KR960032804A - 이방성 도전 매체 및 그 제조 방법, 전기 회로 디바이스 - Google Patents

이방성 도전 매체 및 그 제조 방법, 전기 회로 디바이스 Download PDF

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KR960032804A
KR960032804A KR1019960003003A KR19960003003A KR960032804A KR 960032804 A KR960032804 A KR 960032804A KR 1019960003003 A KR1019960003003 A KR 1019960003003A KR 19960003003 A KR19960003003 A KR 19960003003A KR 960032804 A KR960032804 A KR 960032804A
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conductive
liquid precursor
channel
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conductive material
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알란 파스트낙스트 리차드
진 성호
쥬 웨이
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이. 이. 파서
에이티앤드티 코포레이션
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
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    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/22Contacts for co-operating by abutting
    • H01R13/24Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
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    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4846Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486Via connections through the substrate with or without pins
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    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49827Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/03Contact members characterised by the material, e.g. plating, or coating materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/007Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for elastomeric connecting elements
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
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    • H01ELECTRIC ELEMENTS
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    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09945Universal aspects, e.g. universal inner layers or via grid, or anisotropic interposer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
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    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/10Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/105Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
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    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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  • Superconductors And Manufacturing Methods Therefor (AREA)
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Abstract

본 발명에 따르면, 고밀도 z-방향 상호접속 매체는 z-방향 채널을 갖는 비도전막을 제공하고, z-방향 채널을 도전 재료의 액상 전구체로 채우고, 트랩된 전구체를 z-방향 채널내에서 도전 재료로 변환시키고, z-방향 채널내 도전 재료와 접촉하는 솔더 범프를 형성하는 단계에 의해 제조된다. 특히, 본 발명의 방법은 열 및 기계적 스트레스에 대해 향상된 저항력을 갖는 홀로 튜블러 또는 다공질 도전 통로를 형성하는데 유용하다. 채널은 진공 흡입에 의해 용이하게 채워질 수 있다.

Description

이방성 도전 매체 및 그 제조 방법, 전기 회로 디바이스
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음
제1도는 고밀도, 이방성 도전 복합 매체를 제조하는 단계를 도시하는 블럭도
제2도는 수직 채널을 도전 재료의 액상 전구체로 채우는 예시적인 단계를 개략적으로 예시하는 도면
제3도는 제1도의 공정에 의해 제조된 이방성 도전 복합 매체의 한 실시예를 개략적으로 도시하는 단면도.

Claims (15)

  1. 이방성 도전 매체(an an isotropically conductive medium)를 제조하는 방법에 있어서, 한쌍의 주표면(a pair of major surfaces)과 상기 표면 사이에 연장된 100 내지 100,000Å 직경의 다수의 채널을 갖는 비도전 매트릭스 재료의 몸체(a body of non-conducting matrix material)를 제공하는 단계와; 상기 채널을 도전 재료의 액상 전구체(a liquid precursor of conductive material)로 채우는 단계와; 상기 액체 전구체를 상기 채널을 통해 도전 경로를 형성하는 도전 재료로 변환하는 단계를 포함하는 이방성 도전 매체 제조 방법.
  2. 제1항에 있어서, 상기 채널은 진공 흡입(vacuum suction)에 의해 채워지는 이방성 도전 매체 제조 방법.
  3. 제1항에 있어서, 상기 액상 전구체는 상기 액상을 건조시키고, 상기 건조된 재료를 분해하기 위해 가열함으로써 도전 재료로 변환되는 이방성 도전 매체 제조 방법.
  4. 제1항에 있어서, 상기 도전 경로와 접촉하는 상기 채널의 단부상에 솔더 범프를 형성하는 단계를 더 포함하는 이방성 도전 매체 제조 방법.
  5. 제1항 또는 제4항에 있어서, 상기 액상 전구체가 홀로, 튜블러 도전 경로(hollow, tubular conductive paths)를 형성하는 도전 재료로 변환되는 이방성 도전 매체 제조 방법.
  6. 제1항 또는 제4항에 있어서, 상기 액상 전구체가 다공질 도전 재료로 변환되는 이방성 도전 매체 제조 방법.
  7. 제1항 또는 제4항에 있어서, 상기 액상 전구체는 금속 이온을 포함하는 수용액(an aqueous solution)을 포함하는 이방성 도전 매체 제조 방법.
  8. 제1항 또는 제4항에 있어서, 상기 액상 전구체가 고온 초전도체용 전구체를 포함하는 이방성 도전 매체 제조 방법.
  9. 제1항 또는 제4항에 있어서, 상기 액상 전구체가 용융염(a molten salt)을 포함하는 이방성 도전 매체 제조 방법.
  10. 한쌍의 주표면과 상기 표면 사이에 연장된 100 내지 100,000Å 직경의 다수의 채널을 갖는 비도전 매트릭스 재료의 몸체와; 상기 주표면상에 적어도 104통로/㎠ 밀도로 튜블러 도전 통로를 형성하는 상기 채널내에 침착된 도전 재료를 포함하는 이방성 도전 매체.
  11. 제10항에 있어서, 상기 통로에 접점을 형성하는 상기 주표면상의 솔더 범프를 더 포함하는 이방성 도전 매체.
  12. 한쌍의 주표면과 상기 표면 사이에 연장된 100 내지 100,000Å 직경의 다수의 채널을 갖는 비도전 매트릭스 재료의 몸체와; 상기 주표면상에 적어도 104통로/㎠ 밀도로 도전 통로를 형성하는 상기 채널내에 침착된 도전 재료를 포함하는 이방성 도전 매체.
  13. 제12항에 있어서, 상기 통로에 접점을 형성하는 상기 주표면상의 솔더 범프를 더 포함하는 이방성 도전 매체.
  14. 상기 제10항의 이방성 도전 매체에 의해 상호접속된 한쌍의 디바이스를 포함하는 전기 회로 디바이스.
  15. 상기 제12항의 이방성 도전 매체에 의해 상호접속된 한쌍의 디바이스를 포함하는 전기 회로 디바이스.
    ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.
KR1019960003003A 1995-02-10 1996-02-08 이방성도전매체및그제조방법,전기회로디바이스 KR100347455B1 (ko)

