KR970003292U - Lead frame guide for semiconductor manufacturing equipment - Google Patents
Lead frame guide for semiconductor manufacturing equipmentInfo
- Publication number
- KR970003292U KR970003292U KR2019950012864U KR19950012864U KR970003292U KR 970003292 U KR970003292 U KR 970003292U KR 2019950012864 U KR2019950012864 U KR 2019950012864U KR 19950012864 U KR19950012864 U KR 19950012864U KR 970003292 U KR970003292 U KR 970003292U
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- semiconductor manufacturing
- manufacturing equipment
- frame guide
- guide
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950012864U KR0122200Y1 (en) | 1995-06-08 | 1995-06-08 | Lead frame guide of semiconductor package equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR2019950012864U KR0122200Y1 (en) | 1995-06-08 | 1995-06-08 | Lead frame guide of semiconductor package equipment |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970003292U true KR970003292U (en) | 1997-01-24 |
KR0122200Y1 KR0122200Y1 (en) | 1998-07-15 |
Family
ID=19415115
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR2019950012864U KR0122200Y1 (en) | 1995-06-08 | 1995-06-08 | Lead frame guide of semiconductor package equipment |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0122200Y1 (en) |
-
1995
- 1995-06-08 KR KR2019950012864U patent/KR0122200Y1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0122200Y1 (en) | 1998-07-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
REGI | Registration of establishment | ||
FPAY | Annual fee payment |
Payment date: 20010504 Year of fee payment: 4 |
|
LAPS | Lapse due to unpaid annual fee |