KR960033639A - Laser processing machine - Google Patents

Laser processing machine Download PDF

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Publication number
KR960033639A
KR960033639A KR1019950024853A KR19950024853A KR960033639A KR 960033639 A KR960033639 A KR 960033639A KR 1019950024853 A KR1019950024853 A KR 1019950024853A KR 19950024853 A KR19950024853 A KR 19950024853A KR 960033639 A KR960033639 A KR 960033639A
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KR
South Korea
Prior art keywords
bend
laser processing
processing machine
machine according
bend mirror
Prior art date
Application number
KR1019950024853A
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Korean (ko)
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KR100208421B1 (en
Inventor
에이키치 하야시
미쓰노부 오시무라
쓰카사 마쓰노
히데카즈 사와이
Original Assignee
기타오카 다카시
미쓰비시덴키 가부시키가이샤
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Publication of KR960033639A publication Critical patent/KR960033639A/en
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Publication of KR100208421B1 publication Critical patent/KR100208421B1/en

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0643Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K37/00Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
    • B23K37/003Cooling means
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B7/00Mountings, adjusting means, or light-tight connections, for optical elements
    • G02B7/18Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors
    • G02B7/182Mountings, adjusting means, or light-tight connections, for optical elements for prisms; for mirrors for mirrors

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Mounting And Adjusting Of Optical Elements (AREA)
  • Laser Beam Processing (AREA)

Abstract

간단한 구조로, 벤드미러의 반사면의 정밀도를 유지할 수가 있고, 레이저광의 광로의 조정등의 쉬운, 레이저 가공기를 얻는 것이 목적이다. 레이저광(1)을 반사하는 벤드미러(5)와, 이 벤드미러(5)를 부착한 벤드블록(3)과, 이 벤드블록(3)을 고정지지하는 지지대(2)와, 벤드블록(3)과 지지대(2)의 부착조정을 하는 조정용나사(8)∼(9)를 구비한 것이다.It is a simple structure that the accuracy of the reflecting surface of a bend mirror can be maintained, and the objective is to obtain the laser processing machine which is easy to adjust the optical path of a laser beam. A bend mirror 5 reflecting the laser beam 1, a bend block 3 to which the bend mirror 5 is attached, a support 2 for fixing the bend block 3, and a bend block ( 3) and adjusting screws (8) to (9) for adjusting the attachment of the support table (2).

Description

레이저 가공기Laser processing machine

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음Since this is an open matter, no full text was included.

제1도는 이 발명의 실시예 1에 관한 레이저 가공기의 벤드미러 부착부의 구조단면도1 is a structural cross-sectional view of the bend mirror attachment portion of the laser processing machine according to the first embodiment of the present invention.

제2도는 제1도의 구조단면도의 B-B단면FIG. 2 is a cross-sectional view taken along line B-B in FIG.

제3도는 제2도의 구조반면도의 C-C단면도3 is a C-C cross-sectional view of the structural cross-section of FIG.

제4도는 이 발명의 실시예 2에 관한 레이저 가공기의 벤드미러 부착부의 구조단면도4 is a structural cross-sectional view of the bend mirror attachment portion of the laser processing machine according to the second embodiment of the present invention.

제5도는 제1도의 구조단면도를 화살표 A의 방향에서 본 도면5 is a cross-sectional view of the structural cross-sectional view of FIG. 1 viewed from the direction of arrow A. FIG.

제6도는 이 발명의 실시예 3에 관한 벤드미러 부착부의 요체의 구조단면도6 is a structural cross-sectional view of the main body of the bend mirror attachment portion according to the third embodiment of the present invention.

제7도는 이 발명의 실시예 4에 관한 벤드미러 부착부의 요부의 구조단면도7 is a structural sectional view of a main portion of the bend mirror attachment portion according to the fourth embodiment of the present invention.

제8도는 이 발명의 실시예 5에 관한 벤드미러 부착부의 요부의 구조단면도8 is a structural sectional view of a main portion of the bend mirror attachment portion according to the fifth embodiment of the present invention.

제9도는 이 발명의 실시예 6에 관한 벤드미러 부착부의 요부의 구조단면도9 is a structural sectional view of a main portion of the bend mirror attaching portion according to the sixth embodiment of the present invention;

제10도는 이 발명의 실시예7에 관한 벤드미러 부착부의 요부의 구조단면도10 is a structural sectional view of a main portion of the bend mirror attachment portion according to the seventh embodiment of the present invention.

