DE29616970U1 - Heat dissipation device for integrated circuit - Google Patents

Heat dissipation device for integrated circuit

Info

Publication number
DE29616970U1
DE29616970U1 DE29616970U DE29616970U DE29616970U1 DE 29616970 U1 DE29616970 U1 DE 29616970U1 DE 29616970 U DE29616970 U DE 29616970U DE 29616970 U DE29616970 U DE 29616970U DE 29616970 U1 DE29616970 U1 DE 29616970U1
Authority
DE
Germany
Prior art keywords
heat dissipation
dissipation device
ribs
integrated circuit
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE29616970U
Other languages
German (de)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
LIN TIEH CHENG
Original Assignee
LIN TIEH CHENG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by LIN TIEH CHENG filed Critical LIN TIEH CHENG
Priority to DE29616970U priority Critical patent/DE29616970U1/en
Publication of DE29616970U1 publication Critical patent/DE29616970U1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Transmitters (AREA)

Description

BESCHREIBUNGDESCRIPTION

Die vorliegende Erfindung betrifft eine Wärmeableitvorrichtung für eine integrierte Schaltung.The present invention relates to a heat dissipation device for an integrated circuit.

Die Wärmeableitvorrichtung soll so ausgebildet werden, daß sie in einfacher Weise an der integrierten Schaltung befestigbar ist und möglichst gute Wärmeableiteigenschaften besitzt.The heat dissipation device should be designed so that it can be easily attached to the integrated circuit and has the best possible heat dissipation properties.

Die Erfindung sowie vorteilhafte Ausgestaltungen der Erfindung sind in den Ansprüchen definiert.The invention and advantageous embodiments of the invention are defined in the claims.

Anhand der Zeichnungen wird ein Ausführungsbeispiel der Erfindung näher erläutert. Es zeigt:An embodiment of the invention is explained in more detail using the drawings. It shows:

Fig. 1 eine Explosionsdarstellung einer Wärmeableitvorrichtung fürFig. 1 is an exploded view of a heat dissipation device for

eine integrierte Schaltung;an integrated circuit;

Fig. 2 eine Draufsicht auf die Wärmeableitvorrichtung;Fig. 2 is a plan view of the heat dissipation device;

Fig. 3 und 4 Detailansichten zum Veranschaulichen des Einsatzes der WärFig. 3 and 4 Detailed views to illustrate the use of heat

meableitvorrichtung.mediversion device.

Die in den Fig. 1 bis 3 gezeigte Wärmeableitvorrichtung kann an einer integrierten Schaltung 2 befestigt werden, um Wärme abzuführen. Die Wärmeableitvorrichtung besitzt eine Platte 3, die beispielsweise durch Klebstoff an der integrierten Schaltung 2 befestigbar ist. Die Platte 3 besitzt mehrere Wandpaare 30, welche eine entsprechende Anzahl von Kanälen (Nuten) 301 bilden. Jede Wand der Wandpaare 30 hat ein Loch oder mehrere Löcher 31, durch die Stifte 50 steckbar sind. Mehrere Rippen 4, die zum Erhöhen der Wärmeleitflächen wellenförmig ausgebildet sind, haben jeweils einen ebenen Bodenabschnitt 40, der in die Kanäle 301 der Platte 3 einsteckbar sind, so daß die Rippen 4 in einfacher Weise an der Platte 3 befestigt werden können. Die Rippen 4 besitzen jeweils ein Loch oder mehrere Löcher 41, durch die Stifte 50 steckbar sind, so daß die Rippen 4 zusätzlich mit der Platte 3 fest verbindbar sind.The heat dissipation device shown in Figures 1 to 3 can be attached to an integrated circuit 2 in order to dissipate heat. The heat dissipation device has a plate 3 which can be attached to the integrated circuit 2, for example by means of adhesive. The plate 3 has several pairs of walls 30 which form a corresponding number of channels (grooves) 301. Each wall of the pairs of walls 30 has one or more holes 31 through which pins 50 can be inserted. Several ribs 4, which are designed in a wave-like manner to increase the heat-conducting surfaces, each have a flat bottom section 40 which can be inserted into the channels 301 of the plate 3, so that the ribs 4 can be attached to the plate 3 in a simple manner. The ribs 4 each have one or more holes 41 through which pins 50 can be inserted, so that the ribs 4 can also be firmly connected to the plate 3.

