrier package

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980030992A (en) * 1996-10-30 1998-07-25 김광호 Heat dissipation method of IC
KR100660126B1 (en) * 2004-06-24 2006-12-21 주식회사에스엘디 A circuit board having heat sink plate
KR100775449B1 (en) * 2005-06-30 2007-11-12 주식회사에스엘디 A circuit board having heat sink layer
KR101388976B1 (en) * 2006-12-01 2014-04-25 엘지디스플레이 주식회사 Tape carrier package

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Legal Events

Date Code Title Description
WITN Withdrawal due to no request for examination