Claims (21)

레이저광을 반사하는 벤드미러와, 이 벤드미러를 부착한 벤드블록과, 이 벤드블록을 고정 지지하는 지지대와, 상기 벤드블록과 상기 지지대의 부착에 대한 조정을 하는 조정수단을 구비한 것을 특징으로 하는 레이저 가공기And a bend mirror for reflecting the laser light, a bend block to which the bend mirror is attached, a support for fixing the bend block, and an adjusting means for adjusting the bend block to the support. Laser processing machine 제1항에 있어서, 벤드블록내부에 냉각수 통로를 구비한 것을 특징으로 하는 레이저가공기The laser processing machine according to claim 1, wherein a coolant passage is provided in the bend block. 제1항 또는 제2항에 있어서, 벤드블록측 부착면과 상기 지지대측 부착면사이에 방진용부재를 구비한 것을 특징으로 하는 레이저 가공기The laser processing machine according to claim 1 or 2, further comprising a dustproof member between the bend block side attachment surface and the support side attachment surface. 제3항에 있어서, 방진용부재로서 자기 "실"을 사용한 것을 특징으로 하는 레이저 가공기4. The laser processing machine according to claim 3, wherein a magnetic "thread" is used as the dustproof member. 벤드미러에 부착구멍을 설치하는 동시에, 상기 벤드미러의 반사면이 벤드블록의 벤드미러 부착용 평면부에 맞대어서 부착되도록 한 구조로 한 것을 특징으로 하는 레이저 가공기And a mounting hole in the bend mirror, and at the same time the reflective surface of the bend mirror is attached to the bend mirror attachment plane portion of the bend block. 제5항에 있어서, 벤드블록의 벤드미러 부착용 평면부에, 평면도 1μ이하로 면의 거칠기 0.05μ이하의 평면절삭가공 또는 평면연마가공을 실시한 것을 특징으로 하는 레이저가공기6. The laser processing machine according to claim 5, wherein the bend mirror attachment plane of the bend block is subjected to planar cutting or planar polishing with a surface roughness of 0.05 mu or less with a flatness of 1 mu or less. 제5항 또는 제6항에 있어서, 벤드미러에 설치하는 부착구멍을 2개소로 하고, 벤드블록의 부착나사 대응부가 레이저광의 편향평면에 대해 직각방향으로 설치된 것을 특징으로 하는 레이저 가공기The laser processing machine according to claim 5 or 6, wherein two mounting holes provided in the bend mirror are provided, and the mounting screw corresponding portions of the bend block are provided at right angles to the deflection plane of the laser beam. 제5항 내지 제7항 중 어느 한 항에 있어서, 벤드미러의 재질을 벤드블록의 재질보다 강성(剛性)이 높은 재질로 한 것을 특징으로 하는 레이저가공기The laser processing machine according to any one of claims 5 to 7, wherein the bend mirror is made of a material having a higher rigidity than that of the bend block. 제5항 내지 제8항 중 어느 한 항에 있어서, 벤드미러를 벤드블록에 부착하는 부착볼트를 단불임나사로 하고, 이 단불임나사와, 상기 벤드미러사이에 스프링을 설치해서 상기 벤드미러를 상기 벤드블록에 압압고정하도록 한 것을 특징으로 하는 기재한 레이저가공기The method according to any one of claims 5 to 8, wherein the attachment bolt for attaching the bend mirror to the bend block is a single sterile screw, and a spring is provided between the short sterile screw and the bend mirror to provide the bend mirror. The above-described laser processing machine, characterized in that the pressing block is fixed to the bend block 제9항에 있어서,스프링과 벤드미러 사이에 와셔를 설치한 것을 특징으로 하는 레이저 가공기The laser processing machine according to claim 9, wherein a washer is provided between the spring and the bend mirror. 제5항 내지 제10항 중 어느 한 항에 있어서, 벤드블록의 벤드미러부착부에 벤드미러의 부착방향을 제한하기 위한 안내부재를 구비한 것을 특징으로 하는 레이저가공기The laser processing machine according to any one of claims 5 to 10, wherein the bend mirror attaching portion of the bend block is provided with a guide member for restricting the attaching direction of the bend mirror. 제11항에 있어서, 안내부재로서, 벤드블록의 벤드미러 부착부 표면에서 돌출한 핀을 설치하고, 벤드미러에 상기 핀이 삽입되는 가이드 구멍을 설치한 것을 특징으로 하는 레이저 가공기12. The laser processing machine according to claim 11, wherein as a guide member, a pin protruding from the surface of the bend mirror attachment portion of the bend block is provided, and a guide hole into which the pin is inserted is provided in the bend mirror. 제5항 내지 제11항 중 어느 한 항에 있어서, 벤드미러의 반사면이 되는 면의, 벤드블록과 맞닿는 부분이외의 부분에만 반사막을 도포한 것을 특징으로 하는 레이저 가공기12. The laser processing machine according to any one of claims 5 to 11, wherein a reflecting film is applied only to a portion other than a portion in contact with the bend block on a surface that is a reflecting surface of the bend mirror. 제5항 내지 제13항 중 어느 한 항에 있어서, 벤드미러중, 그 부착구멍 근방부를 기타의 부분보다 단면두께를 두껍게 한 형상으로 한 것을 특징으로 하는 레이저가공기The laser processing machine according to any one of claims 5 to 13, wherein the bend mirror has a shape in which the vicinity of the attachment hole is made thicker in cross section than other parts. 제5항 내지 제13항 중 어느 한 항에 있어서, 벤드미러중, 그 반사면 상당부를 기타의 부분보다 반사면과 반대측 방향에 단면두께를 두껍게한 형상으로 한 것을 특징으로 하는 레이저 가공기The laser processing machine according to any one of claims 5 to 13, wherein a portion of the bend mirror has a shape in which a substantial portion of the reflecting surface is thickened in a direction opposite to the reflecting surface than other portions. 제5항 내지 제15항 중 어느 한 항에 있어서, 벤드미러중, 그 부착공근방부와 그 반사면 상당부 사이에 절결부를 둔 단면형성으로 한 것을 특징으로 하는 레이저가공기The laser processing machine according to any one of claims 5 to 15, wherein the bend mirror has a cross section formed with a cutout portion between the attaching cavity part and the reflective surface equivalent part. 제5항 내지 제16항 중 어느 한 항에 있어서, 벤드미러의 부착구멍에 뒤 spot facing부를 설치한 것을 특징으로 하는 레이저가공기17. The laser processing machine according to any one of claims 5 to 16, wherein a rear spot facing portion is provided in the attachment hole of the bend mirror. 제5항 내지 제 17항중 어느 한 항에 있어서, 벤드미러의 부착구멍의 내부에, 상기 벤드미러의 재질보다 강성이 높은 재질의 슬리브를 설치한 것을 특징으로 하는 레이저가공기18. The laser processing machine according to any one of claims 5 to 17, wherein a sleeve made of a material having a higher rigidity than that of the bend mirror is provided inside the attachment hole of the bend mirror. 제5항 내지 제18항 중 어느 한 항에 있어서, 벤드미러중, 그 부착구멍이 설치되는 외주부의 재질을 상기 벤드미러의 중심부의 재질보다 강성이 높은 재질로 구성한 것을 특징으로 하는 레이저가공기19. The laser processing machine according to any one of claims 5 to 18, wherein a material of an outer circumferential portion of the bend mirror in which the attachment hole is provided is made of a material having a rigidity higher than that of the center of the bend mirror. 벤드블록에 부착자리를 매설하고, 이 부착자리와 벤드미러를 맞대여 부침으로서 상기 벤드블록에 상기 벤드미러를 고정한 것을 특징으로 하는 레이저가공기A laser processing apparatus comprising: embedding an attachment seat in a bend block, and fixing the bend mirror to the bend block by facing the attachment seat and the bend mirror. 제20항에 있어서, 부착자리의 벤드 미러가 접하는 면에, 평면도 1μ이하로 면의 거치름이 0.05 이하의 경면마감을 한 것을 특징으로 하는 레이저가공기21. The laser processing machine according to claim 20, wherein a surface roughness of 0.05 or less is applied to the surface where the bend mirror of the attachment position is in contact with the planar surface of 1 µm or less. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950024853A 1995-03-28 1995-08-11 Band mirror structure for laser machine KR100208421B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP06940495A JP3178294B2 (en) 1995-03-28 1995-03-28 Laser processing machine
JP95-69404 1995-03-28
JP95-069404 1995-03-28

