KR960032804A - 이방성 도전 매체 및 그 제조 방법, 전기 회로 디바이스 - Google Patents
이방성 도전 매체 및 그 제조 방법, 전기 회로 디바이스 Download PDFInfo
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- KR960032804A KR960032804A KR1019960003003A KR19960003003A KR960032804A KR 960032804 A KR960032804 A KR 960032804A KR 1019960003003 A KR1019960003003 A KR 1019960003003A KR 19960003003 A KR19960003003 A KR 19960003003A KR 960032804 A KR960032804 A KR 960032804A
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- Prior art keywords
- conductive
- liquid precursor
- channel
- pair
- conductive material
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- 238000004519 manufacturing process Methods 0.000 title claims description 4
- 239000004020 conductor Substances 0.000 claims abstract description 10
- 239000012705 liquid precursor Substances 0.000 claims abstract description 10
- 238000000034 method Methods 0.000 claims abstract description 9
- 229910000679 solder Inorganic materials 0.000 claims abstract 4
- 239000011159 matrix material Substances 0.000 claims 4
- 239000007864 aqueous solution Substances 0.000 claims 1
- 238000001035 drying Methods 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 239000007791 liquid phase Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 229910021645 metal ion Inorganic materials 0.000 claims 1
- 230000037361 pathway Effects 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 150000003839 salts Chemical class 0.000 claims 1
- 239000002887 superconductor Substances 0.000 claims 1
- 239000002131 composite material Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/007—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09945—Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S505/00—Superconductor technology: apparatus, material, process
- Y10S505/725—Process of making or treating high tc, above 30 k, superconducting shaped material, article, or device
- Y10S505/739—Molding, coating, shaping, or casting of superconducting material
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Non-Insulated Conductors (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
- Superconductor Devices And Manufacturing Methods Thereof (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Conductive Materials (AREA)
Abstract
본 발명에 따르면, 고밀도 z-방향 상호접속 매체는 z-방향 채널을 갖는 비도전막을 제공하고, z-방향 채널을 도전 재료의 액상 전구체로 채우고, 트랩된 전구체를 z-방향 채널내에서 도전 재료로 변환시키고, z-방향 채널내 도전 재료와 접촉하는 솔더 범프를 형성하는 단계에 의해 제조된다. 특히, 본 발명의 방법은 열 및 기계적 스트레스에 대해 향상된 저항력을 갖는 홀로 튜블러 또는 다공질 도전 통로를 형성하는데 유용하다. 채널은 진공 흡입에 의해 용이하게 채워질 수 있다.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 고밀도, 이방성 도전 복합 매체를 제조하는 단계를 도시하는 블럭도
제2도는 수직 채널을 도전 재료의 액상 전구체로 채우는 예시적인 단계를 개략적으로 예시하는 도면
제3도는 제1도의 공정에 의해 제조된 이방성 도전 복합 매체의 한 실시예를 개략적으로 도시하는 단면도.
Claims (15)
- 이방성 도전 매체(an an isotropically conductive medium)를 제조하는 방법에 있어서, 한쌍의 주표면(a pair of major surfaces)과 상기 표면 사이에 연장된 100 내지 100,000Å 직경의 다수의 채널을 갖는 비도전 매트릭스 재료의 몸체(a body of non-conducting matrix material)를 제공하는 단계와; 상기 채널을 도전 재료의 액상 전구체(a liquid precursor of conductive material)로 채우는 단계와; 상기 액체 전구체를 상기 채널을 통해 도전 경로를 형성하는 도전 재료로 변환하는 단계를 포함하는 이방성 도전 매체 제조 방법.
- 제1항에 있어서, 상기 채널은 진공 흡입(vacuum suction)에 의해 채워지는 이방성 도전 매체 제조 방법.
- 제1항에 있어서, 상기 액상 전구체는 상기 액상을 건조시키고, 상기 건조된 재료를 분해하기 위해 가열함으로써 도전 재료로 변환되는 이방성 도전 매체 제조 방법.
