KR970000449A - 평면연삭 내주칼날 절단 복합가공기 - Google Patents

평면연삭 내주칼날 절단 복합가공기

Info

Publication number
KR970000449A
KR970000449A KR1019960022604A KR19960022604A KR970000449A KR 970000449 A KR970000449 A KR 970000449A KR 1019960022604 A KR1019960022604 A KR 1019960022604A KR 19960022604 A KR19960022604 A KR 19960022604A KR 970000449 A KR970000449 A KR 970000449A
Authority
KR
South Korea
Prior art keywords
inner circumferential
surface grinding
blade cutting
complex machine
circumferential blade
Prior art date
Application number
KR1019960022604A
Other languages
English (en)
Other versions
KR100385428B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of KR970000449A publication Critical patent/KR970000449A/ko
Application granted granted Critical
Publication of KR100385428B1 publication Critical patent/KR100385428B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/003—Multipurpose machines; Equipment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D1/00—Cutting through work characterised by the nature or movement of the cutting member or particular materials not otherwise provided for; Apparatus or machines therefor; Cutting members therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mining & Mineral Resources (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
KR1019960022604A 1995-06-30 1996-06-20 평면연삭 내주칼날 절단 복합가공기 KR100385428B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP18671195A JP3174484B2 (ja) 1995-06-30 1995-06-30 平面研削内周刃切断複合加工機
JP7-186711 1995-06-30

Publications (2)

Publication Number Publication Date
KR970000449A true KR970000449A (ko) 1997-01-21
KR100385428B1 KR100385428B1 (ko) 2003-08-19

Family

ID=16193309

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960022604A KR100385428B1 (ko) 1995-06-30 1996-06-20 평면연삭 내주칼날 절단 복합가공기

Country Status (5)

Country Link
US (1) US5836808A (ko)
EP (1) EP0750972B1 (ko)
JP (1) JP3174484B2 (ko)
KR (1) KR100385428B1 (ko)
DE (1) DE69615463T2 (ko)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102364295B (zh) * 2011-06-30 2013-03-06 常州天合光能有限公司 一种晶锭边皮厚度的测量方法
US9527147B2 (en) 2014-05-30 2016-12-27 Simonds International Llc Saw blade indexing assembly
CN107962488A (zh) * 2016-10-19 2018-04-27 张云清 储尘防火遥控半自动切割机

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2469259A1 (fr) * 1979-08-08 1981-05-22 Radiotechnique Compelec Procede d'elaboration de plaquettes de materiaux durs, notamment de silicium et appareil de mise en oeuvre du procede
JPS61106207A (ja) * 1984-10-31 1986-05-24 株式会社東京精密 ウエハー製造方法並びに装置
JPH01115604A (ja) * 1987-10-29 1989-05-08 Tokyo Seimitsu Co Ltd ウエハの切断装置
DE3884903T2 (de) * 1987-10-29 1994-02-10 Tokyo Seimitsu Co Ltd Vorrichtung und Verfahren zum Abschneiden einer Halbleiterscheibe.
JP2737783B2 (ja) * 1988-02-18 1998-04-08 株式会社 東京精密 ウエハの切断装置
JPH02212729A (ja) * 1989-02-13 1990-08-23 Koorin Denshi Kk 圧力センサ
JP2577653B2 (ja) * 1990-07-10 1997-02-05 フジクリーン工業株式会社 小規模合併処理浄化槽における排出流量の調整装置
JPH0615634A (ja) * 1992-07-02 1994-01-25 Tokyo Seimitsu Co Ltd ウエハのスライシング方法

Also Published As

Publication number Publication date
DE69615463D1 (de) 2001-10-31
US5836808A (en) 1998-11-17
EP0750972A1 (en) 1997-01-02
DE69615463T2 (de) 2002-04-25
JP3174484B2 (ja) 2001-06-11
KR100385428B1 (ko) 2003-08-19
JPH0911227A (ja) 1997-01-14
EP0750972B1 (en) 2001-09-26

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Legal Events

Date Code Title Description
A201 Request for examination
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
LAPS Lapse due to unpaid annual fee