KR960035898U - 전자부품 장착기의 칩 검출장치 - Google Patents

전자부품 장착기의 칩 검출장치

Info

Publication number
KR960035898U
KR960035898U KR2019950008701U KR19950008701U KR960035898U KR 960035898 U KR960035898 U KR 960035898U KR 2019950008701 U KR2019950008701 U KR 2019950008701U KR 19950008701 U KR19950008701 U KR 19950008701U KR 960035898 U KR960035898 U KR 960035898U
Authority
KR
South Korea
Prior art keywords
detection device
electronic component
component mounter
chip detection
chip
Prior art date
Application number
KR2019950008701U
Other languages
English (en)
Other versions
KR0124922Y1 (ko
Inventor
신규식
Original Assignee
대우전자주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 대우전자주식회사 filed Critical 대우전자주식회사
Priority to KR2019950008701U priority Critical patent/KR0124922Y1/ko
Publication of KR960035898U publication Critical patent/KR960035898U/ko
Application granted granted Critical
Publication of KR0124922Y1 publication Critical patent/KR0124922Y1/ko

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0813—Controlling of single components prior to mounting, e.g. orientation, component geometry
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices By Optical Means (AREA)
KR2019950008701U 1995-04-26 1995-04-26 전자부품 장착기의 칩 검출장치 KR0124922Y1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019950008701U KR0124922Y1 (ko) 1995-04-26 1995-04-26 전자부품 장착기의 칩 검출장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR2019950008701U KR0124922Y1 (ko) 1995-04-26 1995-04-26 전자부품 장착기의 칩 검출장치

Publications (2)

Publication Number Publication Date
KR960035898U true KR960035898U (ko) 1996-11-21
KR0124922Y1 KR0124922Y1 (ko) 1998-12-15

Family

ID=19412132

Family Applications (1)

Application Number Title Priority Date Filing Date
KR2019950008701U KR0124922Y1 (ko) 1995-04-26 1995-04-26 전자부품 장착기의 칩 검출장치

Country Status (1)

Country Link
KR (1) KR0124922Y1 (ko)

Also Published As

Publication number Publication date
KR0124922Y1 (ko) 1998-12-15

Similar Documents

Publication Publication Date Title
KR970004347A (ko) 반도체 집적회로 장치
KR970003928A (ko) 반도체 장치의 입력 보호 회로
SG74105A1 (en) Semiconductor device method of manufacturing the same circuit board and electronic instrument
KR970020349U (ko) 전자부품 실장장치
KR960003555U (ko) 전자부품 장착기의 칩 유무 검출장치
KR960035898U (ko) 전자부품 장착기의 칩 검출장치
BR9602326A (pt) Dispositivo eletrônico
KR970047375U (ko) 전자기기의 콘넥터 장치
KR970002349A (ko) 인쇄회로기판의 칩부품 장착 상태 검사 장치
KR950007672U (ko) 칩마운터시스템의 pcb 기판유무검출장치
KR960029951U (ko) 전자부품 장착기의 칩부품테이프 보관대
KR950029037U (ko) 칩 마운터의 접착제 도포장치
KR980006047U (ko) 인쇄회로기판의 실리콘 도포장치
KR970019115U (ko) 회로기판 검사장치
KR970011739U (ko) 칩마운터의 인쇄회로기판 지지장치
KR970003783U (ko) 전자부품 장착기의 컷팅장치
KR950016123U (ko) 전자부품 장착장치
KR950002548U (ko) 전자부품 실장장치
KR950002544U (ko) 전자부품 실장장치
KR970064652U (ko) 전자부품삽입검출장치
KR960029955U (ko) 표면실장기의 전자부품 공급장치
KR950016069U (ko) 회로기판의 리드부품 장착장치
KR960019570U (ko) 고속칩 부품장착기의 헤드번호 검출장치
KR960035890U (ko) 전자부품 테이핑벨트장치기
KR960035878U (ko) 전자기기의 회로기판 결합구조

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
REGI Registration of establishment
FPAY Annual fee payment

Payment date: 20010529

Year of fee payment: 4

LAPS Lapse due to unpaid annual fee