- 제1항에 있어서, 상기 도전 경로와 접촉하는 상기 채널의 단부상에 솔더 범프를 형성하는 단계를 더 포함하는 이방성 도전 매체 제조 방법.
- 제1항 또는 제4항에 있어서, 상기 액상 전구체가 홀로, 튜블러 도전 경로(hollow, tubular conductive paths)를 형성하는 도전 재료로 변환되는 이방성 도전 매체 제조 방법.
- 제1항 또는 제4항에 있어서, 상기 액상 전구체가 다공질 도전 재료로 변환되는 이방성 도전 매체 제조 방법.
- 제1항 또는 제4항에 있어서, 상기 액상 전구체는 금속 이온을 포함하는 수용액(an aqueous solution)을 포함하는 이방성 도전 매체 제조 방법.
- 제1항 또는 제4항에 있어서, 상기 액상 전구체가 고온 초전도체용 전구체를 포함하는 이방성 도전 매체 제조 방법.
- 제1항 또는 제4항에 있어서, 상기 액상 전구체가 용융염(a molten salt)을 포함하는 이방성 도전 매체 제조 방법.
- 한쌍의 주표면과 상기 표면 사이에 연장된 100 내지 100,000Å 직경의 다수의 채널을 갖는 비도전 매트릭스 재료의 몸체와; 상기 주표면상에 적어도 104통로/㎠ 밀도로 튜블러 도전 통로를 형성하는 상기 채널내에 침착된 도전 재료를 포함하는 이방성 도전 매체.
- 제10항에 있어서, 상기 통로에 접점을 형성하는 상기 주표면상의 솔더 범프를 더 포함하는 이방성 도전 매체.
- 한쌍의 주표면과 상기 표면 사이에 연장된 100 내지 100,000Å 직경의 다수의 채널을 갖는 비도전 매트릭스 재료의 몸체와; 상기 주표면상에 적어도 104통로/㎠ 밀도로 도전 통로를 형성하는 상기 채널내에 침착된 도전 재료를 포함하는 이방성 도전 매체.
- 제12항에 있어서, 상기 통로에 접점을 형성하는 상기 주표면상의 솔더 범프를 더 포함하는 이방성 도전 매체.
- 상기 제10항의 이방성 도전 매체에 의해 상호접속된 한쌍의 디바이스를 포함하는 전기 회로 디바이스.
- 상기 제12항의 이방성 도전 매체에 의해 상호접속된 한쌍의 디바이스를 포함하는 전기 회로 디바이스.※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US08/387,142 US5698496A (en) | 1995-02-10 | 1995-02-10 | Method for making an anisotropically conductive composite medium |
US08/387,142 | 1995-02-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR960032804A true KR960032804A (ko) | 1996-09-17 |
KR100347455B1 KR100347455B1 (ko) | 2002-11-02 |
Family
ID=23528652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019960003003A KR100347455B1 (ko) | 1995-02-10 | 1996-02-08 | 이방성도전매체및그제조방법,전기회로디바이스 |
Country Status (6)
Country | Link |
---|---|
US (1) | US5698496A (ko) |
EP (1) | EP0726621B1 (ko) |
JP (1) | JP3441871B2 (ko) |
KR (1) | KR100347455B1 (ko) |
DE (1) | DE69608148T2 (ko) |
TW (1) | TW345765B (ko) |
Families Citing this family (31)
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US5902438A (en) * | 1997-08-13 | 1999-05-11 | Fry's Metals, Inc. | Process for the formation of anisotropic conducting material |
DE19856083A1 (de) * | 1998-12-04 | 2000-06-21 | Siemens Ag | Verbindungsanordnung |
DE10006964C2 (de) | 2000-02-16 | 2002-01-31 | Infineon Technologies Ag | Elektronisches Bauelement mit einer leitenden Verbindung zwischen zwei leitenden Schichten und Verfahren zum Herstellen eines elektronischen Bauelements |
US20030048619A1 (en) * | 2001-06-15 | 2003-03-13 | Kaler Eric W. | Dielectrophoretic assembling of electrically functional microwires |
WO2003062133A2 (en) * | 2002-01-18 | 2003-07-31 | Avery Dennison Corporation | Covered microchamber structures |
DE10392199T5 (de) * | 2002-01-18 | 2005-01-05 | Avery Dennison Corp., Pasadena | Folie mit Mikroarchitektur |
US20030155656A1 (en) * | 2002-01-18 | 2003-08-21 | Chiu Cindy Chia-Wen | Anisotropically conductive film |
