KR960040385A - Impact force correction method of wire bonding capillary - Google Patents
Impact force correction method of wire bonding capillary Download PDFInfo
- Publication number
- KR960040385A KR960040385A KR1019950013248A KR19950013248A KR960040385A KR 960040385 A KR960040385 A KR 960040385A KR 1019950013248 A KR1019950013248 A KR 1019950013248A KR 19950013248 A KR19950013248 A KR 19950013248A KR 960040385 A KR960040385 A KR 960040385A
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- KR
- South Korea
- Prior art keywords
- impact force
- measuring
- wire bonding
- measured value
- value obtained
- Prior art date
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- Wire Bonding (AREA)
Abstract
본 발명은 와이어 본딩작업시의 충격력 보정방법에 관한 것이다. 본 발명에 따르면, 리이드프레임 이송장치의 일측부에 설치되어 있는 충격력 측정수단(21)의 상부로 캐퍼러리(22)를 이송시키는 이송단계, 상기 캐퍼러리(22)의 단부를 상기 충격력 측정수단(21)의 센서부(25)를향해 작동시킴으로써 충격력을 측정하는 측정단계, 상기 측정단계에서 구한 측정값을 지정값과 비교하는 비교단계, 상기 측정단계에서 구한 측정값이 상기 지정값의 소정의 범위내에 들어 올 때까지 캐퍼러리의 충격력 조절입력값을 변화시키면서 상기의 측정단계를 반복하는 단계를 포함하는 와이어본딩용 캐피러리의 충격력 보정방법이 제공된다. 본 발명에 따른 와이어본딩용 캐퍼러리의 충격력 측정방법을 사용하면 종래의 텐션게이지를 이용한 정역학적 측정으로부터 탈피하여 와이어본딩 작업시에 실제상황과 동일한 동역학적 충격력을 측정할 수 있다는 장점이 있다.The present invention relates to a method for compensating impact force during wire bonding operation. According to the present invention, a transfer step of transferring the capital 22 to the upper portion of the impact force measuring means 21 installed on one side of the lead frame transfer apparatus, the end of the capacities 22 to the impact force measuring means ( A measurement step of measuring the impact force by operating toward the sensor unit 25 of 21), a comparison step of comparing the measured value obtained in the measuring step with a specified value, and the measured value obtained in the measuring step is a predetermined range of the specified value. There is provided a method of compensating impact force of a wire bonding capillary comprising repeating the above measuring step while changing the impact force adjustment input value of the capper. Using the impact force measuring method of the wire bonding capacities according to the present invention has the advantage that it is possible to measure the same dynamic impact force as the actual situation at the time of wire bonding by avoiding the static measurement using the conventional tension gauge.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명의 방법에 따라서 와이어 본딩용 캐퍼러리의 충격력을 측정할 수 있는 장치를 도시한 상태도이다. 제3도(가)도 및 제3(나)도는 제2도에 도시된 장치를 이용하여 와이어본딩용 캐퍼러리의 충격력을 측정하는 방법을 도시한 상태도이다.2 is a state diagram showing an apparatus capable of measuring the impact force of the wire bonding capacities according to the method of the present invention. 3 (a) and 3 (b) are state diagrams illustrating a method of measuring the impact force of the wire bonding capacities using the apparatus shown in FIG.
Claims (3)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950013248A KR960040385A (en) | 1995-05-25 | 1995-05-25 | Impact force correction method of wire bonding capillary |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950013248A KR960040385A (en) | 1995-05-25 | 1995-05-25 | Impact force correction method of wire bonding capillary |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR960040385A true KR960040385A (en) | 1996-12-17 |
Family
ID=66525783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950013248A KR960040385A (en) | 1995-05-25 | 1995-05-25 | Impact force correction method of wire bonding capillary |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR960040385A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60244032A (en) * | 1984-05-18 | 1985-12-03 | Mitsubishi Electric Corp | Wire bonding device |
| JPH01196839A (en) * | 1988-02-02 | 1989-08-08 | Nec Corp | Wire bonding |
| JPH0294536A (en) * | 1988-09-30 | 1990-04-05 | Nec Yamagata Ltd | Device for measuring bonding load |
| JPH06252210A (en) * | 1993-02-25 | 1994-09-09 | Nec Kansai Ltd | Inner lead bonder |
| JPH0745661A (en) * | 1993-07-26 | 1995-02-14 | Shinkawa Ltd | Bonding load measuring instrument |
-
1995
- 1995-05-25 KR KR1019950013248A patent/KR960040385A/en not_active Application Discontinuation
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60244032A (en) * | 1984-05-18 | 1985-12-03 | Mitsubishi Electric Corp | Wire bonding device |
| JPH01196839A (en) * | 1988-02-02 | 1989-08-08 | Nec Corp | Wire bonding |
| JPH0294536A (en) * | 1988-09-30 | 1990-04-05 | Nec Yamagata Ltd | Device for measuring bonding load |
| JPH06252210A (en) * | 1993-02-25 | 1994-09-09 | Nec Kansai Ltd | Inner lead bonder |
| JPH0745661A (en) * | 1993-07-26 | 1995-02-14 | Shinkawa Ltd | Bonding load measuring instrument |
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Legal Events
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| A201 | Request for examination | ||
| E902 | Notification of reason for refusal | ||
| E601 | Decision to refuse application |