Publications (2)

Publication Number Publication Date
KR960033639A true KR960033639A (en) 1996-10-22
KR100208421B1 KR100208421B1 (en) 1999-07-15

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KR1019950024853A KR100208421B1 (en) 1995-03-28 1995-08-11 Band mirror structure for laser machine

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JP (1) JP3178294B2 (en)
KR (1) KR100208421B1 (en)
CN (1) CN1040513C (en)
TW (1) TW278059B (en)

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JP2006251752A (en) * 2005-02-14 2006-09-21 Sharp Corp Optical apparatus
JP4785430B2 (en) 2005-06-09 2011-10-05 キヤノン株式会社 Optical element and optical instrument having the optical element
JP4965466B2 (en) 2008-01-10 2012-07-04 三菱電機株式会社 Laser oscillator
WO2015151152A1 (en) 2014-03-31 2015-10-08 ギガフォトン株式会社 Mirror device
CN104400091B (en) * 2014-12-01 2017-03-08 江西洪都航空工业集团有限责任公司 Ream frock for non-aqueous planar end surface
CN105261926B (en) * 2015-11-14 2018-11-23 山东能源重装集团大族再制造有限公司 A kind of laser head, laser and application method comprising the laser head
DE102019122064A1 (en) * 2019-08-16 2021-02-18 Bystronic Laser Ag Processing device for laser processing of a workpiece, parts set for a processing device for laser processing of a workpiece and method for laser processing of a workpiece

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6228094A (en) * 1985-07-30 1987-02-06 Mitsubishi Electric Corp Laser optical device for laser beam processing machine
JPH01113193A (en) * 1987-10-28 1989-05-01 Matsushita Electric Ind Co Ltd Laser beam machine
TW225050B (en) * 1990-11-30 1994-06-11 Hitachi Ltd

Also Published As

Publication number Publication date
CN1132132A (en) 1996-10-02
TW278059B (en) 1996-06-11
CN1040513C (en) 1998-11-04
JP3178294B2 (en) 2001-06-18
KR100208421B1 (en) 1999-07-15
JPH08257782A (en) 1996-10-08

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