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Application Number Priority Date Filing Date Title
US08/387,142 US5698496A (en) 1995-02-10 1995-02-10 Method for making an anisotropically conductive composite medium
US08/387,142 1995-02-10

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KR960032804A true KR960032804A (ko) 1996-09-17
KR100347455B1 KR100347455B1 (ko) 2002-11-02

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US (1) US5698496A (ko)
EP (1) EP0726621B1 (ko)
JP (1) JP3441871B2 (ko)
KR (1) KR100347455B1 (ko)
DE (1) DE69608148T2 (ko)
TW (1) TW345765B (ko)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5910354A (en) * 1997-03-04 1999-06-08 W.L. Gore & Associates, Inc. Metallurgical interconnect composite
US5902438A (en) * 1997-08-13 1999-05-11 Fry's Metals, Inc. Process for the formation of anisotropic conducting material
DE19856083A1 (de) * 1998-12-04 2000-06-21 Siemens Ag Verbindungsanordnung
DE10006964C2 (de) 2000-02-16 2002-01-31 Infineon Technologies Ag Elektronisches Bauelement mit einer leitenden Verbindung zwischen zwei leitenden Schichten und Verfahren zum Herstellen eines elektronischen Bauelements
US20030048619A1 (en) * 2001-06-15 2003-03-13 Kaler Eric W. Dielectrophoretic assembling of electrically functional microwires
WO2003062133A2 (en) * 2002-01-18 2003-07-31 Avery Dennison Corporation Covered microchamber structures
DE10392199T5 (de) * 2002-01-18 2005-01-05 Avery Dennison Corp., Pasadena Folie mit Mikroarchitektur
US20030155656A1 (en) * 2002-01-18 2003-08-21 Chiu Cindy Chia-Wen Anisotropically conductive film
EP1612891B1 (en) * 2003-03-31 2011-11-30 Sumitomo Electric Industries, Ltd. Anisotropic electrically conductive film and method of producing the same
DE10359424B4 (de) 2003-12-17 2007-08-02 Infineon Technologies Ag Umverdrahtungsplatte für Halbleiterbauteile mit engem Anschlussraster und Verfahren zur Herstellung derselben
EP1745247B1 (en) 2004-04-23 2015-11-11 Philip Morris Products S.a.s. Aerosol generators and methods for producing aerosols
DE102005033254B4 (de) * 2005-07-15 2008-03-27 Qimonda Ag Verfahren zur Herstellung eines Chip-Trägersubstrats aus Silizium mit durchgehenden Kontakten
US8071179B2 (en) * 2007-06-29 2011-12-06 Stion Corporation Methods for infusing one or more materials into nano-voids if nanoporous or nanostructured materials
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US8809096B1 (en) 2009-10-22 2014-08-19 Stion Corporation Bell jar extraction tool method and apparatus for thin film photovoltaic materials
US8859880B2 (en) 2010-01-22 2014-10-14 Stion Corporation Method and structure for tiling industrial thin-film solar devices
US9096930B2 (en) 2010-03-29 2015-08-04 Stion Corporation Apparatus for manufacturing thin film photovoltaic devices
US8461061B2 (en) 2010-07-23 2013-06-11 Stion Corporation Quartz boat method and apparatus for thin film thermal treatment
US8628997B2 (en) 2010-10-01 2014-01-14 Stion Corporation Method and device for cadmium-free solar cells
CN107113984B (zh) * 2014-12-19 2019-06-04 富士胶片株式会社 多层配线基板
EP3290399B1 (en) 2016-08-29 2022-03-02 Infineon Technologies AG Method for producing a metal-ceramic substrate with a least one via
KR20180049427A (ko) * 2016-11-01 2018-05-11 솔브레인멤시스(주) 다공성 도전부를 구비하는 이방 도전성 시트 및 그 제조 방법
KR20180049839A (ko) * 2016-11-03 2018-05-14 솔브레인멤시스(주) 이방 도전성 시트
JP7080879B2 (ja) * 2017-05-18 2022-06-06 信越ポリマー株式会社 電気コネクターおよびその製造方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4008300A (en) * 1974-10-15 1977-02-15 A & P Products Incorporated Multi-conductor element and method of making same
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
US5045249A (en) * 1986-12-04 1991-09-03 At&T Bell Laboratories Electrical interconnection by a composite medium
EP0560072A3 (en) * 1992-03-13 1993-10-06 Nitto Denko Corporation Anisotropic electrically conductive adhesive film and connection structure using the same

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EP0726621A3 (en) 1998-05-06
US5698496A (en) 1997-12-16
TW345765B (en) 1998-11-21
DE69608148T2 (de) 2000-09-28
EP0726621B1 (en) 2000-05-10
EP0726621A2 (en) 1996-08-14
JP3441871B2 (ja) 2003-09-02
JPH08255520A (ja) 1996-10-01
KR100347455B1 (ko) 2002-11-02
DE69608148D1 (de) 2000-06-15

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