JPH0294536A - Device for measuring bonding load - Google Patents
Device for measuring bonding loadInfo
- Publication number
- JPH0294536A JPH0294536A JP63246505A JP24650588A JPH0294536A JP H0294536 A JPH0294536 A JP H0294536A JP 63246505 A JP63246505 A JP 63246505A JP 24650588 A JP24650588 A JP 24650588A JP H0294536 A JPH0294536 A JP H0294536A
- Authority
- JP
- Japan
- Prior art keywords
- load
- bonding
- piezoelectric element
- wire bonding
- actual
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001514 detection method Methods 0.000 claims description 17
- 238000005259 measurement Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 239000004065 semiconductor Substances 0.000 abstract description 5
- 230000001105 regulatory effect Effects 0.000 abstract 1
- 239000004020 conductor Substances 0.000 description 2
- 238000002788 crimping Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は半導体装置の製造工程におけるダイボンディン
グやワイヤボンディングのボンディング荷重を測定する
装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for measuring bonding loads in die bonding and wire bonding in the manufacturing process of semiconductor devices.
一般に、半導体装置の製造工程におけるダイポンディン
グやワイヤボンディングでは、ボンディング装置がダイ
やワイヤを被ボンデイング物に押圧する荷重、即ちボン
ディング荷重がボンディングの良否に太き（影響するこ
とが知られている。Generally, in die bonding and wire bonding in the manufacturing process of semiconductor devices, it is known that the load with which the bonding device presses the die or wire against the object to be bonded, that is, the bonding load, has a large influence on the quality of the bonding.
このため、半導体装置の製造歩留りを向上するためには
、これらのボンディング荷重を正しく測定することが必
要となる。Therefore, in order to improve the manufacturing yield of semiconductor devices, it is necessary to accurately measure these bonding loads.
従来、この種のボンディング荷重の測定は、例えば第３
図に示すように、ワイヤボンディング装置のキャピラリ
又はウェッジ等のツールＴを取り付けであるアーム部Ａ
にテンションゲージＧを当て、アーム部Ａを下動させた
ときの値を測定して行っている。Conventionally, this type of bonding load measurement has been carried out, for example, at the third
As shown in the figure, arm part A is used to attach a tool T such as a capillary or wedge of a wire bonding device.
This is done by applying a tension gauge G to the position and measuring the value when the arm part A is moved downward.
上述した従来の測定では、ワイヤボンディング装置の静
止荷重を測定することになるため、実際にパッケージや
ダイに加えられる荷重、即ち動荷重を含む全体荷重を測
定することが困難である。In the conventional measurement described above, since the static load of the wire bonding device is measured, it is difficult to measure the load actually applied to the package or die, that is, the entire load including the dynamic load.
したがって、従来では実際にボンディングを行った製品
を後から観察して荷重の適否を判断せざるを得す、自動
ボンディング装置における、品種等の切替え時における
荷重及びワイヤ圧着幅調整等や品質保証面において支障
が生ずるという問題がある。Therefore, in the past, it was necessary to observe the product that was actually bonded afterwards to judge whether the load was appropriate or not.In automatic bonding equipment, it was necessary to adjust the load and wire crimping width when switching products, etc., and to ensure quality. There is a problem in that problems occur in
本発明はボンディング時における実際の荷重を測定可能
な荷重測定装置を提供することを目的とする。SUMMARY OF THE INVENTION An object of the present invention is to provide a load measuring device capable of measuring an actual load during bonding.
（課題を解決するための手段）
本発明のボンディング荷重の測定装置は、基台上に上下
移動可能に支持される圧力荷重検出部と、この圧力荷重
検出部の上部に取着され、かつその上面にボンディング
ツールが押圧される圧電素子と、前記圧力荷重検出部及
び圧電素子を上下移動させ、かつその上下位置を表示す
るマイクロヘッドゲージと、前記圧電素子に電気接続し
て圧電素子からの出力信号に対応した荷重を測定する荷
重測定器とを備えている。(Means for Solving the Problems) The bonding load measuring device of the present invention includes a pressure load detection section that is supported on a base so as to be movable up and down, and a pressure load detection section that is attached to the upper part of the pressure load detection section. a piezoelectric element on the top surface of which a bonding tool is pressed; a micro head gauge that moves the pressure load detection section and the piezoelectric element up and down and displays the vertical position thereof; and an output from the piezoelectric element that is electrically connected to the piezoelectric element. It is equipped with a load measuring device that measures the load corresponding to the signal.
〔作用〕
上述した構成では、実際のボンディング動作と同じ条件
で圧電素子に対してボンディングツールを押圧すれば、
圧電素子は荷重に応じた電気信号を出力し、荷重測定器
ではこの電気信号に基づいてボンディング荷重を測定す
ることが可能となる。[Operation] In the above-described configuration, if the bonding tool is pressed against the piezoelectric element under the same conditions as the actual bonding operation,
The piezoelectric element outputs an electric signal according to the load, and the load measuring device can measure the bonding load based on this electric signal.
