KR960035753A - Semiconductor Wafer Marking Method - Google Patents
Semiconductor Wafer Marking Method Download PDFInfo
- Publication number
- KR960035753A KR960035753A KR1019950005736A KR19950005736A KR960035753A KR 960035753 A KR960035753 A KR 960035753A KR 1019950005736 A KR1019950005736 A KR 1019950005736A KR 19950005736 A KR19950005736 A KR 19950005736A KR 960035753 A KR960035753 A KR 960035753A
- Authority
- KR
- South Korea
- Prior art keywords
- marking
- wafer
- semiconductor wafer
- marking method
- ion implantation
- Prior art date
Links
Abstract
본 발명은 반도체 웨이퍼 마킹 방법에 관한 것으로, 이온 주입장치를 이용하여 이온주입될 웨이퍼의 전면에 마스크를 설치하여 웨이퍼상에 얄은 깊이로 이온을 주입시켜 이에의한 착색효과를 통하여 마킹을 구현하는 방법으로, 종래의 마킹 방법에서와 같이, 마킹 후, 마킹 부위가 벗겨지거나 지워지는 문제를 해결함으로써 마킹 형태가 영구적인 양질의 마킹을 얻을 수 있으며, 마킹시 기타 이물질이 발생되지 않도록 하여 종래 브러싱 등의 별도의 공정을 생략할 수 있어 생산성을 향상시킨 것을 특징으로 한다.The present invention relates to a method for marking a semiconductor wafer, by installing a mask on the front surface of the wafer to be ion-injected using an ion implantation device to implant ions at a deep depth on the wafer to implement marking through the coloring effect thereby. As a method, as in the conventional marking method, after marking, the marking part may be peeled off or erased, thereby obtaining a permanent, high quality marking, and preventing other foreign matters from occurring during the marking. The separate process can be omitted, characterized in that the productivity is improved.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제2도는 본 발명에서 이용되는 이온주입장치의 구조를 설명한 개략도.2 is a schematic diagram illustrating the structure of the ion implantation apparatus used in the present invention.
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950005736A KR960035753A (en) | 1995-03-20 | 1995-03-20 | Semiconductor Wafer Marking Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950005736A KR960035753A (en) | 1995-03-20 | 1995-03-20 | Semiconductor Wafer Marking Method |
Publications (1)
Publication Number | Publication Date |
---|---|
KR960035753A true KR960035753A (en) | 1996-10-24 |
Family
ID=66549531
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950005736A KR960035753A (en) | 1995-03-20 | 1995-03-20 | Semiconductor Wafer Marking Method |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR960035753A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100773245B1 (en) * | 2006-12-26 | 2007-11-05 | 동부일렉트로닉스 주식회사 | Method for wafer marking |
-
1995
- 1995-03-20 KR KR1019950005736A patent/KR960035753A/en not_active Application Discontinuation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100773245B1 (en) * | 2006-12-26 | 2007-11-05 | 동부일렉트로닉스 주식회사 | Method for wafer marking |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
AMND | Amendment | ||
E601 | Decision to refuse application | ||
J201 | Request for trial against refusal decision | ||
J301 | Trial decision |
Free format text: TRIAL DECISION FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 19980930 Effective date: 19990430 |