KR960702853A - Epoxy resin composition - Google Patents

Epoxy resin composition Download PDF

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Publication number
KR960702853A
KR960702853A KR1019950705517A KR19950705517A KR960702853A KR 960702853 A KR960702853 A KR 960702853A KR 1019950705517 A KR1019950705517 A KR 1019950705517A KR 19950705517 A KR19950705517 A KR 19950705517A KR 960702853 A KR960702853 A KR 960702853A
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KR
South Korea
Prior art keywords
epoxy resin
resin composition
composition according
curing agent
represent
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KR1019950705517A
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Korean (ko)
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KR100300543B1 (en
Inventor
마사시 가지
다카노리 아라마키
가즈히코 나카하라
히사유키 나기노
Original Assignee
미야자끼 다께시
신닛테쓰 가가꾸 가부시끼가이샤
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Application filed by 미야자끼 다께시, 신닛테쓰 가가꾸 가부시끼가이샤 filed Critical 미야자끼 다께시
Publication of KR960702853A publication Critical patent/KR960702853A/en
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

하기 일반식(1)General formula (1)

(여기에서, G는 글리시딜기를 나타내며, R1∼R8은 수소원자, 할로겐원자 또는 탄소수 1∼6의 탄화수소기를 나타낸다)로 표시되는 에폭시 수지를 결정화시켜서 고체로 만든 후, 여기에 에폭시 수지 경화제를 배합함으로써 얻게되는 에폭시 수지 조성물이며, 유동성이 우수하고, 저흡습성이 뛰어나며, 또 땜질 온도에서의 내열성이 우수한 경화물을 제공할 수 있어 각종 용도에 사용할 수 있는, 특히 반도체 소자 등의 봉지에 적합한 에폭시 수지 조성물이다.Herein, G represents a glycidyl group and R 1 to R 8 represent a hydrogen atom, a halogen atom or a hydrocarbon group having 1 to 6 carbon atoms. It is an epoxy resin composition obtained by blending a curing agent, and can provide a cured product which is excellent in fluidity, excellent in hygroscopicity and excellent in heat resistance at the brazing temperature, and can be used in various applications, particularly for encapsulation such as semiconductor devices. Suitable epoxy resin composition.

Description

에폭시 수지 조성물Epoxy resin composition

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

Claims (6)

하기 일반식(1)General formula (1) (여기에서, G는 글리시딜기를 나타내며, R1∼R8은 수소원자, 할로겐원자 또는 탄소수 1∼6의 탄화수소기를 나타낸다)로 표시되는 에폭시 수지를 결정화시켜서 고체로 만든 후, 여기에 에폭시 수지 경화제를 배합함으로써 얻게되는 에폭시 수지 조성물.Herein, G represents a glycidyl group and R 1 to R 8 represent a hydrogen atom, a halogen atom or a hydrocarbon group having 1 to 6 carbon atoms. The epoxy resin composition obtained by mix | blending a hardening | curing agent. 제1항에 있어서, 에폭시 수지의 융점이 40∼130℃인 것을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, wherein the epoxy resin has a melting point of 40 to 130 ° C. 제1항에 있어서, 에폭시 수지의 에폭시 당량이 250 이하이고, 가수분해 염소 함유량이 1500ppm 이하인 것을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, wherein an epoxy equivalent of the epoxy resin is 250 or less, and the hydrolyzed chlorine content is 1500 ppm or less. 제1항 또는 제2항에 있어서, 에폭시 수지 경화제가 다가 페놀성 화합물인 것을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1 or 2, wherein the epoxy resin curing agent is a polyhydric phenolic compound. 제1항에 있어서, 무기 충전제를 75중량% 이상의 양으로 더 함유함을 특징으로 하는 에폭시 수지 조성물.The epoxy resin composition according to claim 1, further comprising an inorganic filler in an amount of 75% by weight or more. 하기 일반식(1)General formula (1) (여기에서, G는 글리시딜기를 나타내며, R1∼R8은 수소원자, 할로겐원자 또는 탄소수 1∼6의 탄화수소기를 나타낸다)로 표시되는 에폭시 수지를 결정화시켜서 고체로 만든 후, 여기에 에폭시 수지 경화제를 배합하고, 경화시킨 것으로 특징으로 하는 에폭시 수지 경화물.Herein, G represents a glycidyl group and R 1 to R 8 represent a hydrogen atom, a halogen atom or a hydrocarbon group having 1 to 6 carbon atoms. The epoxy resin hardened | cured material which mix | blended the hardening | curing agent and hardened | cured. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950705517A 1993-06-08 1994-06-07 Epoxy Resin Composition KR100300543B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP1993-163930 1993-06-08
JP5163930A JP2825735B2 (en) 1993-06-08 1993-06-08 Epoxy resin composition
PCT/JP1994/000918 WO1994029363A1 (en) 1993-06-08 1994-06-07 Epoxy resin composition

Publications (2)

Publication Number Publication Date
KR960702853A true KR960702853A (en) 1996-05-23
KR100300543B1 KR100300543B1 (en) 2001-11-22

Family

ID=15783532

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Application Number Title Priority Date Filing Date
KR1019950705517A KR100300543B1 (en) 1993-06-08 1994-06-07 Epoxy Resin Composition

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JP (1) JP2825735B2 (en)
KR (1) KR100300543B1 (en)
WO (1) WO1994029363A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3705618B2 (en) * 1994-09-14 2005-10-12 京セラケミカル株式会社 Epoxy resin composition and semiconductor sealing device
JP4576676B2 (en) * 2000-07-04 2010-11-10 東亞合成株式会社 Method for producing tetramethyldiphenylmethane derivative having oxetane ring and tetramethyldiphenylmethane derivative having oxetane ring
TW202124498A (en) * 2019-12-25 2021-07-01 日商日鐵化學材料股份有限公司 Epoxy resin and method for manufacturing same

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62115057A (en) * 1985-11-13 1987-05-26 Mitsubishi Electric Corp Production of epoxy resin composition
JPS62115021A (en) * 1985-11-13 1987-05-26 Mitsubishi Electric Corp Production of epoxy resin composition
JP2544686B2 (en) * 1990-05-28 1996-10-16 ソマール株式会社 Epoxy resin powder composition and method for producing the same
JP2933705B2 (en) * 1990-11-16 1999-08-16 住友ベークライト株式会社 Resin composition
JPH04198211A (en) * 1990-11-27 1992-07-17 Sumitomo Bakelite Co Ltd Resin composition
JPH04372619A (en) * 1991-06-20 1992-12-25 Toshiba Chem Corp One-pack epoxy resin composition

Also Published As

Publication number Publication date
JPH06345850A (en) 1994-12-20
JP2825735B2 (en) 1998-11-18
KR100300543B1 (en) 2001-11-22
WO1994029363A1 (en) 1994-12-22

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