次に、本発明を図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の一実施例の斜視図であり、ここではワ
イヤボンディング装置におけるボンディング荷重を測定
する例を示している。FIG. 1 is a perspective view of an embodiment of the present invention, showing an example of measuring a bonding load in a wire bonding device.
図において、１は基台であり、この基台１上には圧力荷
重検出部２を介して圧電素子３を配置している。また、
基台１の隣接位置には圧電素子３の上下位置を調節する
ためのマイクロヘッドゲージ４を配置している。更に、
前記圧力荷重検出部２には、荷重測定器５を電気的に接
続している。In the figure, reference numeral 1 denotes a base, and a piezoelectric element 3 is disposed on this base 1 via a pressure load detection section 2 . Also,
A micro head gauge 4 for adjusting the vertical position of the piezoelectric element 3 is arranged adjacent to the base 1. Furthermore,
A load measuring device 5 is electrically connected to the pressure load detecting section 2 .
第２図に基台１の主要部の拡大断面構造を示す。FIG. 2 shows an enlarged cross-sectional structure of the main parts of the base 1.
基台１に設けた凹部内に圧力荷重検出部２を上下動可能
に載置している。この圧力荷重検出部２の上部には、荷
重圧力に応じた電圧を出力する圧電素子３を搭載し、こ
の圧電素子３に接続される電極端子３ａを下面に露呈さ
せている。また、圧力荷重検出部２は、中央下面に設け
たねじ溝２ａをその下方に配設した回転軸６のねし条６
ａに螺合させ、回転軸６の輪転によって圧力荷重検出部
２及び圧電素子３を上下に移動させるようにしている。A pressure load detection section 2 is placed in a recess provided in a base 1 so as to be movable up and down. A piezoelectric element 3 that outputs a voltage according to the load pressure is mounted on the upper part of the pressure load detection section 2, and an electrode terminal 3a connected to the piezoelectric element 3 is exposed on the lower surface. The pressure load detection unit 2 also detects the threaded thread 6 of the rotating shaft 6, which has a threaded groove 2a provided on the lower center surface below the threaded groove 2a.
a, and the pressure load detection section 2 and the piezoelectric element 3 are moved up and down by rotation of the rotating shaft 6.
この回転軸６の下端には歯車７を取着しており、この歯
車７は中間歯車８を介して前記マイクロヘッドゲージ４
の駆動軸４ａに取着した歯車９に噛み合わせている。こ
のため、マイクロへラドゲージ４の駆動軸４ａを回転さ
せることにより、圧力荷重検出部２を上下動でき、かつ
その位置はマイクロヘッドゲージ４に表示される。A gear 7 is attached to the lower end of this rotating shaft 6, and this gear 7 is connected to the micro head gauge 4 via an intermediate gear 8.
It meshes with a gear 9 attached to a drive shaft 4a. Therefore, by rotating the drive shaft 4a of the micro head gauge 4, the pressure load detection section 2 can be moved up and down, and its position is displayed on the micro head gauge 4.
また、前記圧力荷重検出部２の下面に露呈された電極端
子３ａはスプリングコンタクト機構１０によって基台１
内に配設した導線１１に接続し、更にこの導線１１を通
して前記荷重測定器５に電気接続している。このスプリ
ングコンタクト機構１０は、スプリング力を利用して圧
力荷重検出部２の上下動にかかわらず基台１側との電気
接続を確保する構造である。Further, the electrode terminal 3a exposed on the lower surface of the pressure load detection section 2 is connected to the base 1 by a spring contact mechanism 10.
It is connected to a conductive wire 11 disposed inside, and further electrically connected to the load measuring device 5 through this conductive wire 11. This spring contact mechanism 10 has a structure that uses spring force to ensure electrical connection with the base 1 side regardless of the vertical movement of the pressure load detection section 2.
二の構成によれば、ワイヤボンディングを行う場合と同
様にワイヤボンディング装置のアーム部Ａを下動させて
ウェッジ又はキャピラリ等のツールＴを圧電素子３の上
面に押圧させると、圧電素子３はボンディング荷重によ
って微小変形され、この荷重に応じた電圧が電極端子３
ａに出力される。この出力は基台ｌ内に配設した導線１
１を通して圧力測定器５に出力され、ここで荷重を測定
することができる。According to the second configuration, when the arm part A of the wire bonding device is moved downward and the tool T such as a wedge or capillary is pressed against the upper surface of the piezoelectric element 3, the piezoelectric element 3 is bonded. The electrode terminal 3 is slightly deformed by the load, and a voltage corresponding to this load is applied to the electrode terminal 3.
It is output to a. This output is the conductor 1 installed inside the base l.
1 to the pressure measuring device 5, where the load can be measured.
したがって、この測定では実際にワイヤボンディングを
行う場合と同じ荷重を測定することができ、この値に基
づいて荷重を調整することで好適なワイヤボンディング
を実現し、半導体装置の製造歩留りを向上することが可
能となる。Therefore, this measurement can measure the same load as when actually performing wire bonding, and by adjusting the load based on this value, suitable wire bonding can be achieved and the manufacturing yield of semiconductor devices can be improved. becomes possible.