Wie in Fig. 4 angedeutet, können die Wände der Wandpaare 30 gegen den Bodenabschnitt 40 der Rippen 4 angedrückt werden, um die Rippen 4 zusätzlich an der Platte 3 zu befestigen.As indicated in Fig. 4, the walls of the wall pairs 30 can be pressed against the bottom section 40 of the ribs 4 in order to additionally fasten the ribs 4 to the plate 3.

Claims (4)

PATENTANWÄLTE*"" *"' ··**··*PATENT ATTORNEYS*"" *"' ··**··* DR.-ING. H. NEGENDANK (-1973)DR.-ING. H. NEGENDANK (-1973) HAUCK5 GRAALFS, WEHNERT, DÖRING, SIEMONSHAUCK 5 GRAALFS, WEHNERT, DÖRING, SIEMONS HAMBURG · MÜNCHEN · DÜSSELDORFHAMBURG · MUNICH · DÜSSELDORF Tieh-Cheng LIN M-9217Tieh-Cheng LIN M-9217 No. 252, She-Pi Road
Feng Yuan City
Taichung Hsien
Taiwan, R.o.C.No. 252, She-Pi Road
Fengyuan City
Taichung Hsien
Taiwan, RoC Wärmeableitvorrichtung für integrierte Schaltung 15 Heat dissipation device for integrated circuit 15 SCHUTZANSPRÜCHEPROTECTION CLAIMS 1. Wärmeableitvorrichtung für eine integrierte Schaltung (2), mit einer Platte (3), die an der integrierten Schaltung (2) befestigbar ist, und mehreren Rippen (4), die an der Platte (3) befestigbar sind, dadurch gekennzeichnet, daß die Platte (3) mehrere Kanäle (301) aufweist, in die die Rippen (4) jeweils mit einem ebenen Bodenabschnitt (40) einsetzbar sind.1. Heat dissipation device for an integrated circuit (2), with a plate (3) that can be attached to the integrated circuit (2) and several ribs (4) that can be attached to the plate (3), characterized in that the plate (3) has several channels (301) into which the ribs (4) can each be inserted with a flat bottom section (40). 2. Wärmeableitvorrichtung nach Anspruch 1, dadurch gekennzeichnet, daß die Rippen (4) jeweils wellenförmig ausgebildet sind.2. Heat dissipation device according to claim 1, characterized in that the ribs (4) are each wave-shaped. 3. Wärmeableitvorrichtung nach Anspruch 1 oder 2, dadurch gekennzeichnet, daß die Kanäle (301) von Wandpaaren (30) der Platte (3) gebildet sind.3. Heat dissipation device according to claim 1 or 2, characterized in that the channels (301) are formed by wall pairs (30) of the plate (3). 4. Wärmeableitvorrichtung nach Anspruch 3, dadurch gekennzeichnet, daß die Wände der Wandpaare (30) jeweils ein Loch (31) aufweisen, daß die Rippen (4)4. Heat dissipation device according to claim 3, characterized in that the walls of the wall pairs (30) each have a hole (31), that the ribs (4) jeweils ein Loch (31) aufweisen, daß die Rippen (4) jeweils mindestens ein Loch (41) aufweisen, und daß jeweils ein Stift (50) durch die zueinander ausgerichteten Löcher (315 41) der Wände und der Rippen durchsteckbar ist.each have a hole (31), that the ribs (4) each have at least one hole (41), and that a pin (50) can be pushed through the mutually aligned holes (31 5 41) of the walls and the ribs.
DE29616970U 1996-09-27 1996-09-27 Heat dissipation device for integrated circuit Expired - Lifetime DE29616970U1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE29616970U DE29616970U1 (en) 1996-09-27 1996-09-27 Heat dissipation device for integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE29616970U DE29616970U1 (en) 1996-09-27 1996-09-27 Heat dissipation device for integrated circuit

Publications (1)

Publication Number Publication Date
DE29616970U1 true DE29616970U1 (en) 1996-11-14

Family

ID=8029916

Family Applications (1)

Application Number Title Priority Date Filing Date
DE29616970U Expired - Lifetime DE29616970U1 (en) 1996-09-27 1996-09-27 Heat dissipation device for integrated circuit

Country Status (1)

Country Link
DE (1) DE29616970U1 (en)

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Legal Events

Date Code Title Description
R207 Utility model specification

Effective date: 19970102

R156 Lapse of ip right after 3 years

Effective date: 20000701