KR960041427A - Electroplating solution of zinc-nickel alloy to improve the nickel deposition ratio and adhesion - Google Patents

Electroplating solution of zinc-nickel alloy to improve the nickel deposition ratio and adhesion Download PDF

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Publication number
KR960041427A
KR960041427A KR1019950011497A KR19950011497A KR960041427A KR 960041427 A KR960041427 A KR 960041427A KR 1019950011497 A KR1019950011497 A KR 1019950011497A KR 19950011497 A KR19950011497 A KR 19950011497A KR 960041427 A KR960041427 A KR 960041427A
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KR
South Korea
Prior art keywords
nickel
zinc
alcohol
electroplating solution
adhesion
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KR1019950011497A
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Korean (ko)
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KR0143483B1 (en
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진영술
김현태
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김만제
포항종합제철 주식회사
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Priority to KR1019950011497A priority Critical patent/KR0143483B1/en
Publication of KR960041427A publication Critical patent/KR960041427A/en
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Publication of KR0143483B1 publication Critical patent/KR0143483B1/en

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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/565—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of zinc

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

본 발명은 아연-니켈 합금 전기도금용액에 관한 것으로, 염화아연과 염화니켈을 주성분으로 하고, 여기에 염화칼륨, 염화나트륨, 염화바륨 및 염화암모늄등을 전도보조제로 사용한 도금욕에, 첨가제로 아릴알콜계 알콜을 적정범위로 첨가하므로서, 도금시 도금충의 니켈석출비 및 밀착성을 향상시킬 수 있는 아연-니켈 합금 전기도금용액을 제공하고자 하는데, 그목적이 있다.The present invention relates to a zinc-nickel alloy electroplating solution, which comprises zinc chloride and nickel chloride as main components, and is added to an aryl alcohol-based plating bath using potassium chloride, sodium chloride, barium chloride and ammonium chloride as conduction aids. By adding an alcohol in an appropriate range, it is to provide a zinc-nickel alloy electroplating solution that can improve the nickel deposition ratio and adhesion of the plated during the plating, the purpose is.

상기한 목적을 달성하기 위한 본 발명은 아연이온 농도 : 1.0-2.0mol/l, 니켈이온 농도 : 0.15-0.5mol/l, 염소이온농도 :5.0-9.0mol/1, 나머지 물로 조성되는 도금액에 아릴알콜계 알콜을 첨가하여 상기 염소이온과 아릴알콜계 알콜과의 몰농도비가 1:0.0005-0.05 범위가 되도록 조정한 것을 특징으로 하는 도금층 니켈 석출비 및 밀착성을 향상시키는 아연-니켈 합금 전기도금용액을 제공함을 그 요지로 한다.The present invention for achieving the above object is zinc ion concentration: 1.0-2.0mol / l, nickel ion concentration: 0.15-0.5mol / l, chlorine ion concentration: 5.0-9.0mol / 1, the aryl in the plating solution composed of the remaining water The zinc-nickel alloy electroplating solution for improving the nickel deposition ratio and adhesion of the plating layer, characterized in that the molar concentration ratio between the chlorine ion and the aryl alcohol alcohol is adjusted to be in the range of 1: 0.0005-0.05 by adding alcohol alcohol. The main point is to provide.

Description

도금층 니켈석출비 및 밀착성을 향상시키는 아연-니켈합금 전기도금용액Electroplating solution of zinc-nickel alloy to improve the nickel deposition ratio and adhesion

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

Claims (2)

아연이온 농도 : 1.0-2.0mol/l, 니켈이온 농도 : 0.15-0.5mol/l, 염소이온농도 : 5.0-9.0mol/l, 나머지 물로 조성되는 도금액에 아릴알콜계 알콜을 첨가하여 상기 염소이온과 아릴알콜계 알콜과의 몰농도비가 1:0.0005-0.05 범위가 되도록 조정한 것을 특징으로 하는 도금층 니켈 석출비 및 밀착성을 향상시키는 아연-니켈 합금 전기도금용액.Zinc ion concentration: 1.0-2.0mol / l, nickel ion concentration: 0.15-0.5mol / l, chlorine ion concentration: 5.0-9.0mol / l, aryl alcohol-based alcohol is added to the plating solution composed of the remaining water Zinc-nickel alloy electroplating solution to improve the nickel deposition ratio and adhesion of the plating layer, characterized in that the molar concentration ratio with the aryl alcohol-based alcohol is 1: 0.0005-0.05 range. 제1항에 있어서, 상기 아릴알콜계 알콜은 1.2 프로펜올(2-propen-1-ol), 1.3 프로펜올(1-propenol-3), 및비닐카비놀(vinylcarbinol) 중 선택된 1종 또는 2종 이상 인것을 특징으로 하는 도금층 니켈석출비 및 밀착성을 향상시키는 아연-니켈 합금 전기도금용액.According to claim 1, wherein the aryl alcohol alcohol is one or two selected from 1.2 propenol (2-propen-1-ol), 1.3 propenol (1-propenol-3), and vinylcarbinol (vinylcarbinol) Zinc-nickel alloy electroplating solution to improve the plating layer nickel deposition ratio and adhesion, characterized in that the above. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950011497A 1995-05-10 1995-05-10 Electroplating solution of zn-ni alloy for improvement of bonding property and ni precipate rate of plating layer KR0143483B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950011497A KR0143483B1 (en) 1995-05-10 1995-05-10 Electroplating solution of zn-ni alloy for improvement of bonding property and ni precipate rate of plating layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950011497A KR0143483B1 (en) 1995-05-10 1995-05-10 Electroplating solution of zn-ni alloy for improvement of bonding property and ni precipate rate of plating layer

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KR960041427A true KR960041427A (en) 1996-12-19
KR0143483B1 KR0143483B1 (en) 1998-08-17

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100417930B1 (en) * 1996-12-26 2004-03-31 주식회사 포스코 Zn-Ni ALLOY ELECTROPLATING SOLUTION

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101464860B1 (en) * 2013-02-06 2014-11-24 인천대학교 산학협력단 Metal seed layer leveler comprising allyl alcohol and method for constructing metal seed layer using the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100417930B1 (en) * 1996-12-26 2004-03-31 주식회사 포스코 Zn-Ni ALLOY ELECTROPLATING SOLUTION

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