また、マイクロヘッドゲージ４を調節し、歯車９を介し
て回転軸６を回転することで、圧力荷重検出部２及び圧
電素子３の上下位置を調節でき、圧電素子３の上面を実
際のワイヤボンディング高さ位置に調節することができ
、荷重測定を更に高精度に行うことができる。In addition, by adjusting the micro head gauge 4 and rotating the rotating shaft 6 via the gear 9, the vertical position of the pressure load detection section 2 and the piezoelectric element 3 can be adjusted, and the upper surface of the piezoelectric element 3 can be used for actual wire bonding. The height position can be adjusted, and load measurement can be performed with higher accuracy.
なお、本発明はグイボンディング装置のボンディング荷
重をも同様にして測定することができる。Incidentally, the present invention can also measure the bonding load of the Gui bonding device in the same manner.
以上説明したように本発明は、基台上に支持させた圧電
素子に対して、実際のボンディング動作と同じ条件でボ
ンディングツールを押圧すれば、圧電素子は荷重に応じ
た電気信号を出力し、この電気信号に基づいて荷重測定
器でボンディング荷重を測定することができる。これに
より、実際のボンディング荷重を高精度に測定でき、ボ
ンディング装置の管理を容易にし、かつ製品の一定の品
質管理を達成できる効果がある。As explained above, according to the present invention, if a bonding tool is pressed against a piezoelectric element supported on a base under the same conditions as an actual bonding operation, the piezoelectric element outputs an electric signal according to the load. The bonding load can be measured using a load measuring device based on this electrical signal. Thereby, the actual bonding load can be measured with high precision, the bonding device can be easily managed, and the quality of the product can be controlled to a certain level.
第１図は本発明の一実施例の全体構成を示す斜視図、第
２図は基台の要部の拡大断面図、第３図は従来における
荷重測定方法を示す概念図である。
１・・・基台、２・・・圧力荷重検出部、２ａ・・・ね
じ溝、３・・・圧電素子、３ａ・・・電極端子、４・・
・マイクロヘッドゲージ、４ａ・・・駆動軸、５・・・
荷重測定器、６・・・回転軸、６ａ・・・ねじ条、７・
・・歯車、８・・・中間歯車、９・・・歯車、１０・・
・スプリングコンタクト機構、１１・・・導線、Ａ・・
・アーム部、Ｔ・・・ツール部、Ｇ・・・テンションゲ
ージ。
第１図
第２図
’２／；ｌジ（イｑ：、１音Ｐ
（１苓合FIG. 1 is a perspective view showing the overall configuration of an embodiment of the present invention, FIG. 2 is an enlarged sectional view of the main part of the base, and FIG. 3 is a conceptual diagram showing a conventional load measuring method. DESCRIPTION OF SYMBOLS 1... Base, 2... Pressure load detection part, 2a... Screw groove, 3... Piezoelectric element, 3a... Electrode terminal, 4...
・Micro head gauge, 4a... Drive shaft, 5...
Load measuring device, 6...Rotating shaft, 6a...Threaded thread, 7.
...Gear, 8...Intermediate gear, 9...Gear, 10...
・Spring contact mechanism, 11... Conductor, A...
・Arm part, T...Tool part, G...Tension gauge. Figure 1 Figure 2 '2/;lji (Iq:, 1 sound P (1 蓓合)
Claims (1)
と、この圧力荷重検出部の上部に取着され、かつその上
面にボンディングツールが押圧される圧電素子と、前記
圧力荷重検出部及び圧電素子を上下移動させ、かつその
上下位置を表示するマイクロヘッドゲージと、前記圧電
素子に電気接続して圧電素子からの出力信号に対応した
荷重を測定する荷重測定器とを備えることを特徴とする
ボンディング荷重の測定装置。1. A pressure load detection section that is supported on a base so as to be movable up and down, a piezoelectric element that is attached to the top of the pressure load detection section and on which a bonding tool is pressed, and the pressure load detection section. and a micro head gauge that moves the piezoelectric element up and down and displays its up and down position, and a load measuring device that is electrically connected to the piezoelectric element and measures a load corresponding to an output signal from the piezoelectric element. Bonding load measurement device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63246505A JPH0294536A (en) | 1988-09-30 | 1988-09-30 | Device for measuring bonding load |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63246505A JPH0294536A (en) | 1988-09-30 | 1988-09-30 | Device for measuring bonding load |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0294536A true JPH0294536A (en) | 1990-04-05 |
Family
ID=17149397
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63246505A Pending JPH0294536A (en) | 1988-09-30 | 1988-09-30 | Device for measuring bonding load |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0294536A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960040385A (en) * | 1995-05-25 | 1996-12-17 | 이대원 | Impact force correction method of wire bonding capillary |
-
1988
- 1988-09-30 JP JP63246505A patent/JPH0294536A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR960040385A (en) * | 1995-05-25 | 1996-12-17 | 이대원 | Impact force correction method of wire bonding capillary |
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