EP1612891B1 (en) * | 2003-03-31 | 2011-11-30 | Sumitomo Electric Industries, Ltd. | Anisotropic electrically conductive film and method of producing the same |
DE10359424B4 (de) | 2003-12-17 | 2007-08-02 | Infineon Technologies Ag | Umverdrahtungsplatte für Halbleiterbauteile mit engem Anschlussraster und Verfahren zur Herstellung derselben |
EP1745247B1 (en) | 2004-04-23 | 2015-11-11 | Philip Morris Products S.a.s. | Aerosol generators and methods for producing aerosols |
DE102005033254B4 (de) * | 2005-07-15 | 2008-03-27 | Qimonda Ag | Verfahren zur Herstellung eines Chip-Trägersubstrats aus Silizium mit durchgehenden Kontakten |
US8071179B2 (en) * | 2007-06-29 | 2011-12-06 | Stion Corporation | Methods for infusing one or more materials into nano-voids if nanoporous or nanostructured materials |
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CN107113984B (zh) * | 2014-12-19 | 2019-06-04 | 富士胶片株式会社 | 多层配线基板 |
EP3290399B1 (en) | 2016-08-29 | 2022-03-02 | Infineon Technologies AG | Method for producing a metal-ceramic substrate with a least one via |
KR20180049427A (ko) * | 2016-11-01 | 2018-05-11 | 솔브레인멤시스(주) | 다공성 도전부를 구비하는 이방 도전성 시트 및 그 제조 방법 |
KR20180049839A (ko) * | 2016-11-03 | 2018-05-14 | 솔브레인멤시스(주) | 이방 도전성 시트 |
JP7080879B2 (ja) * | 2017-05-18 | 2022-06-06 | 信越ポリマー株式会社 | 電気コネクターおよびその製造方法 |
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US4008300A (en) * | 1974-10-15 | 1977-02-15 | A & P Products Incorporated | Multi-conductor element and method of making same |
US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
US5045249A (en) * | 1986-12-04 | 1991-09-03 | At&T Bell Laboratories | Electrical interconnection by a composite medium |
EP0560072A3 (en) * | 1992-03-13 | 1993-10-06 | Nitto Denko Corporation | Anisotropic electrically conductive adhesive film and connection structure using the same |
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1995
- 1995-02-10 US US08/387,142 patent/US5698496A/en not_active Expired - Lifetime
- 1995-06-09 TW TW084105900A patent/TW345765B/zh active
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1996
- 1996-01-31 DE DE69608148T patent/DE69608148T2/de not_active Expired - Lifetime
- 1996-01-31 EP EP96300697A patent/EP0726621B1/en not_active Expired - Lifetime
- 1996-02-08 KR KR1019960003003A patent/KR100347455B1/ko not_active IP Right Cessation
- 1996-02-09 JP JP02292796A patent/JP3441871B2/ja not_active Expired - Lifetime
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EP0726621A3 (en) | 1998-05-06 |
US5698496A (en) | 1997-12-16 |
TW345765B (en) | 1998-11-21 |
DE69608148T2 (de) | 2000-09-28 |
EP0726621B1 (en) | 2000-05-10 |
EP0726621A2 (en) | 1996-08-14 |
JP3441871B2 (ja) | 2003-09-02 |
JPH08255520A (ja) | 1996-10-01 |
KR100347455B1 (ko) | 2002-11-02 |
DE69608148D1 (de) | 2000-06-15 |
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